Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Issue 3 • Date May 1993
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Displaying Results 1 - 17 of 17
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Comparison of methods for determining the capacitance of planar transmission lines with application to multichip module characterization
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PDF (512 KB)
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A microelectronic test structure and numerical algorithm for characterization of liquid immersion heat transfer
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PDF (996 KB)
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Mode mixing and polarization scrambling microparticles in polymeric resin filled optical couplers
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PDF (528 KB)
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Least-square estimation of the equivalent circuit parameters of a via-hole from a TDR reflectogram, including on-board rise time and delay estimation
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PDF (656 KB)
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Au-Sn bonding metallurgy of TAB contacts and its influence on the Kirkendall effect in the ternary Cu-Au-Sn
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PDF (1060 KB)
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Au-In bonding below the eutectic temperature
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PDF (704 KB)
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Capacitance of disk capacitors
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PDF (444 KB)
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A new de-embedding technique for on-board structures applied to the bandwidth measurement of packages
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PDF (376 KB)
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Aims & Scope
IEEE Transactions on Components, Hybrids, and Manufacturing Technology was published 1978-1993. The latest title for this publication is IEEE Transactions on Advanced Packaging.
