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IEEE Transactions on Electronics Packaging Manufacturing

Issue 2 • Date April 2009

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Displaying Results 1 - 13 of 13
  • Table of contents

    Publication Year: 2009, Page(s): C1
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  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2009, Page(s): C2
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  • Nonconductive Films (NCFs) With Multifunctional Epoxies and Silica Fillers for Reliable NCFs Flip Chip on Organic Boards (FCOBs)

    Publication Year: 2009, Page(s):65 - 73
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (4135 KB) | HTML iconHTML

    Nonconductive films (NCFs) have become one of the promising interconnection adhesives for flip-chip assembly. Because NCFs have many advantages such as low cost, easy handling, and fine-pitch application. However, effects of the material properties of NCFs on the reliability of NCFs flip-chip assemblies have not been fully understood. In this paper, effects of multifunctional epoxy and the additio... View full abstract»

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  • Effects of Anisotropic Conductive Film Viscosity on ACF Fillet Formation and Chip-On-Board Packages

    Publication Year: 2009, Page(s):74 - 80
    Cited by:  Papers (13)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2318 KB) | HTML iconHTML

    In this paper, the effects of anisotropic conductive film (ACF) viscosity on ACF fillet formation and, ultimately, on the pressure cooker test (PCT) reliability of ACF flip chip assemblies were investigated. The ACF viscosity was controlled by varying the molecular weight of the epoxy materials. It was found that the ACF viscosity increased as the increase of molecular weight of the epoxy material... View full abstract»

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  • Parameter Modeling for Wafer Probe Test

    Publication Year: 2009, Page(s):81 - 88
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1703 KB) | HTML iconHTML

    This paper presents the simulation of parameters for wafer probe test by finite-element modeling with consideration of probe over-travel (OT) distance, scrub, contact friction coefficient, probe tip shapes, and diameter. The goal is to minimize the stresses in the device under the bond pad and eliminate wafer failure in probe test. In the probe test modeling, a nonlinear finite-element contact mod... View full abstract»

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  • Modeling of Soldering Quality by Using Artificial Neural Networks

    Publication Year: 2009, Page(s):89 - 96
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (497 KB) | HTML iconHTML

    Multilayer perceptrons (MLPs ) are well-known artificial neural networks (ANNs) that are used in many different applications. In this paper, MLP neural networks were used to predict product quality in a wave soldering research case. The aims were to construct process models and to determine whether the formation of soldering defects could be predicted reliably by using the method. In addition, the... View full abstract»

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  • Statistical Analysis of Transponder Packaging in UHF RFID Systems

    Publication Year: 2009, Page(s):97 - 105
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1355 KB) | HTML iconHTML

    Packaging of RFID transponders that operate at ultrahigh frequencies (UHF) requires nontraditional materials and innovative methods in order to make a functional, reliable, and inexpensive RFID transponders. Presented is a statistical analysis along with the model as the way to evaluate measured results and provide the quality and process control for the electrical and mechanical performance of th... View full abstract»

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  • Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill

    Publication Year: 2009, Page(s):106 - 114
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1761 KB) | HTML iconHTML

    The advanced flip-chip-in-package (FCIP) process technology, using no-flow underfill material for high I/O density (over 3000 I/O) and fine-pitch (down to 150 mum) interconnect applications, presents challenges for flip chip processing because underfill void formation during reflow drives interconnect yield down and degrades reliability. In spite of such challenges, a high yield, reliable assembly... View full abstract»

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  • An Empirical Comparison of Spatial Randomness Models for Yield Analysis

    Publication Year: 2009, Page(s):115 - 120
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1039 KB) | HTML iconHTML

    Yield analysis is an important activity in the assessment and control of semiconductor fabrication processes. Tests of spatial randomness provide a means of enhancing yield analysis by considering the patterns of good and defective chips on the wafer. These patterns can be related to the likely sources of defects during production. This paper compares two approaches for determining spatial randomn... View full abstract»

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  • Table of contents

    Publication Year: 2009, Page(s):121 - 122
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  • Table of contents

    Publication Year: 2009, Page(s):123 - 124
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  • IEEE Components, Packaging, and Manufacturing Technology Society information for authors

    Publication Year: 2009, Page(s): C3
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2009, Page(s): C4
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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

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Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University