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Semiconductor Manufacturing, IEEE Transactions on

Issue 2 • Date May 1993

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Displaying Results 1 - 13 of 13
  • The formula: world class manufacturing for hybrid thin-film component production

    Publication Year: 1993 , Page(s): 170 - 177
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (676 KB)  

    In less than one year, Avantek's hybrid thin film component (HTFC) production operation transformed itself into a showcase for successful world class manufacturing (WCM). Production cycle time was reduced by 60%, work-in-process inventory was reduced by 92%, and overall process yields were improved by over 15%. WCM for this HTFC operation included the application of a number of productivity concep... View full abstract»

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  • Supplier improvement via SPC applications workshops

    Publication Year: 1993 , Page(s): 178 - 183
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (572 KB)  

    To fill the gap between basic classroom courses and help bring suppliers to a Six Sigma level, the Supply Management Quality Assurance organization developed the concept of SPC applications workshops. These workshops combine classroom training with actual hands on applications using the supplier's process as the training materials. This leaves the supplier with an understanding of how to implement... View full abstract»

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  • Advanced CIM environment for manufacturing data analysis

    Publication Year: 1993 , Page(s): 128 - 133
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (592 KB)  

    The Harris semiconductor manufacturing systems organization has released a new environment for performing complex analyses of semiconductor manufacturing processes and IC products in its facilities worldwide. This innovative analysis toolset has increased the productivity of engineers by providing a method for complex manufacturing data reduction without the need for exhaustive training. The inter... View full abstract»

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  • Why even successful teams sometimes fail-self-directed team catalysts [manufacturing]

    Publication Year: 1993 , Page(s): 163 - 169
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (720 KB)  

    The competitive need to significantly reduce cycle time and product inventory while improving yields in its logic fabricator, led IBM's semiconductor facility in Essex Junction, to adopt a continuous flow manufacturing (CFM) methodology and the team approach to implement this methodology. However, once these employee teams successfully achieved record breaking results, their effectiveness began to... View full abstract»

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  • Monitoring supplier quality at PPM levels

    Publication Year: 1993 , Page(s): 189 - 195
    Cited by:  Papers (1)  |  Patents (13)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (584 KB)  

    Motorola has traditionally monitored supplier quality levels using the lot accept rate. This measure, total lots accepted at incoming QA divided by the total lots received, was an adequate measure of supplier quality for many years. With the Motorola Six Sigma goal in place, supplier quality levels approached 100 percent and lot accept rate as a monitoring and rating metric lost its relevance. Sup... View full abstract»

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  • Research accomplishments at the University of Arizona SEMATECH Center of Excellence for contamination/defect assessment and control

    Publication Year: 1993 , Page(s): 134 - 142
    Cited by:  Patents (14)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (812 KB)  

    The Arizona SEMATECH Center of Excellence (SCOE) was established in May of 1988, is funded by SEMATECH and contractually monitored by the Semiconductor Research Corporation (SRC). The SCOE is engaged in research in a broad front to understand and control contamination which causes yield limiting defects in submicron ULSI circuits. Sandia National Laboratory personnel are integrated with UA personn... View full abstract»

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  • The evolution of employee empowerment

    Publication Year: 1993 , Page(s): 143 - 155
    Cited by:  Papers (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1260 KB)  

    The authors present the evolution of employee involvement programs into empowered self-directed work teams (SDWTs) to drive continuous improvement methodologies. With the primary goal of increased manufacturing performance and customer satisfaction, SDWTs are responsible for the day-to-day operations and directions of existing wafer fabs at Harris Semiconductor in Palm Bay, Florida. The SDWTs were... View full abstract»

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  • An object-oriented SECS programming environment

    Publication Year: 1993 , Page(s): 119 - 127
    Cited by:  Papers (3)  |  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (748 KB)  

    An object-oriented programming (OOP) environment for developing SEMI Equipment Communication Standard (SECS) applications with the C++ and C programming languages in a Unix workstation environment is described. The system defines a set of programming objects corresponding to the standard SECS-II item types, messages and headers as well as a number of support classes and operations. Conversion betw... View full abstract»

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  • Advantages of plasma etch modeling using neural networks over statistical techniques

    Publication Year: 1993 , Page(s): 103 - 111
    Cited by:  Papers (90)  |  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (768 KB)  

    Due to the inherent complexity of the plasma etch process, approaches to modeling this critical integrated circuit fabrication step have met with varying degrees of success. Recently, a new adaptive learning approach involving neural networks has been applied to the modeling of polysilicon film growth by low-pressure chemical vapor deposition (LPCVD). In this paper, neural network modeling is appl... View full abstract»

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  • Simultaneous in situ measurement of film thickness and temperature by using multiple wavelengths pyrometric interferometry (MWPI)

    Publication Year: 1993 , Page(s): 112 - 118
    Cited by:  Patents (5)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (544 KB)  

    Film thickness and temperature are two of the most important quantities in semiconductor manufacturing. They play a fundamental role in many standard production techniques like chemical vapor deposition (CVD, LPCVD, PECVD), thermal oxidation and diffusion. They are especially important for more recently developed technologies like molecular beam epitaxy (MBE), metal organic MBE (MOMBE), metal orga... View full abstract»

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  • Monitoring plasma-process induced damage in thin oxide

    Publication Year: 1993 , Page(s): 96 - 102
    Cited by:  Papers (11)  |  Patents (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (656 KB)  

    Plasma etching and resist ashing processes cause current to flow through the thin oxide and the resultant plasma-induced damage can be simulated and modeled as damage produced by constant current electrical stress. The oxide charging current produced by plasma processing increases with the `antenna' size of the device structure. Oxide charge measurement such as CV or threshold voltage is a more se... View full abstract»

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  • From trend charts to control charts: setup tests for making the leap

    Publication Year: 1993 , Page(s): 184 - 188
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (356 KB)  

    Statistical tests are developed to provide an operational definition of the term `under control' for application in deciding whether trend charts in semiconductor operations should be implemented as control charts, which often require considerable investment in responding to special cause flags. The decision rules derive from Monte Carlo simulations of traditional special cause flags modified for ... View full abstract»

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  • The implementation of total quality management (TQM) in a semiconductor manufacturing operation

    Publication Year: 1993 , Page(s): 156 - 162
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (628 KB)  

    The author reviews his five year experience in the implementation of total quality management (TQM) in the operation of the silicon wafer fabrication (fab) facility in Xerox Microelectronics Center (MEC). First, the TQM basic concepts and its operational implications are summarized. This is followed by a detailed description of the TQM implementation process in the wafer fab. Driven by Xerox corpo... View full abstract»

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Aims & Scope

The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components.

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Meet Our Editors

Editor-in-Chief

Anthony Muscat
Department of Chemical and Environmental Engineering
Harshbarger Bldg., Room 134
1133 E. James Rogers Way
University of Arizona
Tucson, AZ  85721