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Circuits and Devices Magazine, IEEE

Issue 5 • Date Sept. 1994

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Displaying Results 1 - 3 of 3
  • A cool package for the 90s

    Page(s): 20 - 25
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (520 KB)  

    Ceramic packaging offers a variety of properties that may be essential for the reliable operation of critical devices. Aluminum nitride, a relatively new and intriguing ceramic, may ultimately provide the best solution for a wide variety of electronic packaging tasks. Indeed, AlN-based packages have reached the marketplace. One obstacle remains, however: its relatively high cost.<> View full abstract»

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  • Copper lasers go for industrial gold

    Page(s): 39 - 42
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (543 KB)  

    The copper-vapor laser (CVL), a relative newcomer to the materials processing area, is already showing its superiority in a variety of applications traditionally addressed by other lasers or alternative techniques. Driving its development is a Pan-European collaboration under the Eureka-Eurolaser umbrella, which has brought together more than 20 leading organizations in the field of CVL design, systems design, and materials processing applications. This consortium is now well-placed to take the CVL successfully to the marketplace. Laboratory lasers can now deliver more than 750 W, the highest of any visible lasers now available. Commercial devices are available from 15 to 120 W. As a consequence of this development, and its unique blend of operating wavelength, high power capability, and high pulse repetition rate, the copper laser presently enjoys an advantage in a wide variety of areas in manufacturing and production, especially its ability to drill and cut many materials that are difficult to process by other methods.<> View full abstract»

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  • NODIFS-simulating faults fast

    Page(s): 26 - 38
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (1124 KB)  

    This article introduces, perhaps for the first time, an asynchronous, distributed, circuit partitioned algorithm that is capable of fault simulating both combinational and sequential digital designs on parallel processors. In this approach, called NODIFS (NOvel asynchronous DIstributed algorithm for Fault Simulation), every circuit component is modeled as an asynchronous and concurrent entity that is checked for faults as soon as appropriate signal transitions and fault lists are asserted at its input ports. The circuit is partitioned such that components of every partition are allocated to a unique processor of the parallel processor system View full abstract»

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Aims & Scope

IEEE Circuits and Devices Magazine (1985-2006) covers the design, implementation, packaging, and manufacture of micro-electronic and photonic devices, circuits and systems

 

This Magazine ceased publication in 2006.

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Meet Our Editors

Editor-in-Chief
Dr. Ronald W. Waynant
r.waynant@ieee.org