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Emerging and Selected Topics in Circuits and Systems, IEEE Journal on

Issue 4 • Date Dec. 2012

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Displaying Results 1 - 14 of 14
  • Table of contents

    Publication Year: 2012 , Page(s): C1
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  • IEEE Journal on Emerging and Selected Topics in Circuits and Systems publication information

    Publication Year: 2012 , Page(s): C2
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  • Editorial

    Publication Year: 2012 , Page(s): 653 - 657
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  • A Self-Contained System With CNTs-Based Biosensors for Cell Culture Monitoring

    Publication Year: 2012 , Page(s): 658 - 671
    Cited by:  Papers (1)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (1815 KB) |  | HTML iconHTML  

    Biosensors have been applied to disparate fields, especially for endogenous compounds such as glucose and lactate. The main areas of application are certainly related to medical and diagnostic purposes. However, metabolic monitoring can be also of interest in cell analysis. Cells can be cultivated for several purposes, such as understanding and modeling some biological mechanisms, the development ... View full abstract»

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  • Heterogeneous Integration of Bio-Sensing System-on-Chip and Printed Electronics

    Publication Year: 2012 , Page(s): 672 - 682
    Cited by:  Papers (9)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (1850 KB) |  | HTML iconHTML  

    In this paper, we present a heterogeneous integration platform for bio-sensing applications, which seamlessly integrates low-power silicon-based circuits with cost-effective printed electronics. A prototype of wearable Bio-Sensing Node is fabricated to investigate the suitability of this integration approach. A 1.5 ×3.0 mm2 customized mixed-signal system-on-chip (SoC) with the si... View full abstract»

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  • An Optically Powered CMOS Receiver System for Intravascular Magnetic Resonance Applications

    Publication Year: 2012 , Page(s): 683 - 691
    Cited by:  Papers (7)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (1931 KB) |  | HTML iconHTML  

    This paper presents a low-power optically powered receiver system designed in 0.18 μm triple well UMC complementary metal-oxide-semiconductor (CMOS) technology. Optical transmission is used for both power delivery and signal transmission. The power of the whole system can be supplied in two different configurations, namely continuous and intermittent mode configurations. In the continuous m... View full abstract»

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  • Power Distribution in TSV-Based 3-D Processor-Memory Stacks

    Publication Year: 2012 , Page(s): 692 - 703
    Cited by:  Papers (2)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (1853 KB) |  | HTML iconHTML  

    Three primary techniques for manufacturing through silicon vias (TSVs), via-first, via-middle, and via-last, have been analyzed and compared to distribute power in a 3-D processor-memory system with nine planes. Due to distinct fabrication techniques, these TSV technologies require significantly different design constraints, as investigated in this paper. A valid design space that satisfies the pe... View full abstract»

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  • Distributed On-Chip Power Delivery

    Publication Year: 2012 , Page(s): 704 - 713
    Cited by:  Papers (10)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (1943 KB) |  | HTML iconHTML  

    The performance of an integrated circuit depends strongly upon the power delivery system. With the introduction of ultra-small on-chip voltage regulators, novel design methodologies are needed to simultaneously determine the location of the on-chip power supplies and decoupling capacitors. In this paper, a unified design methodology is proposed to determine the optimal location of the power suppli... View full abstract»

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  • 3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS

    Publication Year: 2012 , Page(s): 714 - 722
    Cited by:  Papers (7)  |  Patents (30)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (1762 KB) |  | HTML iconHTML  

    3-D sequential integration stands out from other 3-D schemes as it enables the full use of the third dimension. Indeed, in this approach, 3-D contact density matches with the transistor scale. In this paper, we report on the main advances enabling the demonstration of functional and performant stacked CMOS-FETs; i.e., wafer bonding, low temperature processes (<;650°C) and salicide stabil... View full abstract»

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  • CMOS-3D Smart Imager Architectures for Feature Detection

    Publication Year: 2012 , Page(s): 723 - 736
    Cited by:  Papers (7)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (2987 KB) |  | HTML iconHTML  

    This paper reports a multi-layered smart image sensor architecture for feature extraction based on detection of interest points. The architecture is conceived for 3-D integrated circuit technologies consisting of two layers (tiers) plus memory. The top tier includes sensing and processing circuitry aimed to perform Gaussian filtering and generate Gaussian pyramids in fully concurrent way. The circ... View full abstract»

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  • 2012 Index IEEE Journal on Emerging and Selected Topics in Circuits and Systems Vol. 2

    Publication Year: 2012 , Page(s): 737 - 747
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  • IEEE Journal on Emerging and Selected Topics in Circuits and Systems information for authors

    Publication Year: 2012 , Page(s): 748
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  • IEEE Circuits and Systems Society Information

    Publication Year: 2012 , Page(s): C3
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  • [Blank page - back cover]

    Publication Year: 2012 , Page(s): C4
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Aims & Scope

The IEEE Journal on Emerging and Selected Topics in Circuits and Systems publishes special issues covering the entire Field of Interest of the IEEE Circuits and Systems Society and with particular focus on emerging areas.

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Meet Our Editors

Editor-in-Chief
Manuel Delgado-Restituto
Instituto Nacional de Microelectrónica de Sevilla
IMSE-CNM (CSIC/Universidad de Sevilla)