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IBM Journal of Research and Development

Issue 3 • May 1982

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Displaying Results 1 - 16 of 16
  • Preface

    Publication Year: 1982, Page(s):276 - 277
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (349 KB)

    Among computer designers the term “package” now generally implies all of the hardware used to provide physical support for and electrical interconnection of integrated circuit chips. Thus the computer package includes chip modules, cards, circuit boards, electrical connectors, cables, and frames. The design of a computer package involves both electrical and mechanical considerations,... View full abstract»

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  • Cost/Performance Single-Chip Module

    Publication Year: 1982, Page(s):278 - 285
    Cited by:  Papers (11)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1185 KB)

    The introduction of the high performance T2L device technology for the IBM 4300 Systems and the System/38 required extensions of the 24-mm metallized ceramic module used in prior IBM systems. The extension of the metallized ceramic technology into a physically larger 28-mm module, electrically enhanced with a reference plane and with fine line (0.025-mm) wiring, is described. The reliab... View full abstract»

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  • The Thin-Film Module as a High-Performance Semiconductor Package

    Publication Year: 1982, Page(s):286 - 296
    Cited by:  Papers (74)  |  Patents (13)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1258 KB)

    This paper discusses a multichip module for future VLSI computer packages on which an array of silicon chips is directly attached and interconnected by high-density thin-film lossy transmission lines. Since the high-performance VLSI chips contain a large number of off-chip driver circuits which are allowed to switch simultaneously in operation, low-inductance on-module capacitors are found to be e... View full abstract»

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  • Advanced Printed-Circuit Board Design for High-Performance Computer Applications

    Publication Year: 1982, Page(s):297 - 305
    Cited by:  Papers (2)  |  Patents (8)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1027 KB)

    A new integrated circuit packaging structure was needed to support the new 90-mm multilayer ceramic modules, known as Thermal Conduction Modules (TCMs), used in the IBM 3081 computers. The structure developed eliminates one level of packaging (the card level) and allows up to nine TCMs to be plugged directly into a large multilayer printed-circuit board using a new zero-insertion-force connector s... View full abstract»

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  • High-Density Board Fabrication Techniques

    Publication Year: 1982, Page(s):306 - 317
    Cited by:  Papers (4)  |  Patents (6)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1569 KB)

    A variety of construction methods can be used to form high-density printed-circuit boards. The electrical and mechanical requirements of a design strongly influence the choice of processes used to produce the finished product. The introduction of physically large high-density boards required the development of many new processes, several of which are critical to the electrical performance of the c... View full abstract»

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  • Development of Interconnection Technology for Large-Scale Integrated Circuits

    Publication Year: 1982, Page(s):318 - 327
    Cited by:  Papers (5)  |  Patents (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1009 KB)

    The size, cost, reliability, and serviceability of modern large data processing systems are influenced by the electrical interconnections required among the hundreds or thousands of chips they contain. The development of the complex interconnection design scheme is profoundly influenced by the interactions among the component and subassembly designs: modules, printed-circuit boards, cables, connec... View full abstract»

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  • Influence on LSI Package Wireability of Via Availability and Wiring Track Accessibility

    Publication Year: 1982, Page(s):328 - 341
    Cited by:  Papers (3)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1420 KB)

    In this paper, experiments are reported which use automatic global and line-packing wiring routines, supplemented by a restricted maze runner, to evaluate the overall influences of several important physical variables upon the wireability of several logic-circuit package types. The logic circuits are contained in subpackages (e.g., modules carrying chips), which are inserted, using pins, into the ... View full abstract»

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  • Lead Reduction Among Combinatorial Logic Circuits

    Publication Year: 1982, Page(s):342 - 348
    Cited by:  Papers (3)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (625 KB)

    The paper provides a description of the behavior of lead reduction among combinatorial logic circuits. Methods by which one may design the lead reduction architecture for modular packaging schemes are developed. The methods are then applied to the design of the lead reduction architecture of an integrated circuit chip and a nine-chip cell. View full abstract»

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  • Electrical Design of a High Speed Computer Package

    Publication Year: 1982, Page(s):349 - 361
    Cited by:  Papers (61)  |  Patents (37)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1416 KB)

    A methodology for optimizing the design of an electrical packaging system for a high speed computer is described. The pertinent parameters are first defined and their sensitivities are derived so that the proper design trade-offs can ultimately be made. From this procedure, a set of rules is generated for driving a computer aided design system. Finally, there is a discussion of design optimization... View full abstract»

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  • A VLSI Bipolar Metallization Design with Three-Level Wiring and Area Array Solder Connections

    Publication Year: 1982, Page(s):362 - 371
    Cited by:  Papers (11)  |  Patents (4)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1700 KB)

    The ability to interconnect large numbers of integrated silicon devices on a single chip has been greatly aided by a three-level wiring capability and large numbers of solderable input/output terminals on the face of the chip. This paper describes the design and process used to fabricate the interconnections on IBM's most advanced bipolar devices. Among the subjects discussed are thin film metallu... View full abstract»

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  • Optimization of Indium-Lead Alloys for Controlled Collapse Chip Connection Application

    Publication Year: 1982, Page(s):372 - 378
    Cited by:  Papers (15)  |  Patents (2)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1096 KB)

    Indium-lead solders are used for IBM controlled collapse chip connections (C-4s) to improve fatigue life in temperature cycling for large chip applications. Using 50% In-Pb alloy, which is expensive, has posed a number of manufacturing and reliability concerns. This paper presents the results of development studies leading to the use of a low-indium solder alloy for C-4 applications. This alloy ov... View full abstract»

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  • Immersion Wave Soldering Process

    Publication Year: 1982, Page(s):379 - 382
    Cited by:  Patents (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (389 KB)

    Immersion wave soldering is a new technique for soldering advanced printed circuit boards. In this process, an assembled and fixtured printed circuit board is immersed in a fluxing fluid and preheated to the soldering temperature. The fluxing fluid is glycerine activated with ethylenediamine tetra-acetic acid (EDTA). After preheating and while still immersed in the fluxing fluid, the fixtured boar... View full abstract»

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  • Recent Papers by IBM Authors

    Publication Year: 1982, Page(s):383 - 387
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (590 KB)

    Reprints of the papers listed here may usually be obtained by writing directly to the authors. The authors' IBM divisions or groups are identified as follows: CHQ is Corporate Headquarters; CPD, Communication Products Division; DSD, Data System Divsision; FED, Field Engineering Division; FSD, Federal Systems Division; GSD, General Systems Division; GTD, General Technology Division; IPD, Informatio... View full abstract»

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  • Recent IBM Patents

    Publication Year: 1982, Page(s):388 - 390
    IEEE is not the copyright holder of this material | PDF file iconPDF (340 KB)
    Freely Available from IEEE
  • Authors

    Publication Year: 1982, Page(s):391 - 395
    IEEE is not the copyright holder of this material | PDF file iconPDF (694 KB)
    Freely Available from IEEE
  • Errata [Erratum]

    Publication Year: 1982, Page(s): 396
    IEEE is not the copyright holder of this material | PDF file iconPDF (65 KB)
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The IBM Journal of Research and Development is a peer-reviewed technical journal, published bimonthly, which features the work of authors in the science, technology and engineering of information systems.

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Editor-in-Chief
Clifford A. Pickover
IBM T. J. Watson Research Center