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Browse Journals & Magazines > Components, Packaging, and Man ... Volume 17 Issue 4

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

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Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Issue 4 • Date Dec 1994

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Title History

Techniques for measuring energy consumption of reprographic devices

Effect of inorganic binders on the properties of thick film copper conductor

Waste minimization in electronic component processing-a systems approach

A practical excimer laser-based cleaning tool for removal of surface contaminants

Hazardous waste minimization in III-V wafer fabrication processes

Epoxy encapsulation on ceramic quad flat packs (CQFPs)

Preencapsulation cleaning methods and control for microelectronics packaging

Green design: an introduction to issues and challenges

Thermal conductivity of molding compounds for plastic packaging

Indirect bonding of Ni-electroless plated AlN and Cu by hot pressing method

Electrical sliding friction and wear behavior of Cu-Nb in situ composites

Thermal performance limits of the QFP family

Development of an alternative wire bond test technique

A cost-benefit analysis model of product design for recyclability and its application

Fracture properties of molding compound materials for IC plastic packaging

An overview of high-temperature electronic device technologies and potential applications

High-density laser linking of metal interconnect

UV curable urethane encapsulant for ceramic chip carriers

Application of a CFD tool for system-level thermal simulation

A simple test chip to assess chip and package design in the case of plastic assembling

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