Journal of Microelectromechanical Systems

Issue 2 • Jun 1993

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Displaying Results 1 - 4 of 4
  • Design of sealed cavity microstructures formed by silicon wafer bonding

    Publication Year: 1993, Page(s):74 - 81
    Cited by:  Papers (44)  |  Patents (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (888 KB)

    Three fabrication issues related to the design and fabrication of micromechanical devices using sealed cavities within bonded silicon wafers are discussed. The first concerns the resultant residual gas pressure within a sealed cavity between two bonded wafers after bonding and a high-temperature anneal. The second concerns the prediction of plastic deformation in capping layers of single-crystal s... View full abstract»

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  • A method to etch undoped silicon cantilever beams

    Publication Year: 1993, Page(s):82 - 86
    Cited by:  Papers (17)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (348 KB)

    A simple method has been designed to etch cantilever beams oriented in the <100> direction on (100) silicon wafers without back-etching, heavily doped boron etch stop, or anodic oxidation etch stop. The scheme requires only two levels of masking. Silicon dioxide and evaporated gold film are used as passivation materials. Anisotropic etching is performed in a sodium hydroxide bath. Silicon ca... View full abstract»

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  • Fabrication of submicron high-aspect-ratio GaAs actuators

    Publication Year: 1993, Page(s):66 - 73
    Cited by:  Papers (27)  |  Patents (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (792 KB)

    Submicron, single-crystal gallium arsenide (SC-GaAs) actuators have been designed, fabricated, and operated. The fabrication process, called SCREAM-II (single crystal reactive etching and metallization II), uses chemically assisted ion beam etching (CAIBE) and reactive ion etching (RIE) to produce suspended and movable SC-GaAs structures with up to a 25:1 aspect ratio of vertical depth (10 μm) ... View full abstract»

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  • Metallic microstructures fabricated using photosensitive polyimide electroplating molds

    Publication Year: 1993, Page(s):87 - 94
    Cited by:  Papers (97)  |  Patents (45)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (656 KB)

    A polyiimide-based process for the fabrication of thick (1-150 μm), sharp-sidewall, high-aspect-ratio electroplated microstructures is presented. This process is a low-cost alternative to the LIGA process for microstructure fabrication. Although this process cannot match the performance of the LIGA process, it uses ordinary optical masks and ultraviolet light exposure, resulting in simple and i... View full abstract»

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Aims & Scope

The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
Christofer Hierold
ETH Zürich, Micro and Nanosystems