Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Date 7-11 May 2008
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Displaying Results 1 - 25 of 141
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[Front cover]
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PDF (89 KB)
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[Copyright notice]
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PDF (45 KB)
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Contents
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PDF (51 KB)
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Committees
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PDF (97 KB)
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Authors index
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PDF (36 KB)
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The blocking leakage current of packaged silicon devices after their storage at 250 °C ambient temperature
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PDF (3453 KB)
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Influence of production technology to reliability of interconnections in the LTCC modules
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PDF (257 KB)
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Life-time of lead-free soldered SMT joints
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PDF (617 KB)
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Noise sources of p-type CdTe single crystal
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PDF (200 KB)
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Relaxation time in CdTe single crystals
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PDF (3220 KB)
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Intermetallic compound growth in lead free solder joints on Ag-based thick film coductors
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PDF (1357 KB)
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Influence of mechanical stress and temperature aging on a change of electrical connection resistance
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PDF (1222 KB)
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Predictive reliability and prognostics for electronic components: Current capabilities and future challenges
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PDF (478 KB)
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Thick film resistor testing by electro — Ultrasonic spectroscopy with DC electric signal
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PDF (236 KB)
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New mixed rules
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PDF (407 KB)
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