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Proceedings of the IEEE

Issue 12 • Dec 1992

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Displaying Results 1 - 7 of 7
  • Polymer dielectrics for multichip module packaging

    Publication Year: 1992, Page(s):1942 - 1954
    Cited by:  Papers (28)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (888 KB)

    The polymer dielectrics used to fabricate multichip modules are discussed. Numerous relevant properties of the dielectrics are compared and contrasted. It is shown that the suitability of a specific material is highly dependent on the process chosen to fabricate the structure and the intended application of the module. The material properties of the polymer dielectric must be taken into account wh... View full abstract»

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  • Nonintrusive appliance load monitoring

    Publication Year: 1992, Page(s):1870 - 1891
    Cited by:  Papers (589)  |  Patents (63)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1868 KB)

    A nonintrusive appliance load monitor that determines the energy consumption of individual appliances turning on and off in an electric load, based on detailed analysis of the current and voltage of the total load, as measured at the interface to the power source is described. The theory and current practice of nonintrusive appliance load monitoring are discussed, including goals, applications, lo... View full abstract»

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  • High-yield assembly of multichip modules through known-good IC's and effective test strategies

    Publication Year: 1992, Page(s):1965 - 1994
    Cited by:  Papers (54)  |  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3740 KB)

    Multichip module technology has been shown to offer significant improvements for electronics equipment in the areas of miniaturized size, reduced weight, capability for higher frequency operation, improved thermal performance, and improved reliability. Production applications for multichip modules (MCMs) have grown from high-end computer and aerospace modules to include such diverse products as te... View full abstract»

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  • Multichip packaging-a tutorial

    Publication Year: 1992, Page(s):1924 - 1941
    Cited by:  Papers (41)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1596 KB)

    Several aspects of the multichip module technology, including its functions, leverages, applications, and markets, are reviewed. All the packaging technologies used in multichip, such as sealing and encapsulation, heat removal, chip level connections, thin film, ceramic, and printed wiring, are discussed. The module corrections and electrical testing used in forming a high-performance or portable ... View full abstract»

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  • Design of multichip modules

    Publication Year: 1992, Page(s):1955 - 1964
    Cited by:  Papers (19)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (912 KB)

    The process and pitfalls of multichip module (MCM) design, including the constraints, tradeoffs, figures of merit, and considerations which make MCM design a unique interdisciplinary challenge are discussed. The MCM must provide the proper operating environment for the chips it contains. It must also fit the constraints of the system in which it is contained. It must be manufacturable, testable, a... View full abstract»

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  • Order statistics in digital image processing

    Publication Year: 1992, Page(s):1893 - 1921
    Cited by:  Papers (255)  |  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2828 KB)

    A family of nonlinear filters based on order statistics is presented. A mathematical tool derived through robust estimation theory, order statistics has allowed engineers to develop nonlinear filters with excellent robustness properties. These filters are well suited to digital image processing because they preserve the edges and the fine details of an image much better than conventional linear fi... View full abstract»

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  • Crisis in technology: the questionable US ability to manufacture thin-film multichip modules

    Publication Year: 1992, Page(s):1995 - 2002
    Cited by:  Papers (7)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (640 KB)

    It is argued that even though the technology choices are available, the ability to procure deposited multichip modules (MCM-D) in the US is seriously threatened by the inability to obtain volume orders. The result is the withdrawal of capital at just the time when the capabilities are more and more certain. The future capability in the necessary thin-film multichip module technology may not exist ... View full abstract»

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