Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
Issue 3 • Date May 1997
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Displaying Results 1 - 25 of 244
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Approach for a three-dimensional on-chip quantification by secondary-ion mass spectrometry analysis
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PDF (670 KB)
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Effects of oxygen flooding on sputtering and ionization processes during ion bombardment
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PDF (127 KB)
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Optimized time-of-flight secondary ion mass spectroscopy depth profiling with a dual beam technique
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PDF (95 KB)
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Nondestructive depth profiling in Auger electron spectroscopy by means of partial intensity analysis
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PDF (113 KB)
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Growth and characterization of aluminum oxide thin films for evaluation as reference materials
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PDF (369 KB)
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Factors causing deterioration of depth resolution in Auger electron spectroscopy depth profiling of multilayered systems
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PDF (427 KB)
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X-ray photoelectron spectroscopy study of the chemical interaction between BN and Ti/TiN
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PDF (280 KB)
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Metal overlayers on organic functional groups of self-organized molecular assemblies: VII. Ion scattering spectroscopy and x-ray photoelectron spectroscopy of
Cu/CH3 andCu/COOCH3 |
PDF (131 KB)
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Extracting more chemical information from X-ray photoelectron spectroscopy by using monochromatic X rays
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PDF (112 KB)
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Determination of the surface silanol concentration of amorphous silica surfaces using static secondary ion mass spectroscopy
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PDF (119 KB)
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High resolution electron energy loss spectroscopy study of vapor-deposited polyaniline thin films
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PDF (90 KB)
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Study of poly(ether sulfone)/metal interfaces by high energy x-ray photoelectron spectroscopy and x-ray absorption spectroscopy
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PDF (131 KB)
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Determination of electron temperatures in plasmas by multiple rare gas optical emission, and implications for advanced actinometry
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PDF (167 KB)
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Effects of the axial external magnetic field on the reduction of the dielectric window damage due to capacitive coupling in the inductively coupled plasma
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PDF (82 KB)
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CFX(X=1–3) radical densities during Si,SiO2 , andSi3N4 etching employing electron cyclotron resonanceCHF3 plasma |
PDF (127 KB)
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Study of shallow silicon trench etch process using planar inductively coupled plasmas
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PDF (1881 KB)
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Aspect ratio effects in submicron contact hole plasma etching investigated by quantitative x-ray photoelectron spectroscopy
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PDF (121 KB)
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Hole-size dependent highly selective
SiO2 etching with a hexthode-type wide-gap plasma etcher |
PDF (6410 KB)
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Physical damage and contamination by magnetized inductively coupled plasmas and effects of various cleaning and annealing methods
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PDF (386 KB)
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Aims & Scope
The Journal of Vacuum Science and Technology A is devoted to reports of original research, review articles, and Critical Review articles.
Meet Our Editors
Editor
G. Lucovsky
North Carolina State University
