IEEE Electromagnetic Compatibility Magazine

Issue 1 • 1st Quarter 2016

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Displaying Results 1 - 25 of 33
  • Front cover

    Publication Year: 2016, Page(s): c1
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  • Contents

    Publication Year: 2016, Page(s): 3
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  • Letter from the editor

    Publication Year: 2016, Page(s):4 - 89
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  • President's message

    Publication Year: 2016, Page(s):6 - 8
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  • Chapter chatter

    Publication Year: 2016, Page(s):10 - 24
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  • Emission measurements (2014 edition of ANSI C63.4 and CISPR 32-2015), and time domain (TD) applications (Draft C63.25)

    Publication Year: 2016, Page(s): 25
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  • New members of the EMC society board of directors

    Publication Year: 2016, Page(s): 1
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  • IEEE transactions on electromagnetic compatibility: Call for papers: Special issue “EMC in the near-field: Theory, measurements, and applications”

    Publication Year: 2016, Page(s): 27
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  • Education committee

    Publication Year: 2016, Page(s):28 - 29
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  • Announcing a new journal jointly created by the IEEE AP, MTT, and EMC societies: IEEE Journal on Multiscale and Multiphysics Computational Techniques (JMMCT)

    Publication Year: 2016, Page(s): 29
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  • EMC personality profile

    Publication Year: 2016, Page(s):30 - 31
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  • Visit iNARTE in Ottawa!

    Publication Year: 2016, Page(s): 31
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  • EMC society history

    Publication Year: 2016, Page(s): 32
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  • Quasies and peaks

    Publication Year: 2016, Page(s):32 - 33
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  • 50–25–10 Years ago: A review of EMC society newsletters

    Publication Year: 2016, Page(s):33 - 35
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  • Titanic, Marconi's “Wireless telegraphers” and the U. S. radio act of 1912

    Publication Year: 2016, Page(s):35 - 37
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  • IEEE Women in Engineering (WIE)

    Publication Year: 2016, Page(s): 40
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  • Book review

    Publication Year: 2016, Page(s): 41
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  • Practical papers, articles and application notes

    Publication Year: 2016, Page(s): 43
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  • Implementation of a measurement system on field uniformity of transient electromagnetic field

    Publication Year: 2016, Page(s):43 - 49
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (5116 KB) | HTML iconHTML

    Electromagnetic pulse and transient electromagnetic field have received a large concern. To guarantee the validity of the test results in transient field facilities, field uniformity is addressed and required in many international standards. This paper focuses on the implementation of such a measuring system according to the field uniformity requirements of MIL-STD-461F. Also the specific requirem... View full abstract»

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  • Designing building structures for protection against EMP and lightning

    Publication Year: 2016, Page(s):50 - 58
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (7164 KB) | HTML iconHTML

    This article will explore the use of electromagnetic simulation when hardening facilities against EMP and lightning. EMP is a high-intensity burst of electromagnetic energy that can potentially cause major disruption to vital infrastructure such as telecommunications, electrical power, banking and finance, emergency services, medical facilities, transportation, food and water supply. Lightning can... View full abstract»

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  • Limits of lightning protection systems

    Publication Year: 2016, Page(s):59 - 64
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1002 KB) | HTML iconHTML

    Positive first strokes, less frequent but more powerful than negative return strokes, require a larger conductor. If the skin effect is accounted for, a near maximum value of the action integral of positive lightning can be estimated from the sizes of conductors specified by established building codes. The conductor size for watercraft could be increased: (1) to match that used for structures on l... View full abstract»

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  • Technical theme topics

    Publication Year: 2016, Page(s): 65
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  • Recent advances in electromagnetic compatibility of 3D-ICs — Part II

    Publication Year: 2016, Page(s):65 - 74
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (8803 KB) | HTML iconHTML

    This second part addresses a selection of topics related to Electromagnetic interference (EMI) issues in three-dimensional integrated components. Details about Through Silicon Via TSV) technology, modelling and parasitic effects are introduced in the first part, then key concepts such as signal integrity (SI), power integrity (PI), and Electromagnetic Interference are introduced. View full abstract»

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  • IEEE young professionals EMC

    Publication Year: 2016, Page(s):76 - 77
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Aims & Scope

IEEE Electromagnetic Compatibility Magazine informs readers of activities in the IEEE EMC Society and educates members via practical technical papers and design tips.

 

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Meet Our Editors

Editor-in-Chief
Janet Nichols O’Neil
ETS-Lindgren