IEEE Design & Test of Computers

Issue 4 • July-Aug. 2010

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Displaying Results 1 - 21 of 21
  • [Front cover]

    Publication Year: 2010, Page(s): c1
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  • [Front cover]

    Publication Year: 2010, Page(s): c2
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  • Call for Papers

    Publication Year: 2010, Page(s): 1
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  • Toc 
  • Table of Contents

    Publication Year: 2010, Page(s): 2
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  • Overcoming interconnect bottlenecks in gigascale ICs

    Publication Year: 2010, Page(s): 4
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  • Masthead

    Publication Year: 2010, Page(s): 5
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  • Guest Editors' Introduction: Promises and Challenges of Novel Interconnect Technologies

    Publication Year: 2010, Page(s):6 - 9
    Cited by:  Papers (1)
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  • Optical Interconnect for High-End Computer Systems

    Publication Year: 2010, Page(s):10 - 19
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (672 KB) | HTML iconHTML

    Advances in silicon photonic technology have made possible the use of optical communication in large-scale chip arrays. This article shows how such a structure utilizes the high bandwidth of the optical links through optical proximity communication that enables significant levels of device integration. View full abstract»

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  • Carbon Nanomaterials: The Ideal Interconnect Technology for Next-Generation ICs

    Publication Year: 2010, Page(s):20 - 31
    Cited by:  Papers (20)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (534 KB) | HTML iconHTML

    Carbon nanotubes and graphene nanoribbons are two promising next-generation interconnect technologies. Electrical modeling and performance analysis have demonstrated the superiority of these emerging technologies compared to conventional copper interconnects, as this article explains. View full abstract»

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  • Short-Range, Wireless Interconnect within a Computing Chassis: Design Challenges

    Publication Year: 2010, Page(s):32 - 43
    Cited by:  Papers (24)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (881 KB) | HTML iconHTML

    This article advocates the use of short-range wireless communication inside a computing chassis. Ultrawideband links make it possible to design a within-chassis wireless interconnect. In contrast to conventional, fixed, wireline connections between chips, wireless communications offer certain unique advantages, as the authors explain. View full abstract»

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  • Wireless Interconnect and the Potential for Carbon Nanotubes

    Publication Year: 2010, Page(s):44 - 53
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (988 KB) | HTML iconHTML

    Recent research has demonstrated that carbon nanotubes (CNTs) have excellent emission and absorption characteristics, leading to dipole-like radiation behavior, which makes CNTs promising alternatives for use as antennas in on-chip wireless communication. This article reviews the key characteristics of CNTs that make them so well suited for this purpose. View full abstract»

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  • Global On-Chip Coordination at Light Speed

    Publication Year: 2010, Page(s):54 - 67
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1228 KB) | HTML iconHTML

    On-chip optical links are an efficient means of designing the communication backbone for massive multicore chips. Using nanophotonic technology lets designers develop a low-power, low-latency interconnection infrastructure for many-core chips. View full abstract»

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  • Chips in 3D

    Publication Year: 2010, Page(s):68 - 69
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  • When is 3D 2B?

    Publication Year: 2010, Page(s):70 - 71
    Cited by:  Papers (1)
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  • CEDA Currents [including TCAD Best Paper Award]

    Publication Year: 2010, Page(s):72 - 73
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  • Design Automation Technical Committee Newsletter

    Publication Year: 2010, Page(s):74 - 76
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  • Conference Reports

    Publication Year: 2010, Page(s): 77
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  • Test Technology TC Newsletter

    Publication Year: 2010, Page(s):78 - 79
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  • On-chip networks: Two sides of the same coin

    Publication Year: 2010, Page(s): 80
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  • [Advertisement - Back cover]

    Publication Year: 2010, Page(s): c3
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  • [Advertisement - Back cover]

    Publication Year: 2010, Page(s): c4
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Aims & Scope

This Periodical ceased production in 2012. The current retitled publication is IEEE Design & Test.

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Meet Our Editors

Editor-in-Chief
Krishnendu Chakrabarty