2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems

27-30 Oct. 2013

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  • [Title page]

    Publication Year: 2013, Page(s): i
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  • [Copyright notice]

    Publication Year: 2013, Page(s): ii
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  • Welcome message

    Publication Year: 2013, Page(s):iii - iv
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  • NanoCarbon for next-generation green electronics: Status and prospects

    Publication Year: 2013, Page(s): v
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    NanoCarbons constitute the low-dimensional allotropes of carbon including 1-dimensional carbon nanotubes (CNTs) and 2-dimensional (2D) graphene. These nanomaterials have extraordinary physical properties that can be exploited to bring forward their exciting prospects for a variety of applications. This tutorial will highlight and discuss the unique prospects of NanoCarbon materials (especially gra... View full abstract»

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  • The future of optics in supercomputers

    Publication Year: 2013, Page(s): vi
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    In the past decade rack-to-rack cables in the worlds largest computers have gone from being all electrical to all optical. The optimal strategy for tomorrow's supercomputers will be to exploit those technologies, such as optics, which continue to evolve. Several factors drive the spread of optics within the supercomputer. First, the supercomputer's network doesn't scale well, meaning that for cons... View full abstract»

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  • Design and test of 2.5D and 3D stacked ICs

    Publication Year: 2013, Page(s): vii
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    Three dimensional chips stacked using Through Silicon Via (TSV) technology has been under consideration and the subject of intensive research for several years now. Soon the technologies will become available through standard fabs. Will the technology be an instant hit, a niche, or a flop? What is needed to ensure it reaches hit status? What are the basic manufacturing steps and flows? This tutori... View full abstract»

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  • On-chip measurement and characterization for high-speed links

    Publication Year: 2013, Page(s):viii - ix
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (195 KB)

    Today's high-speed interface designers are facing increasingly complex challenges imposed by the requirements of high performance, optimal power efficiency, and often by tight 3-D integration, such as in package-on-package (PoP) systems. Answers to many difficult, yet critical questions, need to be found by measurement inside the high-speed interfaces. What is the signal quality after the package ... View full abstract»

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  • Technical program committee (TPC)

    Publication Year: 2013, Page(s): x
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  • Every product is a promise

    Publication Year: 2013, Page(s): xi
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  • Don't just be sure ... be Sigrity sure! [advertisement]

    Publication Year: 2013, Page(s): xii
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  • Rambus bringing invention to market

    Publication Year: 2013, Page(s): xiii
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  • Make the connection

    Publication Year: 2013, Page(s): xiv
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  • IBM research

    Publication Year: 2013, Page(s): xv
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  • Seeking signal integrity sign-off?

    Publication Year: 2013, Page(s): xvi
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  • Table of contents

    Publication Year: 2013, Page(s):xvii - xix
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  • SoC power integrity from early estimation to design signoff

    Publication Year: 2013, Page(s): 3
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (61 KB) | HTML iconHTML

    Summary form only given. Power integrity has become a major integration challenge even for low power ARM-based SoC design. As performance requirements demand higher speed, more advanced process nodes reduce transistor level voltage margin, and low power consumption dictate aggressive power saving schemes such as more frequent power mode shifts and power gating, it's challenging to satisfy the powe... View full abstract»

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  • Electrical characterization of low-cost glass/epoxy laminates at millimeter wave frequencies

    Publication Year: 2013, Page(s):7 - 10
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (2946 KB) | HTML iconHTML

    We describe the characterization of low-cost glass/epoxy laminates at millimeter-wave frequencies up to 110 GHz. We characterize the loss, dielectric constant and Fiber-Weave-Effect properties of 3 such laminates. We also demonstrate several test cases of transitions at E-band and D-band frequencies (up to 130 GHz) designed with these laminates, showing excellent perform ance. View full abstract»

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  • A method for modeling the impact of conductor surface roughness on waveguiding properties of interconnects

    Publication Year: 2013, Page(s):11 - 14
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (139 KB) | HTML iconHTML

    A methodology is proposed for accounting for the impact of random conductor surface roughness in the electromagnetic analysis of the propagation characteristics of high-speed interconnects. The proposed methodology replaces the rough-surface conductor cross-section with a compound one, where a thin outer layer, conforming to the conductor contour and of frequency-dependent thickness and conductivi... View full abstract»

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  • A perturbation technique to analyze the influence of fiber weave effects on differential signaling

    Publication Year: 2013, Page(s):15 - 18
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (307 KB) | HTML iconHTML

    We study differential signaling via a pair of striplines in a substrate that is comprised of an epoxy/fiberglass woven composite structure. The transmission characteristics, which are deteriorated due to the presence of the fiber weave, are analyzed via an efficient modeling technique for nonuniform transmission lines. This technique is based on the solution of the pertinent differential equations... View full abstract»

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  • Insertion loss characterization of tightly spaced interconnects with an embedded patterned layer

    Publication Year: 2013, Page(s):21 - 24
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    As smaller packaging footprints and faster data rates are pursued, signal integrity suffers as a result of interconnects routed in close proximity to one another. This paper focuses on two tightly spaced microstrips and highlights the use of an embedded patterned layer (EPL) of conductive elements to improve insertion loss and far end crosstalk. The frequency domain S-parameter performance is char... View full abstract»

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  • Modeling I/O buffers using X-parameters

    Publication Year: 2013, Page(s):25 - 28
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (563 KB) | HTML iconHTML

    X-parameters have been shown to have a wide array of applications in the modeling of nonlinear devices and systems. This work analyzes the large-signal portion of an X-parameter model of a buffer to determine the extent of its nonlinearity and use for modeling input/output buffers. View full abstract»

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  • Design and fabrication of geometrically complicated multiband microwave devices using a novel integrated 3D printing technique

    Publication Year: 2013, Page(s):29 - 32
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (239 KB) | HTML iconHTML

    In this work a novel fast and efficient three dimensional (3D) printing technique is presented for prototyping and fabrication of 3D microwave structures to print both the conductive nanoparticle ink together with the dielectric material in an integrated process. This facilitates the fabrication of complicated 3D electromagnetic (EM) structures such as wide range of different multiband antennas an... View full abstract»

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  • Parallel processing improvements for full-wave electromagnetic solvers

    Publication Year: 2013, Page(s):35 - 38
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    As computing resources become increasingly parallel for both shared and distributed memory systems, computational electromagnetic methods need to take full advantage of new architectures in order to reduce simulation times. Several different aspects of the solution process make it difficult for traditional finite element field solvers to effectively utilize distributed and shared memory resources.... View full abstract»

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  • A generalized modeling method for signal/power integrity analysis of 3D coupled interconnects in finite cavity based on 1D technology

    Publication Year: 2013, Page(s):39 - 42
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (381 KB) | HTML iconHTML

    In this paper, an innovative 1D technology is used to model complex vias structures in 3D IC and package system, which can include the layout of both eccentric single-ended and differential signaling types. The problem under investigation is an essential basic unit which can be applied to build and model complex multilayer structures. We first obtain the impedance matrix for finite cavity, which i... View full abstract»

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  • New simulation procedure for accurate package modeling considering chip-package interaction

    Publication Year: 2013, Page(s):43 - 46
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (300 KB) | HTML iconHTML

    This paper presents a novel simulation procedure for full-wave electromagnetic simulations for generating package models taking into account chip-package interaction. If a simulated structure is split into two sub simulations, the accuracy of the overall simulation decreases. This is mainly the case if no clean separation of a composition into sub simulations is possible due to interactions betwee... View full abstract»

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