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IBM Journal of Research and Development

Issue 4 • Date July 1994

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Displaying Results 1 - 11 of 11
  • Preface

    Publication Year: 1994 , Page(s): 346
    Click to expandAbstract | PDF file iconPDF (122 KB)  

    Adhesion between similar or dissimilar materials is of vital importance to IBM in the manufacture of products such as multilayer electronic devices and integrated circuits, printed circuit boards, and magnetic head and disk assemblies. For products to function reliably and reproducibly, ways must be devised to understand and tailor the requisite adhesion strengths between materials. View full abstract»

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  • Atomic-scale metal adhesion investigated by scanning tunneling microscopy

    Publication Year: 1994 , Page(s): 347 - 366
    Click to expandAbstract | PDF file iconPDF (1803 KB)  

    The interaction of a sharply pointed metal tip with a metal surface is investigated both theoretically and experimentally. By resorting to an effective potential approach, the characteristics of tip-sample forces are analyzed systematically in terms of known theory of bulk metal adhesion. Experiments probing the short-range adhesion interaction by means of a combination of force gradient sensing w... View full abstract»

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  • Fracture mechanics for thin-film adhesion

    Publication Year: 1994 , Page(s): 367 - 377
    Cited by:  Papers (1)
    Click to expandAbstract | PDF file iconPDF (1104 KB)  

    The essential elements of the mechanics of delamination are reviewed and their implications for design are discussed. Two important concepts for the prediction of the reliability of thin-film systems are emphasized: 1) limiting solutions for the crack-driving force that are independent of flaw size, and 2) “mixed-mode fracture.” Consideration of the first concept highlights the possi... View full abstract»

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  • Adhesion between polymers

    Publication Year: 1994 , Page(s): 379 - 389
    Click to expandAbstract | PDF file iconPDF (929 KB)  

    This paper is concerned with recent work that relates to the adhesion between nonreacting polymers. Advances in the under- standing of cracks at bimaterial interfaces are considered, with particular emphasis on their implications in the interpretation of adhesion tests. An interpretation of the peel and blister tests is then discussed. Consideration is given to mechanisms of polymer failure as the... View full abstract»

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  • Studies of adhesion by secondary ion mass spectrometry

    Publication Year: 1994 , Page(s): 391 - 411
    Cited by:  Papers (1)
    Click to expandAbstract | PDF file iconPDF (2046 KB)  

    The study of adhesion requires the characterization of surfaces and interfaces. One surface analytical technique which has been used extensively in the study of adhesion is secondary ion mass spectrometry (SIMS). This paper provides a brief introduction to the basis of this technique and describes the two broad categories of SIMS analyses: static and dynamic. A complete literature review of the ap... View full abstract»

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  • Thin film bonding using ion beam techniques—A review

    Publication Year: 1994 , Page(s): 413 - 422
    Click to expandAbstract | PDF file iconPDF (877 KB)  

    Ion beam technologies provide a variety of well-proven means for creating or enhancing strong, stable, direct adhesion of thin films deposited on substrates. Interface chemical bonding and structure are critical. Yet success with such approaches has been reported for a great variety of systems that have little or no bulk chemical affinity, including metals, polymers, ceramics, and semiconductors. ... View full abstract»

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  • Plasma modification of polymer surfaces for adhesion improvement

    Publication Year: 1994 , Page(s): 423 - 439
    Cited by:  Papers (6)  |  Patents (10)
    Click to expandAbstract | PDF file iconPDF (1433 KB)  

    Polymers have wide-ranging applications in food packaging and decorative products, and as insulation for electronic devices. For these applications, the adhesion of materials deposited onto polymer substrates is of primary importance. Not all polymer surfaces possess the required physical and/or chemical properties for good adhesion. Plasma treatment is one means of modifying polymer surfaces to i... View full abstract»

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  • Tailoring the surface morphology of polyimide for improved adhesion

    Publication Year: 1994 , Page(s): 441 - 456
    Cited by:  Patents (2)
    Click to expandAbstract | PDF file iconPDF (1483 KB)  

    Semiflexible polyimide structures are not amenable to good adhesion because of their a) spontaneous orientation of the polymer chains parallel to the film substrate during curing, b) formation of an ordered skin, and c) smooth surface topography. We briefly discuss these structural features with regard to metal-on-polyimide (metal/Pl) adhesion. A method is proposed to improve adhesion by tailoring... View full abstract»

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  • Wet-process surface modification of dielectric polymers: Adhesion enhancement and metallization

    Publication Year: 1994 , Page(s): 457 - 474
    Cited by:  Papers (3)
    Click to expandAbstract | PDF file iconPDF (1393 KB)  

    For many electronic applications, the surface of a dielectric polymer must be modified to obtain the desired surface properties, such as wetting, adhesion, and moisture barrier, without altering the bulk properties. This paper reviews wet- process modifications of dielectric polymer surfaces and also presents unpublished results related to fluorinated polyimides. In a typical wet process, a substr... View full abstract»

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  • Recent publications by IBM authors

    Publication Year: 1994 , Page(s): 475 - 486
    Click to expandAbstract | PDF file iconPDF (902 KB)  

    The information listed here is supplied by the Institute for Scientific Information and other outside sources. Complete addresses are provided for the lead author of each publication. Journals and books are listed alphabetically by title; papers are listed sequentially for each journal. View full abstract»

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  • Recent IBM patents

    Publication Year: 1994 , Page(s): 487 - 488
    PDF file iconPDF (172 KB)  
    Freely Available from IEEE

Aims & Scope

The IBM Journal of Research and Development is a peer-reviewed technical journal, published bimonthly, which features the work of authors in the science, technology and engineering of information systems.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
Clifford A. Pickover
IBM T. J. Watson Research Center