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IBM Journal of Research and Development

Issue 1 • Date Jan. 1983

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Displaying Results 1 - 13 of 13
  • Preface

    Publication Year: 1983, Page(s):2 - 3
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (153 KB)

    In addition to semiconductor chip fabrication, the manufacturing of computer parts involves many disciplines which must be carefully controlled to produce the very complex components that make up a computing system. The editors of the IBM Journal of Research and Development were intrigued by the challenge of providing some insight into the technology that makes the present computer generation poss... View full abstract»

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  • Product Quality Level Monitoring and Control for Logic Chips and Modules

    Publication Year: 1983, Page(s):4 - 10
    Cited by:  Papers (7)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (493 KB)

    In the manufacture of chips and modules, it is important to minimize defects in order to maximize quality levels and product reliability at each level of product assembly (chips, module, card, system). These objectives are best achieved by controlling defects through manufacturing process controls and testing at the lowest possible level of assembly. Defective product remaining after test and insp... View full abstract»

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  • Multi-Layer Ceramics Manufacturing

    Publication Year: 1983, Page(s):11 - 19
    Cited by:  Papers (5)  |  Patents (5)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (887 KB)

    Multi-layer ceramics (MLC) is an advanced packaging technology developed by IBM and used in the IBM 4300 and IBM 3081 processor models to significantly improve the module circuit density, reliability, and performance over those of previous packages. A key element in this package is the MLC substrate, which is capable of supporting more than 100 semiconductor chips in some design uses. The MLC manu... View full abstract»

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  • Precise Numerical Control for the Thermal Conduction Module

    Publication Year: 1983, Page(s):20 - 26
    Cited by:  Papers (3)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (575 KB)

    Automated manufacturing processes have been developed and put into practice for the high-volume production of the thermal conduction module, the high-density circuit package used in the IBM 3081 processor models. The very precise work required on the ceramic surface required the solution of many problems. The small but significant residual distortions (warpage) which resulted from firing the multi... View full abstract»

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  • Multi-Chip Module Test and Diagnostic Methodology

    Publication Year: 1983, Page(s):27 - 34
    Cited by:  Papers (6)  |  Patents (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (664 KB)

    The development of a manufacturing test and diagnostic methodology for multi-chip modules as used in the IBM 4300 processor models involves determining the most attractive compromise among a number of conflicting factors: a) high test coverage, b) high diagnostic resolution, c) test generation, d) test equipment, and e) test application and diagnosis. This paper describes a set of solutions which ... View full abstract»

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  • The LT1280 for Through-the-Pins Testing of the Thermal Conduction Module

    Publication Year: 1983, Page(s):35 - 40
    Cited by:  Papers (1)  |  Patents (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (521 KB)

    Testing the thermal conduction module (TCM), the high-density field-replaceable unit (FRU) used in the IBM 3081 processor models, and diagnosing the faults encountered to a minimal repairable set of entities posed a new problem for the IBM engineers. The requirement and the economic necessity of thoroughly exercising the entire TCM logic and random access memory (RAM) array structure through the i... View full abstract»

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  • Failure Diagnosis on the LT1280

    Publication Year: 1983, Page(s):41 - 49
    Cited by:  Papers (2)  |  Patents (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (718 KB)

    The high-density circuitry and I/O pin population of the thermal conduction module (TCM), the VLSI package used in the IBM 3081 processor models, dictates that there be a precise and cost-effective method of detecting and diagnosing TCM defects. This paper describes the challenge faced in testing the logic and random access memories of the TCM and the diagnostic approach used in the LT1280 test sy... View full abstract»

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  • Computer-Controlled Optical Testing of High-Density Printed-Circuit Boards

    Publication Year: 1983, Page(s):50 - 58
    Cited by:  Papers (2)  |  Patents (8)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (781 KB)

    The increased densities of multi-layer printed-circuit boards have required development of unique approaches to product testing. An optical automatic inspection system developed to test interplanes of the printed-circuit board used in the IBM 3081 processor (TCM board) is described. This system scans the features of the product and locates surface defects of 25.4 µm (1 mil) or larger throug... View full abstract»

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  • A Model for the Prediction of Assembly, Rework, and Test Yields

    Publication Year: 1983, Page(s):59 - 67
    Cited by:  Papers (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (715 KB)

    The increase in density and complexity of computer components used as field-replaceable units of the IBM 3081 processors has required more sophisticated and capital-intense manufacturing and test lines than heretofore seen. To help in the manufacturing planning effort, a simulation model based on the concepts described in this paper was implemented as a means for studying the behavior of different... View full abstract»

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  • Technologies for Network Architecture and Implementation

    Publication Year: 1983, Page(s):68 - 78
    Cited by:  Papers (5)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (911 KB)

    Systems Network Architecture (SNA) provides a framework for constructing networks of distributed processors and terminals. This paper discusses some of the fundamental properties of network architectures such as SNA, and the evolution of formal descriptive methods that provide precise, complete definitions of the architecture. This has culminated in the development of a programming language, Forma... View full abstract»

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  • Recent papers by IBM authors

    Publication Year: 1983, Page(s):79 - 85
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (655 KB)

    Reprints of the papers listed here may usually be obtained by writing directly to the authors. The authors' IBM divisions or groups are identified as follows: CHQ is Corporate Headquarters; CPD, Communication Products Division; DSD, Data Systems Division; FED, Field Engineering Division; FSD, Federal Systems Division; GPD, General Products Division; GSD, General Systems Division; GTD, General Tech... View full abstract»

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  • Recent IBM patents

    Publication Year: 1983, Page(s):86 - 88
    IEEE is not the copyright holder of this material | PDF file iconPDF (207 KB)
    Freely Available from IEEE
  • IBM Journal of Research and Development: Information for Authors

    Publication Year: 1983, Page(s):89 - 92
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (281 KB)

    This paper combines background information about the IBM Journal of Research and Development with guidelines for the preparation of Journal manuscripts. The purpose is to acquaint authors with the Journal as a primary, professional publication and to present suggestions to ease the work of author and editor in preparing clear, concise, and useful manuscripts. View full abstract»

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Aims & Scope

The IBM Journal of Research and Development is a peer-reviewed technical journal, published bimonthly, which features the work of authors in the science, technology and engineering of information systems.

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Meet Our Editors

Editor-in-Chief
Clifford A. Pickover
IBM T. J. Watson Research Center