Issue 2 • Date Feb. 2013
Filter Results
-
[Front cover]
|
PDF (335 KB)
-
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
|
PDF (122 KB)
-
Table of contents
|
PDF (127 KB)
-
-
-
Sliding Mechanism of Lateral Thermosonic Process With Anisotropic Conductive Film for High Productivity and High Reliability
|
PDF (1128 KB)
-
Thermal Stability of Optical Coupling Solutions in Silicone-Based Optical Interconnects
|
PDF (797 KB)
-
3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections
|
PDF (986 KB)
-
Stretchable Electronics Technology for Large Area Applications: Fabrication and Mechanical Characterization
|
PDF (838 KB)
-
One-Port Resonance-Based Test Technique for RF Interconnect and Filters Embedded in RF Substrates
|
PDF (1917 KB)
-
Compact and Broadband CB-CPW-to-SIW Transition Using Stepped-Impedance Resonator With 90
-Bent Slot
|
PDF (1237 KB)
-
Substrate-Integrated Waveguide Bandpass Filters With Planar Resonators for System-on-Package
|
PDF (1935 KB)
-
Analytical Approach to Design of Proportional-to-the-Absolute-Temperature Current Sources and Temperature Sensors Based on Heterojunction Bipolar Transistors
|
PDF (835 KB)
-
-
Conductive Anodic Filament Reliability of Small and Fine-Pitch Through Vias in Halogen-Free Organic Packaging Substrate
|
PDF (604 KB)
-
Fast
-Matrix-Based Direct Integral Equation Solver With Reduced Computational Cost for Large-Scale Interconnect Extraction
|
PDF (576 KB)
-
-
-
Modeling of Vias Sharing the Same Antipad in Planar Waveguide With Boundary Integral Equation and Group T-Matrix Method
|
PDF (1301 KB)
-
In Situ Measurement and Stress Evaluation for Wire Bonding Using Embedded Piezoresistive Stress Sensors
|
PDF (2436 KB)
-
-
-
-
Corrections to “Terahertz Characterization of Dielectric Substrates for Component Design and Nondestructive Evaluation of Packages” [Nov 11 1685-1694]
|
PDF (146 KB)
-
Open Access
|
PDF (1156 KB)
Aims & Scope
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.
Meet Our Editors
Managing Editor
R. Wayne Johnson
Auburn University


