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IEEE Transactions on Components, Packaging and Manufacturing Technology

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• [Front cover]

Publication Year: 2012, Page(s): C1
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• IEEE Transactions on Components, Packaging and Manufacturing Technology publication information

Publication Year: 2012, Page(s): C2
| PDF (38 KB)

Publication Year: 2012, Page(s):183 - 184
| PDF (128 KB)
• Vibration-Induced Changes in the Contact Resistance of High Power Electrical Connectors for Hybrid Vehicles

Publication Year: 2012, Page(s):185 - 193
Cited by:  Papers (10)
| | PDF (1429 KB) | HTML

Relatively little is known about the fretting mechanism of high power connectors used in hybrid vehicles, even though the vehicles are widely being introduced to the market. This paper experimentally investigates the fretting mechanisms of silver-plated high power connectors caused by vibrations. In order to emulate operational and environmental effects, a test stand was designed that is capable o... View full abstract»

• Solid State Bonding of Silicon Chips to Silver Buffer on Copper Substrates

Publication Year: 2012, Page(s):194 - 198
Cited by:  Papers (5)
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A solid state bonding technique was designed and developed to bond silicon (Si) chips to silver (Ag) buffer layer electroplated on copper (Cu) substrates at a temperature (260°C ) far below the melting temperature of Ag (961°C ). This is possible because Ag atoms in Ag buffer are brought in contact with the gold (Au) atoms in Au layer coated on Si chip. The close proximity in atomic ... View full abstract»

• Pick-and-Place Silver Sintering Die Attach of Small-Area Chips

Publication Year: 2012, Page(s):199 - 207
Cited by:  Papers (13)
| | PDF (1438 KB) | HTML

A method for high-temperature-stable die attaches based on sintering of micro and nano silver particles is described. A low-temperature (200°C) and low-pressure (3 N/mm2) process was established to ensure compatibility with conventional adhesive die attach and to avoid surface damage on the dice, respectively. A modified flip-chip bonder providing high placement accuracy (2 ... View full abstract»

• Silicon Carbide Power Modules for High-Temperature Applications

Publication Year: 2012, Page(s):208 - 216
Cited by:  Papers (20)
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A hermetic multichip power package for silicon carbide devices that will operate at 200°C ambient and switch 50-100 A has been developed. The Al2O3/MoCu structure, in which the SiC junction field-effect transistors and diodes are attached, was designed to hermetically seal the device areas. Details of the materials and processes used to fabricate the package... View full abstract»

• Application of Lamination Theory to Study Warpage Across PWB and PWBA During Convective Reflow Process

Publication Year: 2012, Page(s):217 - 223
Cited by:  Papers (3)
| | PDF (714 KB) | HTML

Out-of-plane displacement (warpage) has been a major reliability concern for board-level electronic packaging. Printed wiring board (PWB) and component warpage results principally from coefficient of thermal expansion (CTE) mismatch among the materials that make up the PWB assembly (PWBA). Warpage occurring during surface-mount assembly processes and normal operations may lead to severe solder bum... View full abstract»

• Reliability of liquid crystal polymer air cavity packaging

Publication Year: 2012, Page(s):224 - 230
Cited by:  Papers (9)
| | PDF (699 KB) | HTML

We present the development of liquid crystal polymer (LCP) packages and thermal compression sealing processes. We demonstrate the complete process for prototyping, sealing, and assembling a single-chip LCP package at microwave frequencies. Using the thermal compression technique, we achieve a measured fine leak rate of 3.7×10-8 cc-atm/s of a LCP package cavity. We have conducted ... View full abstract»

• Thermal Analysis and Packaging Optimization of Collector-Up HBTs Using an Enhanced Genetic-Algorithm Methodology

Publication Year: 2012, Page(s):231 - 239
Cited by:  Papers (1)
| | PDF (1073 KB) | HTML

In this paper, state-of-the-art collector-up (C-up) heterojunction bipolar transistors (HBTs) with different thermal-via structures (TVS) have been systematically investigated by an enhanced genetic-algorithm (GA) approach. According to recent literature, C-up HBTs are compelling candidates as active components integrated in modern power amplifiers (PAs). To meet the immense demand for miniature P... View full abstract»

• Reduction of Electromagnetic Interference Susceptibility in Small-Signal Analog Circuits Using Complementary Split-Ring Resonators

Publication Year: 2012, Page(s):240 - 247
Cited by:  Papers (5)
| | PDF (762 KB) | HTML

Low-frequency analog and digital electronic circuits are susceptible to electromagnetic interference in the radiofrequency (RF) range. This disturbance is produced when the coupled RF signal is rectified by the nonlinear behavior of the semiconductors used in the small-signal analog input stage of the electronic system. Circuits based on operational amplifiers are usually employed for such input s... View full abstract»

• Parameterized Partial Element Equivalent Circuit Method for Sensitivity Analysis of Multiport Systems

Publication Year: 2012, Page(s):248 - 255
Cited by:  Papers (1)
| | PDF (850 KB) | HTML

This paper presents a new technique to perform parameterized sensitivity analyses of systems that depend on multiple design parameters, such as layout and substrate features. It uses the electromagnetic (EM) method called partial element equivalent circuit to compute state space matrices at a set of design space points. These EM matrices are interpolated as functions of the design parameters. The ... View full abstract»

• Microstructurally Adaptive Model for Primary and Secondary Creep of Sn-Ag-Based Solders

Publication Year: 2012, Page(s):256 - 265
Cited by:  Papers (14)
| | PDF (949 KB) | HTML

Sn-Ag-based solders are susceptible to appreciable microstructural coarsening due to the combined effect of thermal and mechanical stimuli during service and storage. This results in evolution of the creep properties of the solder over time, necessitating the development of a thermo-mechanical history-dependent creep model for accurate prediction of the long-term reliability of microelectronic sol... View full abstract»

• Design of Complex Structured Monolithic Heat Sinks for Enhanced Air Cooling

Publication Year: 2012, Page(s):266 - 277
Cited by:  Papers (6)
| | PDF (1071 KB) | HTML

The design and characterization of monolithic heat sinks, which can take the form of complex structures, is reported. The designs were conceived to augment heat transport for enhanced air cooling by exploiting clearly identified physical mechanisms, i.e., by streaming the flow through a 2-D array of polygonal ducts, by introducing flow-obstacle-induced local mixing, and by exploiting hydrodynamic ... View full abstract»

• Analytical Solution of Thermal Spreading Resistance in Power Electronics

Publication Year: 2012, Page(s):278 - 285
Cited by:  Papers (4)
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A good understanding of thermal spreading resistance is crucial for thermal management in power electronics. In this paper, an analytical solution is developed for the determination of thermal spreading resistance with a heat source placed on a three-layer substrate, wherein the same footprint is assumed for different layers. An approximate approach is then proposed based on the analytical model w... View full abstract»

• Thermal Conductivity Enhancement of Benzocyclobutene With Carbon Nanotubes for Adhesive Bonding in 3-D Integration

Publication Year: 2012, Page(s):286 - 293
Cited by:  Papers (7)
| | PDF (1144 KB) | HTML

Thermal management is one of the critical challenges in 3-D integration. The intermediate bonding interfaces between two chips, such as silicon dioxide and polymer adhesives, are the major source of internal thermal resistance in 3-D integrated circuits, leading to thermal issues such as high temperature spots and larger temperature gradients. This paper reports an approach to reduce the thermal r... View full abstract»

• TEM Study of Local Conduction Mechanisms in Model Specimens of Ag-Based Conductive Adhesive

Publication Year: 2012, Page(s):294 - 299
Cited by:  Papers (2)
| | PDF (659 KB) | HTML

The conduction mechanisms of silver (Ag)-based conductive adhesives, which consist of metallic Ag particles and an epoxy resin, are discussed on the basis of transmission electron microscopy (TEM) studies and local conductivity measurements of model specimens. A small electrical current was observed in the model specimens, in which a thin epoxy layer was sandwiched between Ag electrodes. TEM obser... View full abstract»

• Effect of Transient Boundary Conditions and Detailed Thermal Modeling of Data Center Rooms

Publication Year: 2012, Page(s):300 - 310
Cited by:  Papers (5)
| | PDF (1715 KB) | HTML

With the ever increasing heat loads dissipated by computer hardware, the ability to accurately characterize the cooling requirements in data centers is becoming crucial. Computational fluid dynamics modeling has proven in many cases to be adequate in providing a general understanding of the thermal environment in data centers. However, almost all analyses of data centers to this day are conducted ... View full abstract»

• On-Chip Two-Phase Cooling With Refrigerant 85 $mu{rm m}$-Wide Multi-Microchannel Evaporator Under Hot-Spot Conditions

Publication Year: 2012, Page(s):311 - 320
Cited by:  Papers (7)
| | PDF (1161 KB) | HTML

Hot-spots are present in micro-electronics and are challenging to cool effectively. This paper presents highly nonuniform heat flux measurements obtained for a pseudo-CPU with 35 local heaters and temperature sensors cooled by a silicon multi-microchannel evaporator with 85 μm wide and 560 μm high channels separated by 46 μm wide fins. A low pressure dielectric refrigerant, R2... View full abstract»

• Extension of the Contour Integral Method to Anisotropic Modes on Circular Ports

Publication Year: 2012, Page(s):321 - 331
Cited by:  Papers (13)
| | PDF (1052 KB) | HTML

In the analysis of power/ground planes in multilayer substrates, circular ports are often used for modeling of via transitions. The electric and magnetic fields on excited ports are usually assumed to be isotropic. This assumption may not hold in certain scenarios such as vias in very close proximity, where anisotropic modes can be excited. This paper first extends voltage and current definitions ... View full abstract»

• Bandwidth Enhancement Based on Optimized Via Location for Multiple Vias EBG Power/Ground Planes

Publication Year: 2012, Page(s):332 - 341
Cited by:  Papers (17)
| | PDF (2444 KB) | HTML

The ground surface perturbation lattice (GSPL) structure is investigated to suppress power noise in the power distribution network of mixed signal circuits. In order to enhance the bandwidth of the noise suppression, the GSPL structure is implemented by using multiple vias in the mushroom-like electromagnetic bandgap structure. Under the concept of multiple vias, the lower and upper bound cutoff f... View full abstract»

• Evaluation of Coatings Applied to Flexible Substrates to Enhance Quality of Ink Jet Printed Silver Nano-Particle Structures

Publication Year: 2012, Page(s):342 - 348
Cited by:  Papers (4)  |  Patents (1)
| | PDF (1218 KB) | HTML

Different types of the commercial surface treatment InkAid have been evaluated as a surface treatment to enhance print quality of silver nano-particle ink structures printed on polyimide and polyethene substrates. Originally these coatings were designed to be applied on substrates for graphical ink jet printing. On the coated polyimide and polyethene substrates lines of different widths have been ... View full abstract»

• GaN-Based LEDs With Sapphire Debris Removed by Phosphoric Etching

Publication Year: 2012, Page(s):349 - 353
Cited by:  Papers (6)
| | PDF (645 KB) | HTML

The authors proposed a simple hot phosphoric etching method to enhance output power of GaN-based light-emitting diodes (LEDs) by 34%. By immersing the sample in H3PO4 at 220°C for 40 min, it was found that debris contaminants induced by nanosecond laser scribing could be effectively removed. It was also found that the hot phosphoric etching method will not degrade elec... View full abstract»

Publication Year: 2012, Page(s): 354
| PDF (320 KB)

Publication Year: 2012, Page(s): 355
| PDF (270 KB)

Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.

Full Aims & Scope

Meet Our Editors

Managing Editor
R. Wayne Johnson
Auburn University