IEEE Transactions on Device and Materials Reliability

Issue 3 • Sept. 2013

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  • Table of contents

    Publication Year: 2013, Page(s): C1
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  • IEEE Transactions on Device and Materials Reliability publication information

    Publication Year: 2013, Page(s): C2
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  • Thermal Stability of High-Power LEDs Analyzed With Efficient Nondestructive Methodology

    Publication Year: 2013, Page(s):401 - 406
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (950 KB) | HTML iconHTML

    With the continuing advancement in light-emitting efficiency of high-power light-emitting diodes (LEDs), a nondestructive evaluation on thermal reliability, especially regarding the operating temperature and thermal resistance, which directly affect their lifetime and luminous characteristics, is needed. In this paper, we develop a methodology of using a 3-D numerical simulation for transient ther... View full abstract»

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  • In Situ I - V Measurements of an Ultraviolet Enhanced $hbox{ZnS:TiO}_{2}/hbox{n-Si}$ Quantum Dot Heterojunction Photodiode Under 120 MeV $hbox{Au}^{9+}$ Ions

    Publication Year: 2013, Page(s):407 - 412
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (793 KB) | HTML iconHTML

    This paper reports the development of a ZnS:TiO2/ n-Si heterojunction photodiode structure by deposition of colloidal ZnS:TiO2 quantum dots (QDs) on the n-Si substrate. To study the diode performance under harsh radiation atmospheres, in situ dark I- V characteristics of the ZnS:TiO2/n-Si photodiode have been studied under the irradiation of 120 MeV Au9+... View full abstract»

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  • Reliability of Self-Assembly Vertical Interconnects in Magnetically Aligned Anisotropic Conductive Adhesive for Electronic Packaging Applications

    Publication Year: 2013, Page(s):413 - 419
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1318 KB) | HTML iconHTML

    A self-assembly process in a magnetically aligned anisotropic conductive adhesive (MA-ACA) is a novel approach to selectively create high-density vertical interconnects by magnetic interaction between ferromagnetic input-output pads and particles. In order to characterize self-assembly vertical interconnects created in an MA-ACA, quad-flat no-lead chips with 40 daisy chain pads were assembled on a... View full abstract»

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  • Reducing the Cost of Single Error Correction With Parity Sharing

    Publication Year: 2013, Page(s):420 - 422
    Cited by:  Papers (1)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (345 KB) | HTML iconHTML

    Error correction codes (ECCs) are commonly used to protect memory devices from errors. The most commonly used codes are a simple parity bit and single-error-correction (SEC) codes. A parity bit enables single-bit error detection, whereas a SEC code can correct one-bit errors. A SEC code requires more additional bits per word and also more complex decoding that impacts delay. A tradeoff between bot... View full abstract»

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  • IEEE International Integrated Reliability Workshop (IIRW)

    Publication Year: 2013, Page(s): 423
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  • IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference

    Publication Year: 2013, Page(s): 424
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  • IEEE Transactions on Device and Materials Reliability information for authors

    Publication Year: 2013, Page(s): C3
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  • [Blank page - back cover]

    Publication Year: 2013, Page(s): C4
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Aims & Scope

IEEE Transactions on Device and Materials Reliability is published quarterly. It provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the manufacture of these devices; and the interfaces and surfaces of these materials.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
Anthony S. Oates
Taiwan Semiconductor Mfg Co.