By Topic

IBM Journal of Research and Development

Issue 5 • Sept. 1982

Filter Results

Displaying Results 1 - 15 of 15
  • Preface

    Publication Year: 1982, Page(s):526 - 527
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (176 KB)

    Semiconductor chips are similar to computer program modules in that they embody algorithms that are duplicated or mass-produced. The process of duplicating programs involves writing as many copies as required from one computer-readable medium into another. No matter how difficult an algorithm it embodies, any program module can be duplicated simply and correctly without further intellectual effort... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Semiconductor Manufacturing Technology at IBM

    Publication Year: 1982, Page(s):528 - 531
    Cited by:  Patents (12)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (316 KB)

    IBM's current semiconductor manufacturing processes are summarized. Briefly outlined are highlights of salient features of semiconductor manufacturing that established IBM leadership and direction for embarking on VLSI production. Some of these features are taken from papers already published; others are from articles in this issue of the IBM Journal of Research and Development ranging from silico... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Evolution and Accomplishments of VLSI Yield Management at IBM

    Publication Year: 1982, Page(s):532 - 545
    Cited by:  Papers (17)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1296 KB)

    The methods developed at IBM to manage and improve the yield of some of its newer FET semiconductor products are described. A number of visual inspection and electric monitoring techniques have evolved since discrete semiconductors were manufactured. The data obtained with these techniques are used in self-checking yield models to give the relative yields for all the yield components. The results ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Oxygen Incorporation and Precipitation in Czochralski-Grown Silicon

    Publication Year: 1982, Page(s):546 - 552
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (572 KB)

    Oxygen incorporation is examined for growth of large-diameter (80–130 mm) silicon single crystals by the Czochralski method. The primary growth parameters affecting the oxygen concentration in the crystals are shown to be the crystal-melt interface position within the hot zone and the rate of crucible rotation used. Tight control of the oxygen concentration [±1.5 parts per million at... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Metrology in Mask Manufacturing

    Publication Year: 1982, Page(s):553 - 560
    Cited by:  Patents (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (647 KB)

    A major source of registration failure in microlithography was found to be due to variations in optical field sizes defined by the dies, caused by unsatisfactory focus control. Two methods for determining variations in optical field sizes are described. Both allow measurements of selected registration errors with an uncertainty of ±0.01 µm (1σ) under manufacturing conditions u... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Feature Size Control in IC Manufacturing

    Publication Year: 1982, Page(s):561 - 567
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (536 KB)

    Until recently, the ever-increasing demand for higher device density in integrated-circuit (IC) designs has been satisfied mainly through device and circuit design ingenuity, increased chip size, and dimensional reduction. To keep pace with dimensional reduction, control of dimensional variations has assumed a more significant role. New IC designs are very dense and performance-oriented, requiring... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Electron-Beam Proximity Printing—A New High-Speed Lithography Method for Submicron Structures

    Publication Year: 1982, Page(s):568 - 579
    Cited by:  Patents (12)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1005 KB)

    A laboratory prototype of an electron-beam proximity printer is described which shadow-projects patterns of chip-size transmission masks onto wafers. Electron-beam transmission masks with physical holes at transparent areas have been fabricated with the smallest structures down to 0.3 µm. Experiments to replicate mask patterns were directed at demonstrating the applicability of this lithogr... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Optimization of Plasma Processing for Silicon-Gate FET Manufacturing Applications

    Publication Year: 1982, Page(s):580 - 589
    Cited by:  Papers (2)  |  Patents (7)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (802 KB)

    The development and implementation of plasma processing techniques for silicon-gate FET manufacturing applications is described. Process requirements are discussed for the stripping of photoresist and the isotropic etching of thin films. A systematic approach for the optimization of these processes, involving the use of statistically designed multiparametric experimentation (MPE), is presented. Th... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • The Mechanism of Single-Step Liftoff with Chlorobenzene in a Diazo-Type Resist

    Publication Year: 1982, Page(s):590 - 595
    Cited by:  Papers (8)  |  Patents (2)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (407 KB)

    The mechanism of the chlorobenzene single-step liftoff process is defined. The chlorobenzene penetrates to some depth into the resist film during the soaking cycle, extracting residual casting solvent and low-molecular-weight resin species. The chlorobenzene is subsequently removed by a rinse cycle. The penetrated layer of resist develops at a slower rate than the underlying bulk resist, producing... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Process Control of the Chlorobenzene Single-Step Liftoff Process with a Diazo-Type Resist

    Publication Year: 1982, Page(s):596 - 604
    Cited by:  Papers (2)  |  Patents (24)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (627 KB)

    Introduction of the single-step chlorobenzene liftoff process using a diazo-type resist to manufacturing lines produced problems not encountered during development and pilot-line work. Variances in the structure of the photoresist liftoff image are the result of complex interactions among exposure, chlorobenzene soaking, development, and post-application baking conditions. Effects produced by thes... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Semiconductor Final Test Logistics and Product Dispositioning Systems

    Publication Year: 1982, Page(s):605 - 612
    Cited by:  Papers (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (754 KB)

    As product lines at the IBM East Fishkill plant have expanded in the last few years, and as the number of technologies and semiconductor wafer and module volumes have increased, more sophisticated software systems were introduced which not only drove test times downward, but also reduced the development time previously required to accommodate testing new technologies. This paper discusses two such... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Quality and Reliability Assurance Systems in IBM Semiconductor Manufacturing

    Publication Year: 1982, Page(s):613 - 624
    Cited by:  Papers (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (916 KB)

    Soon after semiconductor manufacturing began it was realized that classical process control techniques were needed for the control of quality, reliability, and yield. The discovery and control of yield, quality, and reliability detractors have been pursued continually by IBM manufacturing engineers ever since, and the resulting evolution of process control techniques has grown into a highly discip... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Regenerative Simulation of Networks of Queues with General Service Times: Passage Through Subnetworks

    Publication Year: 1982, Page(s):625 - 633
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (698 KB)

    A linear “job stack,” an enumeration by service center and job class of all the jobs, is an appropriate state vector for simulation of closed networks of queues with priorities among job classes. Using a representation of the job stack process as an irreducible generalized semi-Markov process, we develop a regenerative simulation method for passage times in networks with general serv... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Recent papers by IBM authors

    Publication Year: 1982, Page(s):634 - 642
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (693 KB)

    Reprints of the papers listed here may usually be obtained by writing directly to the authors. The authors' IBM divisions or groups are identified as follows: CHQ is Corporate Headquarters; CPD, Communication Products Division: DSD, Data Systems Division; FED, Field Engineering Division; FSD, Federal Systems Division; GPD, General Products Division; GSD, General Systems Division; GTD, General Tech... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Recent IBM patents

    Publication Year: 1982, Page(s):643 - 644
    IEEE is not the copyright holder of this material | PDF file iconPDF (193 KB)
    Freely Available from IEEE

Aims & Scope

Meet Our Editors

Editor-in-Chief
Clifford A. Pickover
IBM T. J. Watson Research Center