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Solid-State Circuits Magazine, IEEE

Issue 1 • Date winter 2013

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Displaying Results 1 - 25 of 28
  • [Front Cover]

    Page(s): C1
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  • [Table of Contents]

    Page(s): 1
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  • Society Listing

    Page(s): 2
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  • [Contributors]

    Page(s): 3
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  • Welcome to the Winter 2013 Issue of IEEE Solid-State Circuits Magazine! [Editor's Note]

    Page(s): 4
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  • Distinguished Lecturers Around the World [President's Corner]

    Page(s): 5
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  • Stepping Out of Line [Associate Editor's View]

    Page(s): 6 - 7
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  • [Letter to Editor]

    Page(s): 7
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  • Quest for Low-Voltage and Low-Power Integrated Circuits: Towards a Sustainable Future

    Page(s): 8 - 26
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (11858 KB) |  | HTML iconHTML  

    On recent decades, human society has continuously required more and more functions and performance for IT and electronics equipment, more traffic and connectivity for the Internet, and more convenience and security for household electronics and automobiles. These needs are realized by means of integrated circuits (ICs) with digital logic, memory, analog, RF, and power functions and optical transmitters and receivers. View full abstract»

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  • A Historical Review of Low-Power, Low-Voltage Digital MOS Circuits Development

    Page(s): 27 - 39
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (2215 KB) |  | HTML iconHTML  

    The development of low-power (LP), low-voltage (LV) (or LPLV) digital MOS circuits, fueled by a strong need for highend microcomputers (MPUs) and explosive growth in portable systems, has surely contributed to the current boom in MOS large-scale integration (LSI). This article reviews such digital MOS circuits as they have been developed over the last 50 years, since the advent of integrated circuits (ICs). A particular emphasis is placed on MPUs, systems-on-a-chip (SoCs), and SRAMs and DRAMs; the discussion is based mainly on papers presented at the International Solid-State Circuits Conference (ISSCC) and the Symposium on VLSI Circuits. Flash memories that necessitate unique circuits for high density rather than low power and high speed are excluded. View full abstract»

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  • The Age of the Digital Nomad: Impact of CMOS Innovation

    Page(s): 40 - 47
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    Digital nomad? has become the catchphrase that describes a new lifestyle in which people have been freed from the constraints of time and location, thanks to the progress of mobile intelligent devices and high-speed communication networks. A book with this title was published in 1997 by the author and David Manners of the United Kingdom?based Electronics Weekly [1]. The first version was written in English; Japanese and Chinese versions were published the following year. Figure 1 shows photographs of the books and the authors. View full abstract»

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  • Silicon Photonics: The Next Fabless Semiconductor Industry

    Page(s): 48 - 58
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    Something very surprising has been happening in photonics recently: the same foundries and processes that were developed to build transistors are being repurposed to build chips that can generate, detect, modulate, and otherwise manipulate light. This is pretty counterintuitive, since the electronics industry spends billions of dollars to develop tools, processes, and facilities that lend themselves to building the very best transistors without any thought about how to make these processes compatible with photonics (with the obvious exception of the processes designed to make CMOS and CCD camera chips). View full abstract»

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  • Your Heart on Your Sleeve: Advances in Textile-Based Electronics Are Weaving Computers Right into the Clothes We Wear

    Page(s): 59 - 70
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (9139 KB)  

    In this article, we give an overview of these items and discuss the associated technological trends. In the first section, the history of wearable electronics is summarized, with special emphasis on I/O systems and substrate and packaging issues. Interconnections for wearable devices are introduced in the second section; they can be split into wireline and wireless approaches, as well as permanent versus detachable connections. In the third section, wearable health care systems on a chip (SoCs) and systems on textiles (SoTs) are explained in connection with their appropriate applications. Since wearable health care applications are a good match with wearable technologies, most of the dedicated chips have been developed for health care monitoring, diagnosis, and treatment. A final section presents anumber of conclusions regarding wearable electronics. View full abstract»

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  • Through the Looking Glass II?Part 1 of 2: Trend Tracking for ISSCC 2013 [ISSCC Trends]

    Page(s): 71 - 89
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  • Anantha P. Chandrakasan Wins 2013 IEEE Donald O. Pederson Award: ISSCC Conference Chair to Be Honored at ISSCC 2013 Plenary Awards Program [People]

    Page(s): 80 - 82
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  • ASSCC 2012 Student Design Contest Showcases Eleven from IEEE Region 10 Schools: Best Designs by Benjamin Devlin, Kailiang Chen, and Ryota Sekimoto [People]

    Page(s): 82 - 89
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  • Tom Lee Reprises "Dark Secrets of RF Design" in Webinar at SSCS-Singapore: Second SSCS Members-Only Electronic Classroom Targets IEEE Region 10 Time Zones [Chapters]

    Page(s): 90
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  • SSCS DL Bram Nauta Joins Local Analog/RF Experts for Two-Day Workshop in Delhi: Second Program in Chapter-Based Educational Drive Targets Advanced Analog Designers [Chapters]

    Page(s): 91 - 92
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  • OMEE Becomes International Conference in 2012 : SSCS Special Chapter Subsidy Underwrites Seven-Year-Old Workshop in Lviv Sponsored by IEEE MTT/ED/AP/CPMT/SSC West Ukraine [Chapters]

    Page(s): 92 - 94
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  • IEEE Central Texas CAS-SSC-CEDA Chapters Host Workshop in October on Data Parallelism for Multicore Chips and GPU [Chapters]

    Page(s): 94 - 95
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  • SSCS-Italy Sponsors Seventh Annual Topics on Microelectronics Program in Pavia: Partners with the 2013 International Conference on IC Design and Technology [Chapters]

    Page(s): 96
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  • SSCS/EDS-Bahia Holds First Workshop on Electron Devices and Solid-State Circuits: Industry Innovation in SOI was Main Theme of Inaugural Chapter Event [Chapters]

    Page(s): 97
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  • New "IEEE Virtual Journal" Revitalizes the IEEE Press Book: First IEEE Society-Based Multimedia Compendium [Society News]

    Page(s): 98 - 99
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  • Nominating Process for AdCom 2014-2016 Begins in March [Society News]

    Page(s): 99 - 101
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  • CEDA Currents [IEEE News]

    Page(s): 100 - 101
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Aims & Scope

Each issue of IEEE Solid-State Circuits Magazine is envisioned as a self-contained resource for fundamental theories and practical advances within the field of integrated circuits

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
Mary Lanzerotti
marylanzerotti@post.harvard.edu