IBM Journal of Research and Development

Issue 1 • Jan 1982

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Displaying Results 1 - 15 of 15
  • System Development and Technology Aspects of the IBM 3081 Processor Complex

    Publication Year: 1982, Page(s):2 - 11
    Cited by:  Papers (8)  |  Patents (4)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (802 KB)

    The IBM 3081 Processor Complex consists of a 3081 Processor Unit and supporting units for processor control, power, and cooling. The Processor Unit, completely implemented in LSI technology, has a dyadic organization of two central processors, each with a 26-ns machine cycle time, and executes System/370 instructions at approximately twice the rate of the IBM 3033. This paper presents an overview ... View full abstract»

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  • IBM 3081 Processor Unit: Design Considerations and Design Process

    Publication Year: 1982, Page(s):12 - 21
    Cited by:  Papers (7)  |  Patents (2)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (843 KB)

    Significantly new challenges were presented for the design of the 3081 Processor Unit since it was the first IBM large system implemented in LSI technology. Solutions had to be found for a new set of problems in order to achieve the required product objectives while maintaining an acceptable development cost and schedule. In this paper, the design aspects and the characteristics of the 3081 Proces... View full abstract»

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  • Processor Controller for the IBM 3081

    Publication Year: 1982, Page(s):22 - 29
    Cited by:  Papers (3)  |  Patents (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (628 KB)

    The IBM 3081 represents an important step in the evolution of large-scale data processing systems. The incorporation of LSI technology in its design has resulted in a departure from the use of traditional support tools and techniques. Its increased processing capabilities and its dyadic organization have further accented the requirements for high availability and ease of operation. This paper desc... View full abstract»

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  • Thermal Conduction Module: A High-Performance Multilayer Ceramic Package

    Publication Year: 1982, Page(s):30 - 36
    Cited by:  Papers (72)  |  Patents (34)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (743 KB)

    Innovations in package design coupled with major advances in multilayer ceramic (MLC) technology provide a high-performance LSI package for the IBM 3081 Processor Unit. The thermal conduction module (TCM) utilizes a 90 × 90-mm MLC substrate to interconnect up to 118 LSI devices. The substrate, which typically contains 130 m of impedance-controlled wiring, provides an array of 121 pads for s... View full abstract»

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  • A New Set of Printed-Circuit Technologies for the IBM 3081 Processor Unit

    Publication Year: 1982, Page(s):37 - 44
    Cited by:  Papers (5)  |  Patents (4)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (675 KB)

    A new set of printed-circuit technologies have been developed which permit construction of printed-circuit panels with several kilometers of controlled-impedance interconnections. Communications between internal layers of signal planes are achieved through small plated vias (drilled with a laser), while plated through-holes are used for the logic service terminals for cable terminations and module... View full abstract»

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  • Conduction Cooling for an LSI Package: A One-Dimensional Approach

    Publication Year: 1982, Page(s):45 - 54
    Cited by:  Papers (37)  |  Patents (2)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (757 KB)

    The introduction of LSI packaging has significantly increased the number of circuits per silicon chip, and at the same time has greatly increased their heat flux density. In comparison to earlier MST (monolithic systems technology) products, the heat flux which must be removed from the new multi-chip substrates (100 or more chips) has increased by an order of magnitude or more. This paper discusse... View full abstract»

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  • A Conduction-Cooled Module for High-Performance LSI Devices

    Publication Year: 1982, Page(s):55 - 66
    Cited by:  Papers (24)  |  Patents (13)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (975 KB)

    The advent of LSI chip technology makes possible significantly increased performance and circuit densities by means of large-scale packaging of multiple devices on a single multi-layer ceramic (MLC) substrate. Integration at the chip and module levels has resulted in circuit densities as high as 2.5×107 circuits per cubic meter, with the necessity of removing heat fluxes on the o... View full abstract»

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  • Model for Transient and Permanent Error-Detection and Fault-Isolation Coverage

    Publication Year: 1982, Page(s):67 - 77
    Cited by:  Papers (21)  |  Patents (2)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (851 KB)

    As computer technologies advance to achieve higher performance and density, intermittent failures become more dominant than solid failures, with the result that the effectiveness of any diagnostic procedure which relies on reproducing failures is greatly reduced. This problem is solved at the system level by a new strategy of dynamic error detection and fault isolation based on error checking and ... View full abstract»

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  • Automated Diagnostic Methodology for the IBM 3081 Processor Complex

    Publication Year: 1982, Page(s):78 - 88
    Cited by:  Papers (16)  |  Patents (4)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (890 KB)

    The concepts of automated diagnostics that were developed for and that are implemented in the IBM 3081 Processor Complex are presented in this paper. Significant features of the 3081 diagnostics methodology are the capability to isolate intermittent as well as solid hardware failures, and the automatic isolation of a failure to the failing field-replaceable unit (FRU) in a high percentage of the c... View full abstract»

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  • Design Verification System for Large-Scale LSI Designs

    Publication Year: 1982, Page(s):89 - 99
    Cited by:  Papers (18)  |  Patents (2)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (911 KB)

    This paper describes the changing environment of large-scale hardware designs as influenced by technology advancements and the growing use of design verification in the design implementation process. The design verification methodology presented here saved some 66 % from the 3081 product schedule, when compared with a schedule utilizing a conventional verification method, on almost 800,000 LSI log... View full abstract»

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  • Timing Analysis of Computer Hardware

    Publication Year: 1982, Page(s):100 - 105
    Cited by:  Papers (159)  |  Patents (32)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (515 KB)

    Timing Analysis is a design automation program that assists computer design engineers in locating problem timing in a clocked, sequential machine. The program is effective for large machines because, in part, the running time is proportional to the number of circuits. This is in contrast to alternative techniques such as delay simulation, which requires large numbers of test patterns, and path tra... View full abstract»

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  • Boolean Comparison of Hardware and Flowcharts

    Publication Year: 1982, Page(s):106 - 116
    Cited by:  Papers (54)  |  Patents (2)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (815 KB)

    Boolean comparison is a design verification technique in which two logic networks are compared for functional equivalence using analysis rather than simulation. Boolean comparison was used on the IBM 3081 project to establish that hardware flowcharts and the detailed hardware logic design were functionally equivalent. Hardware flowcharts are a graphic form of a hardware description language which ... View full abstract»

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  • Recent Papers by IBM Authors

    Publication Year: 1982, Page(s):117 - 124
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (693 KB)

    Reprints of the papers listed here may usually be obtained by writing directly to the authors. The authors' IBM divisions or groups are identified as follows: CHQ is Corporate Headquarters: DPD, Data Processing Division; CPD. Communication Products Division: DSD, Data Systems Division: FED, Field Engineering Division: FSD, Federal Systems Division: GBG/I, General Business Group/International: GPD,... View full abstract»

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  • Recent IBM Patents

    Publication Year: 1982, Page(s):125 - 127
    IEEE is not the copyright holder of this material | PDF file iconPDF (222 KB)
    Freely Available from IEEE
  • Authors

    Publication Year: 1982, Page(s):128 - 132
    IEEE is not the copyright holder of this material | PDF file iconPDF (452 KB)
    Freely Available from IEEE

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IBM T. J. Watson Research Center