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IEEE Design & Test

Issue 6 • Dec. 2014

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Displaying Results 1 - 18 of 18
  • [Front cover]

    Publication Year: 2014, Page(s): C1
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  • [Front inside cover]

    Publication Year: 2014, Page(s): C2
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  • [Masthead]

    Publication Year: 2014, Page(s): 1
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  • Table of contents

    Publication Year: 2014, Page(s): 2
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  • Departments [Table of Contents]

    Publication Year: 2014, Page(s): 3
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  • Design and Testing of Millimeter-Wave/Subterahertz Circuits and Systems

    Publication Year: 2014, Page(s):4 - 5
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  • Guest Editors' Introduction: Design and Testing of Millimeter-Wave/Subterahertz Circuits and Systems

    Publication Year: 2014, Page(s):6 - 7
    Cited by:  Papers (1)
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  • Adaptive Circuit Design Methodology and Test Applied to Millimeter-Wave Circuits

    Publication Year: 2014, Page(s):8 - 18
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB) | HTML iconHTML

    This paper presents a design methodology of millimeter-wave circuits that are insensitive to process, voltage, and temperature variations. Instead of using conventional direct sensing, the authors propose an indirect sensing method with Bayesian fusion, which simplifies the sensors and allows more adaptive circuit loops to be integrated. View full abstract»

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  • Architecture and Design of Multichannel Millimeter-Wave Wireless NoC

    Publication Year: 2014, Page(s):19 - 28
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1316 KB) | HTML iconHTML

    The network-on-chip (NoC) is an enabling methodology to integrate many embedded cores on a single die. The existing method of implementing a NoC with planar metal interconnects is deficient due to high latency and significant power consumption arising out of multi-hop links used in data exchanges. To address these problems, this paper introduces design methodology for a wireless NoC with multiple ... View full abstract»

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  • Millimeter-Wave Wireless Interconnect for 3-D SIC Testing

    Publication Year: 2014, Page(s):29 - 37
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1141 KB) | HTML iconHTML

    As 3-D ICs gain popularity in the industry, finding an efficient way to test the stacked chips is becoming a new challenge. The authors of this paper present a contact-free testing method using millimeter-wave wireless I/Os with microbump antennas. This method has the potential to reduce the latency and cost of 3-D IC testing. View full abstract»

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  • Review of Millimeter-Wave MMIC Mixers

    Publication Year: 2014, Page(s):38 - 45
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (246 KB) | HTML iconHTML

    This paper conducts a detailed survey on state-of-the-art millimeter-wave mixers that possess various design features including wide bandwidth, high isolation, high linearity, image rejection, low power, and small chip area. The authors also give insight into the future trends of millimeter-wave mixer design. View full abstract»

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  • A Simple New Method to Calibrate Millimeter-Wave Mixers

    Publication Year: 2014, Page(s):46 - 51
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (460 KB) | HTML iconHTML

    This paper presents a novel method to test the conversion loss of fully reciprocal millimeter-wave mixers without measuring the absolute signal power at the radio-frequency port. The authors utilize the reciprocal feature of the mixer and obtain conversion loss based on relative power measured by a network analyzer. View full abstract»

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  • CEDA Currents

    Publication Year: 2014, Page(s):52 - 53
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  • Test Technology TC Newsletter

    Publication Year: 2014, Page(s):54 - 55
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  • UCLA engineering online masters

    Publication Year: 2014, Page(s): 55
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  • A truly wireless future?

    Publication Year: 2014, Page(s): 56
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (72 KB) | HTML iconHTML

    It is argued that wires are an endangered species. They are vanishing from our environment. The author notes that if there was one place he would have thought we would always find wires, it would be on-chip. But as we see in this special issue of Design & Test wireless Networks on Chip are possible, so we may not even find long wires there in the future. What has created this wire-free revolution?... View full abstract»

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  • [Back inside cover]

    Publication Year: 2014, Page(s): C3
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  • [Back cover]

    Publication Year: 2014, Page(s): C4
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Aims & Scope

IEEE Design & Test offers original works describing the models, methods and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews and roundtable discussions. Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy efficient design, electronic design automation tools, practical technology, and standards.  

It was published as IEEE Design & Test of Computers between 1984 and 2012.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
Joerg Henkel
Chair for Embedded Systems (CES)
Karlsruhe Institute of Technology (KIT)