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IBM Journal of Research and Development

Issue 5 • Date Sept. 1993

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Displaying Results 1 - 10 of 10
  • Preface

    Publication Year: 1993, Page(s):582 - 583
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (185 KB)

    Pin-in-hole technology (ceramic electronic-circuit-chip carriers with pins that are inserted into the plated through holes of epoxy-glass printed circuit cards) dominated IBM subsystem-assembly technology through the 1960s and 1970s. The 1980s saw the emergence of surface mount technology (SMT), peripherally leaded components mounted on the surface of printed circuit cards. SMT no longer required ... View full abstract»

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  • Editor's note

    Publication Year: 1993, Page(s): 584
    IEEE is not the copyright holder of this material | PDF file iconPDF (59 KB)
    Freely Available from IEEE
  • Finite element analysis for Solder Ball Connect (SBC) structural design optimization

    Publication Year: 1993, Page(s):585 - 596
    Cited by:  Papers (33)  |  Patents (4)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1029 KB)

    Solder Ball Connect (SBC) is a second-level surface mount electronics packaging technology in which ceramic modules containing one or more chips are joined to a circuit card (FR-4) by means of an array of nonhomogeneous solder columns. These columns consist of a high-temperature-melting 90%Pb/10%Sn solder sphere attached to the module and card with eutectic solder fillets. The solder structures ac... View full abstract»

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  • Attachment of Solder Ball Connect (SBC) packages to circuit cards

    Publication Year: 1993, Page(s):597 - 608
    Cited by:  Papers (9)  |  Patents (2)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1082 KB)

    IBM has developed an assembly process to attach a new family of Solder Ball Connect (SBC) integrated circuit packages to glass/epoxy cards using surface mount technology (SMT). The process provides nearly perfect yields for the resulting solder ball joint structures and ensures reliability by controlling wear-out due to metallurgical fatigue. The package, card, and process parameters found to most... View full abstract»

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  • Thermal modeling of the infrared reflow process for Solder Ball Connect (SBC)

    Publication Year: 1993, Page(s):609 - 620
    Cited by:  Papers (2)  |  Patents (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1182 KB)

    A thermal model of the infrared reflow process has been developed for an FR-4 card populated with an array of Solder Ball Connect (SBC) modules. The analysis of the three-dimensional, transient, finite element model accounts for radiative exchange within the infrared oven and for the heat conduction (nonisotropic) within the modules and card. Transient temperature profiles of selected points and t... View full abstract»

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  • Thermal-mechanical strain characterization for printed wiring boards

    Publication Year: 1993, Page(s):621 - 634
    Cited by:  Papers (15)  |  Patents (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1166 KB)

    Multilayer printed wiring boards are widely used in electronic packaging assemblies. One critical reliability concern is the thermal-mechanical strains induced by temperature change. For example, the in-plane strain affects the thermal fatigue life of surface mount solder interconnections, while the out-of-plane strain affects the mechanical integrity of the plated-through holes of the printed wir... View full abstract»

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  • Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation

    Publication Year: 1993, Page(s):635 - 648
    Cited by:  Papers (41)  |  Patents (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1433 KB)

    Thermal deformations that result from mismatches of coefficients of thermal expansion (CTE) in Solder Ball Connect (SBC) assemblies were investigated. The CTE mismatches of the materials and the components in the package have both macro and micro effects on the strain distributions in the SBC interconnections. The geometry of the SBC joint also has a strong influence on the solder strains in the S... View full abstract»

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  • Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations

    Publication Year: 1993, Page(s):649 - 659
    Cited by:  Papers (2)  |  Patents (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1125 KB)

    A novel approach to processing interferometric moiré images, called computational Fourier transform moiré, has been developed. The essential principle of this technique is to automatically calculate a whole-field strain from digitized images of interferometric moiré fringes using digital Fourier transform procedures. With the use of this technique, a whole-field strain distrib... View full abstract»

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  • Recent publications by IBM authors

    Publication Year: 1993, Page(s):661 - 674
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (1200 KB)

    The information listed here is supplied by the Institute for Scientific Information and other outside sources. Reprints of the papers may be obtained by writing directly to the first author cited. Information on books may be obtained by writing to the publisher. Journals and boob are listed alphabetically by title; papers are listed sequentially for each journal. View full abstract»

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  • Recent IBM patents

    Publication Year: 1993, Page(s):675 - 676
    IEEE is not the copyright holder of this material | PDF file iconPDF (163 KB)
    Freely Available from IEEE

Aims & Scope

The IBM Journal of Research and Development is a peer-reviewed technical journal, published bimonthly, which features the work of authors in the science, technology and engineering of information systems.

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Meet Our Editors

Editor-in-Chief
Clifford A. Pickover
IBM T. J. Watson Research Center