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IEEE Transactions on Electronics Packaging Manufacturing

Issue 3 • Date July 2009

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Displaying Results 1 - 18 of 18
  • Table of contents

    Publication Year: 2009, Page(s): C1
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  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2009, Page(s): C2
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  • Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device

    Publication Year: 2009, Page(s):125 - 132
    Cited by:  Papers (10)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1952 KB) | HTML iconHTML

    In this paper, a wafer-level package with simultaneous through silicon via (TSV) connection and cavity hermetic sealing by low-temperature solder bonding for microelectromechanical system (MEMS) device such as resonator is presented. Wet etching technique combined with dry etching technique is utilized to achieve a ldquoY-shapedrdquo through wafer interconnection structure to shorten the TSV in or... View full abstract»

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  • Modeling of the Fluid Volume Transferred in Contact Dispensing Processes

    Publication Year: 2009, Page(s):133 - 137
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (193 KB) | HTML iconHTML

    In the contact dispensing process, the contact of the fluid with the target board is essentially needed in order to transfer a certain volume of fluid to the board. Due to the action of surface tension, part of the fluid extruded from the needle hangs on the needle after the process, and this causes the difference between the fluid volume extruded and the one transferred to the board. This differe... View full abstract»

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  • Simplified Measuring Method of Copper Concentration in Solder Bath Utilizing Copper Dissolution

    Publication Year: 2009, Page(s):138 - 143
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (822 KB) | HTML iconHTML

    In lead-free soldering on printed circuit boards (PCBs), the dissolution and disappearance of PCB copper electrodes in solder bath has been a problem for the dip soldering method, such as wave soldering, in which PCBs are dipped in molten solder. In the former report, it has been estimated the influence of solder composition, temperature, and flowing velocity on the dissolution of copper electrode... View full abstract»

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  • A 5-Gbps Test System for Wafer-Level Packaged Devices

    Publication Year: 2009, Page(s):144 - 151
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1885 KB) | HTML iconHTML

    This paper describes an economical approach to high-speed testing of wafer-level packaged logic devices. The solution assumes that the devices have built-in self-test features, thereby reducing the complexity of external test instrumentation required. A stand-alone miniature tester is connected to the top of a wafer probe card, transmitting and receiving multiple high-speed (2-5 Gbps) signals. To ... View full abstract»

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  • Fabrication of Molded Interconnection Devices by Ultrasonic Hot Embossing on Thin Polymer Films

    Publication Year: 2009, Page(s):152 - 156
    Cited by:  Papers (6)  |  Patents (52)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (764 KB) | HTML iconHTML

    Ultrasonic hot embossing allows fabrication of metal patterns onto a polymer film with a low cost and rapid process. A polymer layer with a thin metal film on top is welded onto the polymer substrate where there are protruding micro structures on the tool. Edges around the protruding structures cut the metal layer and ensure electrical insulation. The entire process performs in a few seconds. The ... View full abstract»

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  • Concurrent Optimization of Crescent Bond Pull Force and Tail Breaking Force in a Thermosonic Cu Wire Bonding Process

    Publication Year: 2009, Page(s):157 - 163
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1933 KB) | HTML iconHTML

    In conventional wire bonding process optimization, the crescent bond is tested by destructive pulling the loop and measure the pull force (PF) required to break the bond. While this method assures the final quality, it does not necessarily minimize production stoppages which can reduce throughput significantly. Many stoppages are caused by short-tail and tail-lift errors which in turn are caused b... View full abstract»

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  • Design for Environment: An Environmentally Conscious Analysis Model for Modular Design

    Publication Year: 2009, Page(s):164 - 175
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (603 KB) | HTML iconHTML

    Nowadays, more and more manufacturing enterprises are working hard to improve the environmental performance of their products. Pollution may be generated through the life cycle of a product. To maximally improve a product's overall environmental performance and reduce potential environmental impacts, Design for the Environment can be used as early as the design stage for the product. For electrome... View full abstract»

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  • Low-Stress Thermosonic Copper Ball Bonding

    Publication Year: 2009, Page(s):176 - 184
    Cited by:  Papers (13)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1132 KB) | HTML iconHTML

    Thermosonic ball bonding processes on test chips with Al metallized bonding pads are optimized with one Au and two Cu wire types, all 25 mum diameter, obtaining average shear strengths of more than 120 MPa. The process temperature is ~110degC. Ball bonds made with Cu wire show at least 15% higher shear strength than those made with Au wire. The estimated maximum shear strength cpk value... View full abstract»

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  • An Effective Scheduling Approach for Maximizing Polyimide Printing Weighted Throughput in Cell Assembly Factories

    Publication Year: 2009, Page(s):185 - 197
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (783 KB) | HTML iconHTML

    Polyimide printing (PI) is an important process operation but also often the cause of bottlenecks in capital-intensive cell assembly factories. Therefore, the development of an effective scheduling method to maximize throughput in this PI process is essential and difficult. In the polyimide printing scheduling problem (PISP), jobs are given weights and clustered by their product types, which must ... View full abstract»

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  • Statistical Approach for Cycle Time Estimation in Semiconductor Packaging Factories

    Publication Year: 2009, Page(s):198 - 205
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (738 KB) | HTML iconHTML

    In the semiconductor industry, to enhance customer satisfactions and ability of quick responses, the development of cycle time estimation model is very important. Cycle time estimation is an essential planning basis, which has many applications, especially on the analyses of performance indexes, capacity planning, and the assignments of due dates. In this paper, we provide a statistical approach f... View full abstract»

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  • Table of contents

    Publication Year: 2009, Page(s):206 - 208
    Request permission for commercial reuse | PDF file iconPDF (76 KB)
    Freely Available from IEEE
  • Table of contents

    Publication Year: 2009, Page(s):209 - 210
    Request permission for commercial reuse | PDF file iconPDF (52 KB)
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  • IEEE Foundation [advertisement]

    Publication Year: 2009, Page(s): 211
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    Publication Year: 2009, Page(s): 212
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  • IEEE Components, Packaging, and Manufacturing Technology Society information for authors

    Publication Year: 2009, Page(s): C3
    Request permission for commercial reuse | PDF file iconPDF (34 KB)
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2009, Page(s): C4
    Request permission for commercial reuse | PDF file iconPDF (32 KB)
    Freely Available from IEEE

Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University