Rensselaer Polytech. Inst., Troy, NY, USA
(1)
Dept. of Electron. Eng., Sogang Univ., Seoul, South Korea
(1)
Intel Corp., Hillsboro, OR, USA
(1)
Inst. of Microelectron., Tsinghua Univ., Beijing, China
(1)
Dept. of Electr. Eng. & Comput. Sci., Univ. of California, Berkeley, CA, USA
(1)
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
(1)
Production Eng. Res. Lab., Hitachi Ltd., Yokohama, Japan
(1)
Broadcom Corp., Irvine, CA, USA
(1)
Dept. of Electr. & Comput. Eng., Univ. of Massachusetts, Amherst, MA, USA
(1)
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea
(1)
LETI, CEA, Grenoble, France
(1)
Freescale Semicond., Austin, TX, USA
(1)
Sch. of Inf. Sci. & Technol., Donghua Univ., Shanghai, China
(1)
Nvidia, Santa Clara, CA, USA
(1)
Dept. of Comput. Sci., Nat. Chiao Tung Univ., Hsinchu, Taiwan
(1)
Dept. of Commun. Eng., Xiamen Univ., Xiamen, China
(1)
State Key Lab. of Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
(1)
Dept. of Microelectron. Eng., Univ. Coll. Cork, Cork, Ireland
(1)
DIEES, Univ. of Catania, Catania, Italy
(1)
DIEES (Dipt. di Ing. Elettr. Elettron. e dei Sist.), Univ. of Catania, Catania, Italy
(1)
Sch. of Phys. & Electron. Eng., Guangzhou Univ., Guangzhou, China
(1)
Ikanos Commun., Inc., Red Bank, NJ, USA
(1)
Lab. of the Integration from Mater. to Syst., Univ. Bordeaux 1, Bordeaux, France
(1)
Inst. of Neuroinf., Univ. of Zurich, Zürich, Switzerland
(1)
Microelectron. Syst. Lab. (LSM), Swiss Fed. Inst. of Technol. (EPFL), Lausanne, Switzerland
(1)
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