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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Issue 3 • Date Sept. 1988

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Title History

Advances in wire bonding technology for high lead count, high-density devices

Thermal stress in semiconductor encapsulating materials

Solderability degradation models for fusible tin alloy coatings on copper substrates

Hot spot effects in hybrid circuits

Electrical characteristics of single buried microstrip lines in the TEM approximation

A creep-rupture model for two-phase eutectic solders

Metallization of solar cells with ink jet printing and silver metallo-organic inks

Design tradeoffs between organic polymer-on-metal PWBs and ceramic thick-film PWBs for high-density operation using leadless ceramic chip carriers

Aluminium collector electrodes formed by the plasma spraying method for electric double-layer capacitors

Computer simulation for the conductance of a contact interface. II

An electret volatile organic chemical and particulate sensor

Design rules for microstrip capacitance

Performance limits of electrical interconnections to a high-speed chip

Thick-film circuit layout using the Magic layout editor

AutoTool I: a human focus on the development of software for tool control

Determination of current density distribution and constriction resistance in the multiple line contact with various space angles by using conformal mapping

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