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IEEE Circuits and Devices Magazine

Issue 5 • Date Sept. 1994

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  • A cool package for the 90s

    Publication Year: 1994, Page(s):20 - 25
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (520 KB)

    Ceramic packaging offers a variety of properties that may be essential for the reliable operation of critical devices. Aluminum nitride, a relatively new and intriguing ceramic, may ultimately provide the best solution for a wide variety of electronic packaging tasks. Indeed, AlN-based packages have reached the marketplace. One obstacle remains, however: its relatively high cost.<> View full abstract»

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  • Copper lasers go for industrial gold

    Publication Year: 1994, Page(s):39 - 42
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (543 KB)

    The copper-vapor laser (CVL), a relative newcomer to the materials processing area, is already showing its superiority in a variety of applications traditionally addressed by other lasers or alternative techniques. Driving its development is a Pan-European collaboration under the Eureka-Eurolaser umbrella, which has brought together more than 20 leading organizations in the field of CVL design, sy... View full abstract»

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  • NODIFS-simulating faults fast

    Publication Year: 1994, Page(s):26 - 38
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1124 KB)

    This article introduces, perhaps for the first time, an asynchronous, distributed, circuit partitioned algorithm that is capable of fault simulating both combinational and sequential digital designs on parallel processors. In this approach, called NODIFS (NOvel asynchronous DIstributed algorithm for Fault Simulation), every circuit component is modeled as an asynchronous and concurrent entity that... View full abstract»

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Aims & Scope

IEEE Circuits and Devices Magazine (1985-2006) covers the design, implementation, packaging, and manufacture of micro-electronic and photonic devices, circuits and systems

 

This Magazine ceased publication in 2006.

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Meet Our Editors

Editor-in-Chief
Dr. Ronald W. Waynant
r.waynant@ieee.org