Issue 6 • Date Nov. 2008
Filter Results
Displaying Results 1 - 12 of 12
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Three-dimensional silicon integration
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PDF (1461 KB)
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Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
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PDF (996 KB)
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Wafer-level 3D integration technology
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PDF (420 KB)
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3D chip stacking with C4 technology
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PDF (1198 KB)
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3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
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PDF (1050 KB)
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Through-silicon vias enable next-generation SiGe power amplifiers for wireless communications
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PDF (1262 KB)
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Author index for papers in Volume 52
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PDF (77 KB)
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Subject index for papers in Volume 52
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PDF (60 KB)
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Errata [Erratum]
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PDF (46 KB)
Aims & Scope
The IBM Journal of Research and Development is a peer-reviewed technical journal, published bimonthly, which features the work of authors in the science, technology and engineering of information systems.
Meet Our Editors
Editor-in-Chief
John J. Ritsko
IBM T. J. Watson Research Center


