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IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B

Issue 2 • May 1994

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Displaying Results 1 - 15 of 15
  • Effects of losses on signals in PWB's

    Publication Year: 1994, Page(s):217 - 222
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (428 KB)

    This paper shows data that demonstrates the effects of dielectric and conductor losses on signals propagating in a printed wiring board (PWB). These losses vary with frequency (increasing as frequency increases), and depend on the geometry and size of the conductors involved, and on the materials used. Some determination of the significance of these effects on system performance is made. Limits on... View full abstract»

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  • Holographic optical interconnects for VLSI multichip modules

    Publication Year: 1994, Page(s):223 - 227
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (480 KB)

    The design of a prototype multichip module utilizing free-space holographic optical interconnects is discussed. This prototype incorporates GaAs laser array chips and silicon CMOS chips which are flip-chip bonded to the transparent MCM substrate. Computer generated holograms are etched onto the opposite side of the MCM substrate to form optical links between lasers and photodetectors that are inte... View full abstract»

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  • Design of low dielectric glass+ceramics for multilayer ceramic substrate

    Publication Year: 1994, Page(s):228 - 233
    Cited by:  Papers (23)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (552 KB)

    Compositional design and properties of a low dielectric constant glass+ceramics, containing borosilicate glass, high silica glass and alumina, for multilayer ceramic substrates are described. The new low dielectric system can be densified at below 1000°C in air, allowing high electrical conductivity metallization including Au and Ag-Pd. Compositions with tailor-made properties are designed acc... View full abstract»

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  • Planarized thin film inductors and capacitors for hybrid integrated circuits made of aluminum and anodic alumina

    Publication Year: 1994, Page(s):197 - 200
    Cited by:  Papers (11)  |  Patents (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (244 KB)

    Planarized inductors and capacitors made of aluminum layers by electrochemical anodization technique have been tested in the frequency region of 1 kHz-300 MHz at temperatures of 293-473 K. These microcomponents can be used for high-frequency hybrid integrated circuits View full abstract»

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  • A method to predict cracking in IC plastic packages

    Publication Year: 1994, Page(s):209 - 216
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (588 KB)

    We present a method to predict cracking in a model geometry, representing an IC plastic package, under monotonic thermal loading, when no delaminations are present. The results of the analysis are expressed in a dimensionless form so they are generally applicable. A critical relation between the residual stress in the polymer and its tensile strength predicts fracture. Experimental results with a ... View full abstract»

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  • Next generation burn-in development

    Publication Year: 1994, Page(s):190 - 196
    Cited by:  Papers (10)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (592 KB)

    Die level burn-in (DLBI) and wafer level burn-in (WLBI) are two technologies that are being investigated to address the growing industry demand for product shipped as “known good die” (KGD). Commercial DLBI technology is now in the prototype evaluation and development stages. WLBI technology is now being seriously discussed in the industry and will require significant development effor... View full abstract»

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  • Predicting delamination in plastic IC packages and determining suitable mold compound properties

    Publication Year: 1994, Page(s):201 - 208
    Cited by:  Papers (63)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (620 KB)

    This paper proposes that the critical stress intensity factor obtained in an adhesion test between the leadframe and the mold compound,can be used as a criterion for predicting delamination. A finite element stress analysis of the adhesion test determines the critical stress intensity factor KIIC corresponding to the measured maximum strength. Delamination between the leadframe chip pad... View full abstract»

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  • Dynamic probe scheduling optimization for MCM substrate test

    Publication Year: 1994, Page(s):182 - 189
    Cited by:  Papers (5)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (820 KB)

    We propose an improved integrated test generation/optimization algorithm for Multichip Module (MCM) substrate verification using two-probe testers. The goal of this work is to reduce the substrate testing time while providing complete coverage for open, short, and high net resistance faults. We approach this objective via two directions, namely test set size reduction and efficient probe schedulin... View full abstract»

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  • Package inductance characterization at high frequencies

    Publication Year: 1994, Page(s):175 - 181
    Cited by:  Papers (32)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (708 KB)

    This paper describes a package inductance measurement technique based on network analysis and lumped element package model. Advantages of this technique include: 1. Measuring inductance over the same high operating frequencies of today's high-speed CMOS and ECL chips. 2. Providing information on a package's resonance frequencies and determining the limit of the lumped element model and 3. Utilizin... View full abstract»

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  • Advanced design and modeling for manufacturability of a hybrid MCM package

    Publication Year: 1994, Page(s):170 - 174
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (496 KB)

    The objective of this paper is to focus on manufacturability aspects of the MCM package through advanced design and modeling techniques. Two types of modeling are discussed: electrical and process. Use of electrical modeling to enhance manufacturability is demonstrated. Process modeling is driven by the requirements to maximize yield. A Poisson model which relates the product complexity and proces... View full abstract»

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  • Technology application tradeoff studies in multichip systems

    Publication Year: 1994, Page(s):161 - 169
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (848 KB)

    This paper presents the results of technology tradeoff studies for multichip systems. Performance analyses which are considered in this study focus on module costs, sizes, and routability, however thermal and electrical performance are also briefly considered. These metrics are influenced by different technology and design approaches including surface and through-hole mounting, wirebond, TAB, and ... View full abstract»

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  • Broadband modeling and transient analysis of MCM interconnections

    Publication Year: 1994, Page(s):153 - 160
    Cited by:  Papers (8)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (696 KB)

    In this paper, conductive losses of multi-chip module interconnections are analysed. A distributed network model for the conductor surface impedance is extended to include the transition from DC resistivity to high frequency losses and to cover the effect of barrier and adhesion layers. Using this model, a broadband loss expression is derived. This loss expression can be implemented in network sim... View full abstract»

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  • Delay macromodels for point-to-point MCM interconnections

    Publication Year: 1994, Page(s):147 - 152
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (520 KB)

    We develop delay macromodels for lossless as well as lossy point-to-point MCM transmission lines using a systematic model construction procedure that includes dimensional analysis. The result for lossless lines confirms earlier work and extends it to the case of nonlinear drivers and capacitive termination. For lossy lines, we show that dimensional analysis allows us to reduce the complexity of th... View full abstract»

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  • SPICE simulation of lossy and coupled interconnection lines

    Publication Year: 1994, Page(s):134 - 146
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (992 KB)

    A new simulation method for analyzing propagation characteristics of high frequency waves on single or coupled lossy interconnections is presented, based on the universal CAD SPICE software. The concept used is the direct analysis of lossy propagating lines as an equivalent circuit which can be easily modeled and simulated by SPICE software. The results obtained in both frequency and time domains ... View full abstract»

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  • Adaptation of “SPICE3” to simulation of lossy multiple-coupled transmission lines

    Publication Year: 1994, Page(s):126 - 133
    Cited by:  Papers (8)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (536 KB)

    Design of high-speed, high-performance electronic circuits requires simulation of transients in networks that include multiple, coupled lossy transmission lines. A widely used circuit simulator, SPICE, does not have facilities for simulation of multiconductor transmission lines. Recently a modification to SPICE3 to include multi-conductor lossless lines was reported. In many situations line losses... View full abstract»

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Aims & Scope

This Transaction ceased production in 1998. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope