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IBM Journal of Research and Development

Issue 3 • Date May 1991

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Displaying Results 1 - 13 of 13
  • Preface

    Publication Year: 1991 , Page(s): 306
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (150 KB)  

    IBM recently announced the IBM System/390™ processors known as the Enterprise Systed9000™ (ES/9000™)—a single family of air- and water-cooled processors. ES/9000 is upward compatible with Systed370™ systems, and offers additional function and new architecture support through the Enterprise Systems Architecture/390.™ View full abstract»

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  • The IBM Enterprise System/9000 Type 9121 air-cooled processor

    Publication Year: 1991 , Page(s): 307 - 312
    Cited by:  Papers (1)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (492 KB)  

    The IBM Enterprise System/9000™ Type 9121 air-cooled processor achieves, with the same or reduced physical floor space and power levels, a performance level equal to or greater than those of previous IBM processors. This performance level was attained by a combination of design innovations: a new air-cooled thermal conduction module (TCM), integration of bipolar and CMOS technology in this TCM, the design and implementation of a differential current switch bipolar circuit family, integrated programmable memory subsystem design, and extensive use of VLSI technology. The result of these innovations was a 15-ns-cycle air-cooled machine. The salient features and an overview of the machine design are presented. View full abstract»

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  • Differential current switch—High performance at low power

    Publication Year: 1991 , Page(s): 313 - 320
    Cited by:  Papers (2)  |  Patents (13)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (620 KB)  

    The recent IBM System/390™ announcement includes six high-performance air-cooled models that use a low-power variation of emitter-coupled logic (ECL). This new logic family, called differential current switch (DCS), uses differential signal pairs to represent logic signals, and combines two-level cascode logic with dotting to implement a complete set of logic circuits. These DCS circuits are described in detail, and the relative value of the DCS and ECL logic families is discussed extensively. View full abstract»

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  • A 128Kb CMOS static random-access memory

    Publication Year: 1991 , Page(s): 321 - 329
    Cited by:  Papers (1)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (750 KB)  

    This paper describes an all-CMOS 128Kb static random-access memory (SRAM) with emitter-coupled-logic (ECL) I/O compatibility which was designed for the air-cooled Enterprise System/9000™ processors. Access time of 6.5 ns is achieved using 0.5-µm channel length and 1.0-µm minimum geometry. Pipelining and self-resetting circuit techniques permit the chip to operate with cycle time less than access time. To achieve the high-reliability requirement in the TCM environment, a novel technique utilizing a sacrificial substrate is used to “burn in” chips prior to their attachment to the TCM. View full abstract»

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  • IBM System/390 air-cooled alumina thermal conduction module

    Publication Year: 1991 , Page(s): 330 - 341
    Cited by:  Papers (11)  |  Patents (2)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (1047 KB)  

    Advances in multilayer ceramic (MLC) processing, the use of thin-film metallurgy wiring, and enhancements in thermal dissipation, all described in this paper, represent significant milestones in the evolution of microelectronic packaging technology. The IBM System/390™ air-cooled alumina thermal conduction module (S/390™ alumina TCM) utilizes a 127.5 × 127.5-mm MLC substrate to interconnect as many as 121 VLSI devices and 144 substrate-mounted decoupling capacitors. The substrate provides an array of 648 pads for solder connections to each device, an array of 16 pads for solder connections to each capacitor, and an array of 2772 pins for interconnection with the next package level, and contains approximately 400 m of wiring. The reduced thermal resistance design permits up to 600 W of air-cooling capacity. This paper describes the S/390 alumina TCM fabrication processes and discusses the advances they represent in processing technology, packaging density, and performance. Comparisons to prior technology are made. View full abstract»

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  • IBM Enterprise System/9000 Type 9121 Model 320 air-cooled processor technology

    Publication Year: 1991 , Page(s): 342 - 351
    Cited by:  Papers (4)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (1016 KB)  

    The basic component of the new IBM Enterprise System/9000™ Type 9121 Model 320 processor is an air-cooled thermal conduction module (TCM). The fabrication of this module required the integration of new bipolar chips, CMOS SRAM chips, and ECL and DCS logic circuitry in a TCM that could dissipate heat by means of air cooling. The method and details of this process of integration are described and discussed. View full abstract»

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  • An adder design optimized for DCS logic

    Publication Year: 1991 , Page(s): 352 - 356
    Cited by:  Papers (1)  |  Patents (1)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (394 KB)  

    The basic DCS logic gate provides a two-way SELECT function and, with modifications, a two-way XOR, OR, or AND function. Furthermore, outputs of DCS gates can be wired together (dotted) to perform dotted SELECT, XOR, OR, or AND functions. The versatility of this logic is illustrated in the design of a carry-lookahead adder. View full abstract»

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  • IBM Enterprise System/9000 Type 9121 system controller and memory subsystem design

    Publication Year: 1991 , Page(s): 357 - 366
    Cited by:  Patents (3)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (832 KB)  

    A system controller supporting two processors, two independent memory banks, and a channel subsystem has been implemented within a single air-cooled thermal conduction module for the IBM Enterprise System/9000™ Type 9121 processors. Improvements in technology densities, usage of CMOS and emitter-coupled logic on the same substrate, and innovations in the system controller design were required to achieve the one-module objective. In addition, system reliability is improved with a storage key error-correction code, and storage allocation options are increased with a combined main/expanded store design. In conjunction with the system controller development, a new memory subsystem has been designed for the 9121 system. Innovative large-system memory packaging techniques and functional changes in the data accessing methods have culminated in a memory board which supports up to one-gigabyte system storage. View full abstract»

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  • Design and performance of the IBM Enterprise System/9000 Type 9121 Vector Facility

    Publication Year: 1991 , Page(s): 367 - 381
    Cited by:  Papers (10)  |  Patents (1)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (1150 KB)  

    The design of the IBM Enterprise System/9000™ Type 9121 Vector Facility is described and its performance is evaluated in this paper. The Vector Facility design adheres to the architecture developed for the 3090™ vector facilities. The original design objectives and associated architecture are reviewed. Vector operations and design details are discussed, and specific performance results are shown. View full abstract»

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  • Two approaches to array fault tolerance in the IBM Enterprise System/9000 Type 9121 processor

    Publication Year: 1991 , Page(s): 382 - 389
    Cited by:  Papers (4)  |  Patents (2)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (614 KB)  

    The system design of the IBM Enterprise System/9000™ Type 9121 processor was intended to provide high performance and dense packaging within an air-cooled system. Packaging and technology factors had a major influence on the fault-tolerance strategies chosen. This paper describes the effect that this design point had on the fault-tolerant capabilities of two critical 9121 array applications. Although the design challenges faced by these array applications initially appeared to be very similar, the resulting solutions represent very different designs with differing fault-tolerance capabilities. The rationale for these approaches is given, and the error-correction algorithms are described. View full abstract»

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  • Enhanced self-test techniques for VLSI systems applied to the IBM Enterprise System/9000 Type 9121 processor

    Publication Year: 1991 , Page(s): 390 - 399
    Cited by:  Papers (3)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (827 KB)  

    This paper discusses the problems associated with obtaining adequate test coverage from random self-test for thermal conduction modules (TCMs) in the air-cooled IBM Enterprise System/9000™ Type 9121 processors. Each 9121 TCM contains approximately a quarter of a million circuits. The present complexity of the TCMs made previous testing methods such as chip-in-place (CIP) testing inviable. The solution was to apply self-test techniques to the 9121 TCMs during the manufacturing process. Analytical and simulation techniques were used to predict the random-pattern testability of the TCMs. The results of the self-test process for the five distinct 9121 processor TCMs are presented. Methods of identifying and modifying random-pattern-resistant logic structures are discussed. It is also proposed that a hybrid approach combining random self-test with deterministic test generation can be used to enhance testability. View full abstract»

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  • Recent publications by IBM authors

    Publication Year: 1991 , Page(s): 400 - 440
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (3256 KB)  

    The information listed here is supplied by the Institute for Scientific Information and other outside sources. Reprints of the papers may be obtained by writing directly to the first author cited. Journals are listed alphabetically by title; papers are listed sequentially for each journal. View full abstract»

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  • Recent IBM patents

    Publication Year: 1991 , Page(s): 441 - 456
    Save to Project icon | PDF file iconPDF (1039 KB)  
    Freely Available from IEEE

Aims & Scope

The IBM Journal of Research and Development is a peer-reviewed technical journal, published bimonthly, which features the work of authors in the science, technology and engineering of information systems.

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Meet Our Editors

Editor-in-Chief
Clifford A. Pickover
IBM T. J. Watson Research Center