By Topic

IBM Journal of Research and Development

Issue 3 • May 1969

Filter Results

Displaying Results 1 - 14 of 14
  • SLT Device Metallurgy and its Monolithic Extension

    Publication Year: 1969, Page(s):226 - 238
    Cited by:  Papers (48)  |  Patents (22)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1001 KB)

    The glass-passivated, face-down semiconductor chip joining technology employed in IBM's SLT (Solid Logic Technology), has become not only a fundamental element in the hybrid circuitry of System/360 but also the basis for later metallurgical designs. The “flip-chip,” copper ball terminal, solder reflow technique is comprehensively reviewed and a discussion is given of its extension, t... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Controlled Collapse Reflow Chip Joining

    Publication Year: 1969, Page(s):239 - 250
    Cited by:  Papers (151)  |  Patents (26)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (753 KB)

    Solder reflow connection of semiconductor devices to substrates has been shown to be a reliable, effective, and readily automated technique. Rigid copper spheres, which remain rigid during solder reflow, have been used successfully for some time as a major element of the contact joint. However, to expand the capability of such joints to larger devices such as multiple-transistor chips in hybrid co... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Geometric Optimization of Controlled Collapse Interconnections

    Publication Year: 1969, Page(s):251 - 265
    Cited by:  Papers (71)  |  Patents (21)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (887 KB)

    This paper deals with the mechanical reliability of controlled collapse solder joints in modules subjected to the thermal fatigue conditions of machine usage. Particular emphasis is placed on design variability and how the shape and dimensions of the joint and chip affect reliability. A systematic technique is presented to optimize pad dimensions. A new experimental method to characterize chip-to-... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Reliability of Controlled Collapse Interconnections

    Publication Year: 1969, Page(s):266 - 271
    Cited by:  Papers (159)  |  Patents (20)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (446 KB)

    The use of solder pads to join multi-pad integrated circuit chips to modules provides a highly reliable, rugged interconnection technology. This paper reports some important aspects of the reliability evaluation that was carried out on the “controlled chip collapse” interconnection system developed by IBM. Included are an analysis of the mechanics of the system, a model to establish ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Parametric Study of Temperature Profiles in Chips Joined by Controlled Collapse Techniques

    Publication Year: 1969, Page(s):272 - 285
    Cited by:  Papers (2)  |  Patents (3)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1037 KB)

    Parameters governing the temperature profiles of typical semiconductor chips joined to circuit module substrates by controlled chip collapse (flip-chip bonding) techniques are discussed. These include the physical and geometric properties of various layers of metals and non-metals that form the chip-to-substrate interconnection. The importance of the bond between the interconnection and the substr... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Studies of the SLT Chip Terminal Metallurgy

    Publication Year: 1969, Page(s):286 - 296
    Cited by:  Papers (6)  |  Patents (4)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1574 KB)

    The thin film metallurgy used for SLT chip terminal contacts has been studied with respect to the soldering procedure used for chip-to-module joining. A simple solder immersion test was used to study wetting and dewetting effects on Cr films overlaid with films of Cu and other metals. It was found that the initial soldering reaction (consisting of the conversion of the Cu film to a Cu-Sn metallic ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Parallel Methods for Approximating the Root of a Function

    Publication Year: 1969, Page(s):297 - 301
    Cited by:  Papers (2)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (500 KB)

    We present a class of methods for approximating the root of a function. The methods are designed for execution on a parallel processor and when they are so executed, the speed of the approximation process is increased. The increase in speed is estimated analytically by computations of the order of convergence of the various methods presented. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Scattering of Electromagnetic Radiation by a Large, Absorbing Sphere

    Publication Year: 1969, Page(s):302 - 313
    Cited by:  Papers (4)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1045 KB)

    Details are provided for two subroutines with which one can compute the various characteristics of the electromagnetic radiation scattered by an absorbing, homogeneous sphere of any reasonable size. The necessary expressions for this purpose were first derived by Mie. The method of computations used is the so-called method of logarithmic derivative of one of the complex functions, introduced by In... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • A General Method for Obtaining Impedance and Coupling Characteristics of Practical Microstrip and Triplate Transmission Line Configurations

    Publication Year: 1969, Page(s):314 - 322
    Cited by:  Papers (12)  |  Patents (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (767 KB)

    In order to design an interconnection system for nanosecond-risetime logic circuitry, it is necessary to obtain a balance between impedance variations, propagation velocities, and crosstalk levels so as to achieve the best system speed as well as system speed control. To accomplish this, it is necessary to relate the electrical material properties and physical dimensions of the connections to char... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Thermal Expansion in a Constrained Elastic Cylinder

    Publication Year: 1969, Page(s):323 - 330
    Cited by:  Papers (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (726 KB)

    The stress developed in an elastic cylinder of finite length undergoing thermal expansion with one end clamped is expressed in terms of a series expansion of a biharmonic function, appropriate derivatives of which give the displacements and stresses within the cylinder. The coefficients in this series are determined by a least-squares fit to the boundary conditions at the ends of the cylinder and ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Recent Papers by IBM Authors

    Publication Year: 1969, Page(s):331 - 334
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (501 KB)

    Reprints of the papers listed here may usually be obtained most efficiently by writing directly to the authors. The authors' IBM divisions and locations are identified as follows: ASDD is the Advanced Systems Development Division; CD, Components Division; DPD, Data Processing Division; FSD, Federal Systems Division; RES, Research Division; SDD, Systems Development Division and SMD, Systems Manufac... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Patents Recently Issued to IBM Inventors

    Publication Year: 1969, Page(s):335 - 336
    IEEE is not the copyright holder of this material | PDF file iconPDF (344 KB)
    Freely Available from IEEE
  • Authors

    Publication Year: 1969, Page(s):337 - 338
    IEEE is not the copyright holder of this material | PDF file iconPDF (371 KB)
    Freely Available from IEEE
  • Contents of previous two issues

    Publication Year: 1969, Page(s): 339
    IEEE is not the copyright holder of this material | PDF file iconPDF (159 KB)
    Freely Available from IEEE

Aims & Scope

Meet Our Editors

Editor-in-Chief
Clifford A. Pickover
IBM T. J. Watson Research Center