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# IEEE Transactions on Components, Packaging and Manufacturing Technology

## Filter Results

Displaying Results 1 - 21 of 21
• ### Front Cover

Publication Year: 2016, Page(s): C1
| PDF (1781 KB)
• ### IEEE Transactions on Components, Packaging and Manufacturing Technology publication information

Publication Year: 2016, Page(s): C2
| PDF (143 KB)

Publication Year: 2016, Page(s):833 - 834
| PDF (133 KB)
• ### Numerical and Experimental Evaluation of the Microsecond Pulsed Heating Curve Technique Dedicated to Die Interconnection Characterization

Publication Year: 2016, Page(s):835 - 845
| | PDF (6321 KB) | HTML

This paper describes and qualifies a partial thermal impedance measurement technique to evaluate the thermal behavior of the physical layers close to the die in power electronic assemblies. The measurement approach is derived from the pulsed heating curve method; nonetheless, the experimental setup proposed here is fitted for a higher sensitivity analysis of die interconnections due to the extract... View full abstract»

• ### The Preceding Voltage Pulse and Separation Welding Mechanism of Electrical Contacts

Publication Year: 2016, Page(s):846 - 853
| | PDF (2419 KB) | HTML

In order to obtain a better understanding of the welding mechanism in contact separation, electrical endurance tests were conducted with AgSnO2 and AgNi contacts on a simulation test device. Waveforms of contact displacement, contact voltage, and current were recorded with LabVIEW during the tests, and changes in a contact gap and heights of pips with increases in operation cycles were observed th... View full abstract»

• ### Compact Single-/Dual-Band Planar Crossovers Based on Strong Coupled Lines

Publication Year: 2016, Page(s):854 - 863
| | PDF (2888 KB) | HTML

Three compact planar crossovers based on strong coupled lines loaded with open stubs are proposed in this paper. Two conventional coupled lines loaded with different electrical wavelength open stubs are used to realize the single/dual passband. The center frequencies of the three planar crossovers can be adjusted over a wide frequency band by changing the even-/odd-mode characteristic impedance of... View full abstract»

• ### High-Level Virtual Prototyping of Signal Integrity in Bus Communication

Publication Year: 2016, Page(s):864 - 872
| | PDF (5463 KB) | HTML

In this paper, a novel methodology for high-level modeling of bus communication in embedded systems is introduced. It allows the dynamic evaluation of their signal integrity (SI) characteristics at the virtual prototyping step (i.e., before physical realization). The method is based on the association of functional and nonfunctional modules. Functional modules represent the ideal behavior of the s... View full abstract»

• ### Eye Height/Width Prediction From $S$ -Parameters Using Learning-Based Models

Publication Year: 2016, Page(s):873 - 885
| | PDF (4445 KB) | HTML

Design space exploration and sensitivity analysis for electrical performance of high-speed serial links is a critical and challenging task for a robust, cost-efficient, and signal-integrity-compliant channel design. The generation of time-domain (TD) metrics like eye height and eye width at higher bit error rates requires longer bit sequences in TD circuit simulation, which is compute time intensi... View full abstract»

• ### Reduction of Noise Using Continuously Changing Variable Clock and Clock Gating for IC Chips

Publication Year: 2016, Page(s):886 - 896
| | PDF (3133 KB) | HTML

The performance of silicon chip depends on the operating voltage of the chip. The chip should be designed using proper power and ground bond pads to minimize the power supply noise. When the chip starts working from the sleep mode, then the sudden rise in current inside the chip causes LdI/dt noise. This noise reduces the power supply voltage, which in turn reduces the operating frequency of the c... View full abstract»

• ### A Wideband Bandpass Filter With Frequency Selectivity Controlled by SAW Resonators

Publication Year: 2016, Page(s):897 - 905
| | PDF (2849 KB) | HTML

A wideband bandpass filter (BPF) with two cascaded sections, each consisting of a surface acoustic wave (SAW) resonator and one or two transmission lines in parallel, is proposed. The lower and upper rolloffs of the passband are separately controlled by the narrowband characteristics of the SAW resonators to realize high frequency selectivity. The filter principle is analyzed for the two sections ... View full abstract»

• ### Gap Waveguide PMC Packaging for Two-Layer PEC Surfaces

Publication Year: 2016, Page(s):906 - 916
Cited by:  Papers (1)
| | PDF (2110 KB) | HTML

This paper shows the investigation of gap waveguide (GW) packaging for an irregular perfect electric conductor (PEC) composed of two layers of metal surfaces. The stopband for a GW with two-layer PEC surfaces is carefully studied, considering the top-layer PEC width, pin size, pin height, columns of pins, as well as dielectric substrate thickness and permittivity. A strategy of the GW packaging fo... View full abstract»

• ### A Novel Coupled-Line Tunable Wilkinson Power Divider With Perfect Port Match and Isolation in Wide Frequency Tuning Range

Publication Year: 2016, Page(s):917 - 925
Cited by:  Papers (1)
| | PDF (2395 KB) | HTML

In this paper, a novel coupled-line tunable Wilkinson power divider with perfect port match and isolation in a continuously tunable passband is presented. The proposed tunable power divider consists of an isolation resistor, two coupled lines, and two types of varactors. By providing these varactors with suitable bias voltages, the operating frequency of the proposed power divider can be flexibly ... View full abstract»

• ### Plasma-Generated Etchback to Improve the Via-Reliability in High-Tg Substrates Used in Multilayer PWBs for Space Electronic Packaging

Publication Year: 2016, Page(s):926 - 932
| | PDF (2982 KB) | HTML

High-Tg (glass transition temperature, 210°C) woven fiber-glass reinforced multifunctional-epoxy FR-4 laminates are now becoming main trend in the fabrication of multilayer printed wiring boards (PWBs) for space application due to their inherent properties of better dimensional stability, low coefficient of thermal expansion, and the capability to withstand multiple soldering operations. In... View full abstract»

• ### Significant Factors in the Inkjet Manufacture of Frequency-Selective Surfaces

Publication Year: 2016, Page(s):933 - 940
| | PDF (2750 KB) | HTML

Additive fabrication of electromagnetic structures by inkjet printing technology is both cost effective and compatible with a wide range of environmentally friendly substrates, enabling the fabrication of frequency-selective surface (FSS) arrays with line dimensions less than 0.1 mm, which is difficult to achieve with conventional subtractive techniques. Several approaches, such as savings in ink ... View full abstract»

• ### Hybrid Dielectric Thin Films on Flexible Substrates for Embedded Capacitor Applications

Publication Year: 2016, Page(s):941 - 945
Cited by:  Papers (1)
| | PDF (1661 KB) | HTML

This paper describes a novel fabrication process and technology for making hybrid thin film capacitors on flexible metallic substrates using vapor deposition process (polymer multilayer) and RF sputtering. In this case, polymeric acrylate thin films are deposited on flexible base metal foils (Cu) using a vapor deposition process followed by inorganic yttria stabilized zirconia thin films by RF spu... View full abstract»

• ### Fine Pitch Rapid Heat Self-Aligned Assembly and Liquid-Mediated Direct Bonding of Si Chips

Publication Year: 2016, Page(s):946 - 953
Cited by:  Papers (2)
| | PDF (2285 KB) | HTML

3-D stacking with vertical interconnection of thinned microelectronic silicon chips is a novel approach to achieve the enhanced performance, higher density, and smaller size of integrated circuits with a better multifunctionality than the traditional 2-D chip packaging. To achieve this, high alignment accuracy is required between the top chip and the bottom substrate along with good bonding betwee... View full abstract»

• ### A Measurement Method on Nanoscale Thickness of the Ti Barrier Layer of TSV Structure for 3-D IC

Publication Year: 2016, Page(s):954 - 958
Cited by:  Papers (1)
| | PDF (1046 KB) | HTML

As the characteristic dimension of an integrated circuit (IC) continuously scales down, together with the requirements of low power consumption, multiple functionality, and cost effectiveness, the conventional IC transforms into a 3-D IC. Through-silicon via (TSV) is a promising and preferred way to realize the reliable interconnection for a 3-D IC. Thus, accurate measurement of the critical struc... View full abstract»

• ### Design, Modeling, Fabrication and Characterization of 2–5- $mu text{m}$ Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass Interposers

Publication Year: 2016, Page(s):959 - 967
Cited by:  Papers (1)
| | PDF (4208 KB) | HTML

This paper presents the latest advances in extending semiadditive process (SAP) methods to 2-5 μm lines and spaces, achieved using dry film photoresists on thin glass substrates, toward meeting the routing requirements for 20-μm bump pitch interposers. High-density chip-to-chip interconnections on 2.5-D interposers are a key enabler to meet the high logic to memory bandwidth needs of... View full abstract»

• ### Introducing IEEE Collabratec

Publication Year: 2016, Page(s): 968
| PDF (2157 KB)
• ### IEEE Components, Packaging, and Manufacturing Technology Society information for authors

Publication Year: 2016, Page(s): C3
| PDF (156 KB)
• ### IEEE Components, Packaging, and Manufacturing Technology Society Information

Publication Year: 2016, Page(s): C4
| PDF (216 KB)

## Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.

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## Meet Our Editors

Managing Editor
R. Wayne Johnson
Auburn University