IEEE Electromagnetic Compatibility Magazine

Issue 3 • Third Quarter 2016

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Displaying Results 1 - 25 of 33
  • Front cover

    Publication Year: 2016, Page(s): c1
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  • Contents

    Publication Year: 2016, Page(s): 3
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  • Letter from the editor

    Publication Year: 2016, Page(s):4 - 44
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  • President's message

    Publication Year: 2016, Page(s):6 - 8
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  • Chapter chatter

    Publication Year: 2016, Page(s):10 - 19
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  • Annual chapter training meeting and symposium awards

    Publication Year: 2016, Page(s):19 - 22
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  • EMC society awards

    Publication Year: 2016, Page(s):24 - 29
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  • EMC personality profile

    Publication Year: 2016, Page(s):30 - 31
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  • IEEE.tv serving up EMC delicacies online

    Publication Year: 2016, Page(s): 31
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  • EMC society history

    Publication Year: 2016, Page(s): 32
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  • 50 - 25 - 10 years ago: a review of EMC society newsletters

    Publication Year: 2016, Page(s):32 - 34
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  • EMC Legacy I and Legacy II projects

    Publication Year: 2016, Page(s):34 - 35
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  • National electronics museum and the EMC society

    Publication Year: 2016, Page(s):35 - 36
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  • The MTT-S and the National Electronics Museum [Speaker's Corner]

    Publication Year: 2016, Page(s):37 - 38
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  • IEEE milestone for Germany: the EMC society is "instrumental" in making it happen!

    Publication Year: 2016, Page(s): 39
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  • Silicon Photonics - Fundamentals and Devices (Deen, M.J. and Basu, P.K.; 2012) [Book review]

    Publication Year: 2016, Page(s):42 - 43
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  • Practical papers, articles and application notes

    Publication Year: 2016, Page(s): 45
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1585 KB) | HTML iconHTML

    Presents information of the articles that are presented in this issue of the publication. View full abstract»

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  • Alternative conducted immunity tests

    Publication Year: 2016, Page(s):45 - 51
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (4291 KB) | HTML iconHTML

    Conducted immunity tests are always performed by the use of CDNs in laboratories in accordance with the standard EN61000-4-6. However, it is not always possible to use CDNs because of some limitations. If the EUT (Equipment Under Test) has large dimensions or high currents, it is not, most of the time, possible to send it to an EMC laboratory or to use CDNs during the test. As a consequence, usage... View full abstract»

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  • Call for authors: IEEE short books initiative

    Publication Year: 2016, Page(s): 51
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    Presents information for authors interesting in learning about the IEEE Short Books initiative. View full abstract»

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  • Power integrity modeling and measurement of TSV-based 3D IC system with application to the analysis of seven-chip stack

    Publication Year: 2016, Page(s):52 - 60
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (6720 KB) | HTML iconHTML

    This paper presents power integrity modeling and measurement of through-silicon via (TSV)-based 3D IC system. To leverage the accuracy of a full-wave approach and shorter computational time of a circuit approach, a hybrid full-wave and circuit approach is proposed to model each individual chip consisting of TSVs, on-chip power grids and decoupling capacitors. A cascaded scattering matrix approach ... View full abstract»

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  • W-element RLGC matrices calculation for power distribution planes modeling using MCTL matrix method

    Publication Year: 2016, Page(s):61 - 69
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (6304 KB) | HTML iconHTML

    The ever-increasing demands of advanced computing and communication have been driving the semiconductor technology to change with each passing day following Moore's law. As a consequence, advanced electronic packages have been developed and predictive modeling of Power Distribution Network (PDN) becomes more and more important. In this paper, we present an efficient methodology for predictive mode... View full abstract»

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  • IEEE-JMMCT special section proposal "metamaterial-by-design: theory and applications to multiscale/multiphysics problems"

    Publication Year: 2016, Page(s): 70
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  • Technical theme topics

    Publication Year: 2016, Page(s): 71
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1557 KB) | HTML iconHTML

    Discusses the articles persented in this journal that focus on the topic of macromodeling of complex systems. View full abstract»

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  • Black-box macromodeling and its EMC applications

    Publication Year: 2016, Page(s):71 - 78
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3152 KB) | HTML iconHTML

    The main idea of black-box macromodeling is to approxA005imate the dynamic behavior of complex systems in terms of lowcomplexity models or equivalent circuits. Such compact models can be derived through robust numerical algorithms, such as the Vector Fitting scheme, starting from frequency- or time-domain responses of the system, and without any specific knowledge of its internal structure. The ex... View full abstract»

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  • Present and future of I/O-buffer behavioral macromodels

    Publication Year: 2016, Page(s):79 - 85
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3351 KB) | HTML iconHTML

    Modern Signal and Power Integrity (SI/PI) verification flows rely on accurate models for complex I/O-buffers that drive and receive electrical signals on high-speed channels. The sheer density of modern integrated circuits makes detailed transistor-level descriptions computationally cumbersome to the point where they become unusable for system-level simulations. Fortunately, transistor-level descr... View full abstract»

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Aims & Scope

IEEE Electromagnetic Compatibility Magazine informs readers of activities in the IEEE EMC Society and educates members via practical technical papers and design tips.

 

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
Janet Nichols O’Neil
ETS-Lindgren