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Microelectromechanical Systems, Journal of

Issue 1 • Date Mar 1994

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Displaying Results 1 - 5 of 5
  • Low temperature wafer direct bonding

    Publication Year: 1994 , Page(s): 29 - 35
    Cited by:  Papers (22)  |  Patents (41)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (648 KB)  

    A pronounced increase of interface energy of room temperature bonded hydrophilic Si/Si, Si/SiO2, and SiO2/SiO 2 wafers after storage in air at room temperature, 150°C for 10-400 h has been observed. The increased number of OH groups due to a reaction between water and the strained oxide and/or silicon at the interface at temperatures below 110°C and the for... View full abstract»

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  • Insect-model based microrobot with elastic hinges

    Publication Year: 1994 , Page(s): 4 - 9
    Cited by:  Papers (28)  |  Patents (10)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (568 KB)  

    This paper describes the new concept of making a microrobot based upon insects and its implementation using rigid plates and elastic hinges. One unique feature of an insect's structure is its deformable external skeleton, to which wings and legs are attached, forming a closed-loop mechanism. Frictionless deformation of elastic elements, instead of conventional rotational joints, allows for efficie... View full abstract»

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  • Porous polycrystalline silicon: a new material for MEMS

    Publication Year: 1994 , Page(s): 10 - 18
    Cited by:  Papers (6)  |  Patents (54)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1288 KB)  

    A new technique for the fabrication of thin patterned layers of porous polycrystalline silicon (polysilicon) and surface micromachined structures is presented. First, a multilayer structure of polysilicon between two layers of low-stress silicon nitride is prepared on a wafer of silicon. Electrochemical anodization with an external cathode takes place in an RF solution. A window in the outer nitri... View full abstract»

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  • The design, fabrication, and testing of corrugated silicon nitride diaphragms

    Publication Year: 1994 , Page(s): 36 - 42
    Cited by:  Papers (21)  |  Patents (9)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (752 KB)  

    Silicon nitride corrugated diaphragms of 2 mm×2 mm×1 μm have been fabricated with 8 circular corrugations, having depths of 4, 10, or 14 μm. The diaphragms with 4-μm-deep corrugations show a measured mechanical sensitivity (increase in the deflection over the increase in the applied pressure) which is 25 times larger than the mechanical sensitivity of flat diaphragms of equal ... View full abstract»

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  • Emergent faces in crystal etching

    Publication Year: 1994 , Page(s): 19 - 28
    Cited by:  Papers (6)  |  Patents (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (876 KB)  

    The time development of emergent faces in crystal etching is investigated. We present and discuss a novel computational approach, based on an intuitive geometrical derivation, for predicting an etched shape given an initial polygonal (mask) shape and a diagram of etch rate as a function of orientation. A two-dimensional geometric model is derived which determines the etched shape as a function of ... View full abstract»

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Aims & Scope

The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.

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Meet Our Editors

Editor-in-Chief
Christofer Hierold
ETH Zürich, Micro and Nanosystems