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IEEE Microwave Magazine

Issue 5 • Aug. 2011

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Displaying Results 1 - 25 of 33
  • [Front cover]

    Publication Year: 2011, Page(s): C1
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  • Table of contents

    Publication Year: 2011, Page(s):3 - 4
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  • Demystifying Signal and Power Integrity [From the Guest Editor's Desk]

    Publication Year: 2011, Page(s):6 - 10
    Cited by:  Papers (3)
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  • Midyear Review [President's Column]

    Publication Year: 2011, Page(s):12 - 14
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  • Integrity in Business [MicroBusiness]

    Publication Year: 2011, Page(s):18 - 22
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    We are responsible for our own professional integrity, and by extension, the integrity of our businesses. When we become managers, we need to be watchful of the integrity of our organizations. Integrity is something that must be earned over time through competence and ethical behavior. It means that we are an organization that can be depended on. Integrity is easily lost, so we must be vigilant to... View full abstract»

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  • Dark Matters [Microwave Bytes]

    Publication Year: 2011, Page(s):24 - 29
    Cited by:  Papers (1)
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    I'm not sure how and why all this started, but I seem to have taken a recent new interest in magnetics. Having spent most of my own technical career working in the GHz frequency range, I have really had little to do with ferrites and magnetic properties of materials in general. Other than occasionally thanking my lucky stars that such things as isolators exist (and even then feeling a sense of fai... View full abstract»

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  • The Other Davos? [Microwave Surfing]

    Publication Year: 2011, Page(s):30 - 32
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  • New! Announcing the Measurement Internship Program

    Publication Year: 2011, Page(s): 32
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  • Essential Principles of Signal Integrity

    Publication Year: 2011, Page(s):34 - 41
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1743 KB) | HTML iconHTML

    High-speed digital design is driven by the analog effects of interconnects. These are fundamentally driven by the overlap of Maxwell's equations and board design. While simulations can help optimize a design, it is still fundamentally an engineer's design intuition that establishes the starting place. The earlier in the design process problems can be identified and designed out, the shorter the de... View full abstract»

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  • High-Speed Digital Design

    Publication Year: 2011, Page(s):42 - 50
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1727 KB) | HTML iconHTML

    High-speed digital design and microwave design share a rich heritage of electrical engineering theory, yet, key differences separate these two fields and the people that work in them. View full abstract»

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  • A New Dawn in R&D

    Publication Year: 2011, Page(s):51 - 60
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3393 KB) | HTML iconHTML

    The design of power distribution networks in modern highspeed electronic systems has become an ever-growing challenge. From boards with literally no bypass capacitors in the old days, through the one-capacitor-per-pin rule twenty years ago, the power distribution design has reached a state when it is equally as important as the signal-integrity design. The challenges stem from the simultaneous fun... View full abstract»

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  • Modeling of High-Speed Interconnects for Signal Integrity Analysis: Part I

    Publication Year: 2011, Page(s):61 - 74
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2659 KB) | HTML iconHTML

    Due to the continually rising demands for high-speed, high-density and broadband applications, signal integrity modeling and analysis has become imperative for design and validation of modern VLSI designs. In this review article, basic concepts of high-speed interconnect modeling were discussed. Also recent advances in interconnect modeling, such as MRA, DEPACT and WR-TP were reviewed. View full abstract»

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  • Measuring Signal Integrity

    Publication Year: 2011, Page(s):75 - 82
    Cited by:  Papers (1)
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    This article explains mechanisms and parameters that are relevant for signal integrity, illustrates their individual impact, and introduces typical measurement methods for signal integrity parameters in frequency and time domain. These methods are compared with respect to their specific strengths and limitations. Results from practical applications will be demonstrated including printed circuit bo... View full abstract»

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  • Packaging with Liquid Crystal Polymer

    Publication Year: 2011, Page(s):83 - 91
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2113 KB) | HTML iconHTML

    Electronics packages provide housing, protection, electrical interconnections, thermal dissipation, and assembly for integrated circuits and devices. At high frequency, cavity packages are used more often than over-molded plastic packages to achieve lower electrical losses. The major drawback of cavity packages is the open area that water and other contamination can be accumulated on the surface o... View full abstract»

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  • RF MEMS Satellite Switch Matrices

    Publication Year: 2011, Page(s):92 - 109
    Cited by:  Papers (31)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (5986 KB) | HTML iconHTML

    Microelectromechanical systems (MEMS) technology has the potential of replacing many of the radio frequency (RF) components used in to day's satellite communication systems. In many cases, such RF MEMS components would not only substantially reduce size, weight, and power consumption, but also promise superior performance when compared to that of current technologies. The benefits of MEMS technolo... View full abstract»

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  • Recent Advances in Delay Cell VCOs [Application Notes]

    Publication Year: 2011, Page(s):110 - 118
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (914 KB) | HTML iconHTML

    In this article, a review of commonly used delay cell techniques in ring VCO design was covered. Design limitations such as area, power, jitter, and phase noise performance were compared for ring and LC VCOs. These parameters were compared for several delay cell topologies throughout the paper. The tunable and flexible bandwidth criterion combined with low-noise characteristics, low power, and sma... View full abstract»

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  • ARFTG 78th Microwave Measurement Symposium

    Publication Year: 2011, Page(s): 119
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  • Are Inductors Bad? [review of "Integrated Inductors and Transformers" (Scuderi, A. et al; 2011)]

    Publication Year: 2011, Page(s): 120
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  • Recently Published Books [Book/Software Reviews]

    Publication Year: 2011, Page(s): 121
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  • Rudiger Vahldieck [In Memoriam]

    Publication Year: 2011, Page(s):122 - 125
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  • Ratification of MTT-S Constitution and Bylaws Amendments

    Publication Year: 2011, Page(s):124 - 125
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  • Wireless Energy Transfer and Conversion [TCC Tidbits]

    Publication Year: 2011, Page(s):126 - 139
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  • BCTM 2011

    Publication Year: 2011, Page(s): 127
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  • MTT-S Chapters and Membership 2011 [Around the Globe]

    Publication Year: 2011, Page(s):128 - 129
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  • MTT-S in Region 8 [Around the Globe]

    Publication Year: 2011, Page(s):129 - 131
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Aims & Scope

IEEE Microwave Magazine is intended to serve primarily as a source of information of interest to professionals in the field of microwave theory and techniques.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
Alfy Riddle
M/A-COM Technology Solutions
microwave.editor@ieee.org

408-506-0972