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IEEE Transactions on Electronics Packaging Manufacturing

Issue 4 • Date Oct. 2010

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Displaying Results 1 - 18 of 18
  • Table of contents

    Publication Year: 2010, Page(s): C1
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  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2010, Page(s): C2
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  • Editorial - CPMT Society to Merge Transactions in 2011

    Publication Year: 2010, Page(s):241 - 242
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  • List of Reviewers

    Publication Year: 2010, Page(s): 243
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  • An Integrated Manufacturing System for the Design, Fabrication, and Measurement of Ultra-Precision Freeform Optics

    Publication Year: 2010, Page(s):244 - 254
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1699 KB) | HTML iconHTML

    Geometry complexity and high-precision requirement have imposed a lot of challenges for the design, manufacturing, and measurement of ultra-precision freeform surfaces with submicrometer form accuracy and surface finish in nanometer range. Successful manufacturing of ultra-precision freeform surface not only relies on the high precision of machine tools, but also largely depends on comprehensive c... View full abstract»

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  • Simulation Methods for Predicting Fusing Current and Time for Encapsulated Wire Bonds

    Publication Year: 2010, Page(s):255 - 264
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2029 KB) | HTML iconHTML

    Wirebonding is a process often used to provide electrical connection between the silicon chip and the external leads of a semiconductor device using very fine wires. For high-power IC chips, as device size inevitably decreases, the wire diameter unfortunately must decrease due to the need of finer pitch wires. Fusing or melting of wirebonds thus increasingly becomes one of the potential failure is... View full abstract»

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  • Reducing Solder Paste Inspection in Surface-Mount Assembly Through Mahalanobis–Taguchi Analysis

    Publication Year: 2010, Page(s):265 - 274
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1508 KB) | HTML iconHTML

    Increased functional density and reduced input/output (I/O) spacing are the market trends in the electronics manufacturing industry. Industry reports indicate that approximately 50%-70% of soldering defects are attributed to the solder paste printing process for printed circuit board (PCB) assembly. Hence, after the printing process, a solder paste inspection (SPI) system is generally used to exam... View full abstract»

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  • Scalability of Roll-to-Roll Gravure-Printed Electrodes on Plastic Foils

    Publication Year: 2010, Page(s):275 - 283
    Cited by:  Papers (66)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3454 KB) | HTML iconHTML

    Roll-to-roll (R2R) gravure printing is considered to be a leading technology for the production of flexible and low-cost printed electronics in the near future. To enable the use of R2R gravure in printed electronics, the limits of overlay printing registration accuracy (OPRA) and the scalability of printed features with respect to the physical parameters of the gravure system, including given pla... View full abstract»

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  • Signal Integrity Enhanced EBG Structure With a Ground Reinforced Trace

    Publication Year: 2010, Page(s):284 - 288
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1051 KB) | HTML iconHTML

    In general, a conventional electromagnetic bandgap (EBG) structure efficiently suppresses simultaneous switching noise (SSN) over a wide frequency range. However, it is difficult to apply the geometry to the design of a real printed circuit boards (PCBs) for high-speed digital circuits due to the degradation in the signal integrity performance. In this paper, a ground reinforced trace (GRT) is add... View full abstract»

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  • Time–Frequency and Autoregressive Techniques for Prognostication of Shock-Impact Reliability of Implantable Biological Electronic Systems

    Publication Year: 2010, Page(s):289 - 302
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2140 KB) | HTML iconHTML

    In this paper, autoregressive and time-frequency-based techniques have been investigated to predict and monitor the damage in implantable biological electronics such as pacemakers and defibrillators. The approach focuses is on the pre-failure space and methodologies for quantification of failure in electronic equipment subjected to shock and vibration loads using the dynamic response of the electr... View full abstract»

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  • Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach

    Publication Year: 2010, Page(s):303 - 311
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (909 KB) | HTML iconHTML

    The assessment of the capability of electronic equipment, to withstand harsh vibration environments, is an issue faced in several branches of engineering. Various researchers have studied the vibration response of electronic boards using different parameters, e.g., local board accelerations, bending moments, curvatures, etc., as a simpler alternative to very detailed stress analysis. However, the ... View full abstract»

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  • Table of contents

    Publication Year: 2010, Page(s): 312
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  • Table of contents

    Publication Year: 2010, Page(s):313 - 314
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  • 2010 Index IEEE Transactions on Electronics Packaging Manufacturing Vol. 33

    Publication Year: 2010, Page(s):315 - 322
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  • IEEE Foundation [advertisement]

    Publication Year: 2010, Page(s): 323
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  • Leading the field since 1884 [advertisement]

    Publication Year: 2010, Page(s): 324
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  • IEEE Components, Packaging, and Manufacturing Technology Society information for authors

    Publication Year: 2010, Page(s): C3
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2010, Page(s): C4
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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

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Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University