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IEEE Design & Test of Computers

Issue 6 • Date Nov.-Dec. 2011

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Displaying Results 1 - 25 of 26
  • [Advertisement]

    Publication Year: 2011, Page(s): 1
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  • Contents

    Publication Year: 2011, Page(s):2 - 3
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  • The Promise of Flexible Electronics

    Publication Year: 2011, Page(s): 4
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  • Masthead

    Publication Year: 2011, Page(s): 5
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  • A Promising Alternative to Conventional Silicon [Guest editors' introducton]

    Publication Year: 2011, Page(s): 6
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  • Call for Papers

    Publication Year: 2011, Page(s): 7
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  • Robust Circuit Design for Flexible Electronics

    Publication Year: 2011, Page(s):8 - 15
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (962 KB) | HTML iconHTML

    In this review article, the authors survey several thin-film transistor (TFT) technologies for flexible electronics of the future. The review's focus centers on the reliability issues of these new devices compared to those of classic silicon CMOS. In addition, the article examines different digital and analog design techniques, which are discussed within the context of robust circuit design. View full abstract»

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  • Materials, Processing, and Testing of Flexible Image Sensor Arrays

    Publication Year: 2011, Page(s):16 - 23
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3677 KB) | HTML iconHTML

    Editors' note:Flexible, large-area display and sensor arrays are finding growing applications in multimedia and future smart homes. This article first analyzes and compares current flexible devices, then discusses the implementation, requirements, and testing of flexible sensor arrays. View full abstract»

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  • Placement Optimization of Flexible TFT Digital Circuits

    Publication Year: 2011, Page(s):24 - 31
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (976 KB) | HTML iconHTML

    Mechanical strain significantly affects thin-film transistor (TFT) device mobility; thus, strain awareness is indispensable to flexible TFT circuit design. This article presents a strain-aware placement technique to enhance TFT logic circuit performance in the presence of mechanical stress. View full abstract»

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  • Powering the Future: Organic Solar Cells with Polymer Energy Storage

    Publication Year: 2011, Page(s):32 - 40
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (859 KB) | HTML iconHTML

    Editors' note:This article presents a flexible self-sustaining energy solution. The low-cost and long-lasting organic solar cell technology, together with the polymer energy storage film technique, will enable more versatile and smart mobile applications in the future. View full abstract»

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  • Adaptive Testing: Dealing with Process Variability

    Publication Year: 2011, Page(s):41 - 49
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1029 KB) | HTML iconHTML

    This article describes the development of adaptive testing in response to the ever-growing need to dynamically and cost-effectively tailor IC testing to discriminately manage manufacturing process variations. Various degrees of adoption are presented, together with benefits and examples of its use. Finally, challenges for future development are discussed. View full abstract»

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  • Pulsed-Latch Circuits: A New Dimension in ASIC Design

    Publication Year: 2011, Page(s):50 - 57
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (732 KB) | HTML iconHTML

    Pulsed-latch circuits retain the advantages of both latches and flip-flops, offering higher performance and lower power consumption within a conventional ASIC design environment. This article identifies a design methodology and tools for pulsed-latch ASICs to complement this environment. The authors review potential solutions and provide quantitative results to assess the effectiveness of pulsed-l... View full abstract»

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  • Long-Term Thermal Overstressing of Computers

    Publication Year: 2011, Page(s):58 - 65
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2796 KB) | HTML iconHTML

    Significant opportunities exist to reduce costs in the design, manufacture, and operation of systems by using temperatures higher than specified in testing systems' reliability. The authors share the findings and observations of an experimental study in which they subjected operating computers to high steady-state temperatures and thermal cycling well beyond their design specifications. The result... View full abstract»

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  • Replacing Error Vector Magnitude Test with RF and Analog BISTs

    Publication Year: 2011, Page(s):66 - 75
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (812 KB) | HTML iconHTML

    RF and analog BIST techniques are capable of replacing the traditional error vector magnitude (EVM) test used in production. In a case study, four BISTs detected actual production faults in a commercial, highly integrated WLAN device. In combination with traditional digital testing, the BISTs caught an impressive 100% of EVM failures during production of over a million devices, which presents sign... View full abstract»

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  • RF Front-End Test Using Built-in Sensors

    Publication Year: 2011, Page(s):76 - 84
    Cited by:  Papers (13)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (980 KB) | HTML iconHTML

    This article proposes a new class of sensors for built-in test in RF devices. These sensors are placed in close proximity to the DUT on the same substrate without being electrically connected to it. Instead, they monitor it by virtue of being subjected to the same process variations. The authors also describe other types of sensors they have studied, including DC probes, an envelope detector, and ... View full abstract»

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  • Major Milestones for Two IEEE Standards Groups in 2011

    Publication Year: 2011, Page(s):85 - 87
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  • Product Futures

    Publication Year: 2011, Page(s):88 - 89
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (99 KB) | HTML iconHTML

    The "system driver" roadmaps for microprocessor, SoC, and other key products help unify and align more than a dozen supplier industries within the overall semiconductor technology roadmap. This column examines the relationship between product roadmaps and technology roadmaps, and the ever-present need to develop improved product roadmaps. View full abstract»

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  • CEDA Currents

    Publication Year: 2011, Page(s):90 - 91
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  • Test Technology TC Newsletter

    Publication Year: 2011, Page(s):92 - 93
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  • Conference Reports

    Publication Year: 2011, Page(s):94 - 95
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  • Getting Close to Your Computer

    Publication Year: 2011, Page(s): 96
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  • [Advertisement - Back cover]

    Publication Year: 2011, Page(s): c3
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  • [Advertisement - Back cover]

    Publication Year: 2011, Page(s): c4
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  • Annual Index

    Publication Year: 2011, Page(s): ii
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  • [Front cover]

    Publication Year: 2011, Page(s): c1
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Aims & Scope

This Periodical ceased production in 2012. The current retitled publication is IEEE Design & Test.

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Meet Our Editors

Editor-in-Chief
Krishnendu Chakrabarty