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# IEEE Transactions on Components and Packaging Technologies

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Displaying Results 1 - 25 of 35
• ### [Front cover]

Publication Year: 2009, Page(s): C1
| PDF (226 KB)
• ### IEEE Transactions on Components and Packaging Technologies publication information

Publication Year: 2009, Page(s): C2
| PDF (38 KB)

Publication Year: 2009, Page(s):1 - 2
| PDF (50 KB)
• ### Internal Geometry Variation of LTCC Inductors to Improve Light-Load Efficiency of DC-DC Converters

Publication Year: 2009, Page(s):3 - 11
Cited by:  Papers (15)
| | PDF (1243 KB) | HTML

A low-profile power inductor fabricated using low-temperature cofired ceramic (LTCC) technology has been demonstrated to improve the light-load efficiency of a converter, without the use of additional control circuitry. This is brought about by the material and the geometry, which causes a change in inductance with load current. Variation in inductor geometry is performed experimentally to study t... View full abstract»

• ### Thermomechanical Analysis of Plastic Ball Grid Arrays With Vapor Pressure Effects

Publication Year: 2009, Page(s):12 - 19
Cited by:  Papers (3)
| | PDF (591 KB) | HTML

This study adopts a mechanism-based computational approach to gain insights into the delamination and cracking of plastic ball grid array (PBGA) packages under moisture sensitivity test (MST) conditions. The possible crack paths in the molding compound are first examined by modeling the fully porous over-mold with void-containing cell elements. These computational cells are governed by a Gurson co... View full abstract»

• ### Fabrication and Characterization of a Low-Cost, Wafer-Scale Radial Microchannel Cooling Plate

Publication Year: 2009, Page(s):20 - 29
Cited by:  Papers (3)
| | PDF (2278 KB) | HTML

The modeling, simulation, fabrication, and testing of a microchannel cooling plate for microelectronic packaging applications are described in this paper. The cooling component uses forced convection of gas injected inside 128 microchannels of 100-mu m width and 70-mu m height. The nickel-based plate is fabricated on a glass substrate using a two-layer electroforming process using UV-LIGA technolo... View full abstract»

• ### Asynchronous Modular Contactor for Intelligent Motor Control Applications

Publication Year: 2009, Page(s):30 - 37
Cited by:  Papers (5)
| | PDF (1388 KB) | HTML

R&D activities have been carried out for decades by many researchers in order to improve electromechanical contactor performance employing electronic control. This includes electronic controlled contactor opening to minimize contact erosion, and closing to reduce contact bounce, but the improvement is limited with significant increase of cost and size due to the inherent design structure of co... View full abstract»

• ### Computational Assessment of the Effects of Temperature on Wafer-Level Component Boards in Drop Tests

Publication Year: 2009, Page(s):38 - 43
Cited by:  Papers (4)
| | PDF (1003 KB) | HTML

The drop reliability of wafer-level chip-scale package (WL-CSP) component boards used in portable devices was studied by employing mechanical shock loads (JESD22-B111 standard) at different temperatures. The drop tests were carried out at room temperature (23 degC), 75 degC, 100 degC, and 125 degC. The elevated temperatures were achieved by integrated he... View full abstract»

• ### Optimization of Cylindrical Pin-Fin Heat Sinks Using Genetic Algorithms

Publication Year: 2009, Page(s):44 - 52
Cited by:  Papers (9)
| | PDF (943 KB) | HTML

In this paper, genetic algorithms (GAs) are applied for the optimization of pin-fin heat sinks. GAs are usually considered as a computational method to obtain optimal solution in a very large solution space. Entropy generation rate due to heat transfer and pressure drop across pin-fins is minimized by using GAs. Analytical/empirical correlations for heat transfer coefficients and friction factors ... View full abstract»

• ### Thermal and Mechanical Characteristics of a Multifunctional Thermal Energy Storage Structure

Publication Year: 2009, Page(s):53 - 62
Cited by:  Papers (9)
| | PDF (706 KB) | HTML

Thermal energy storage (TES) sandwich-structures that combine the heat storage function with structural functionality are described. The structure consists of a thermal interface (TI) connected to a hollow plate lamination. Each laminate is a hollow aluminum plate having a series of mm-scale channels or compartments that are filled with phase change material (PCM). Heat storage is via the latent h... View full abstract»

• ### Simulation and Optimization of Gate Temperatures in GaN-on-SiC Monolithic Microwave Integrated Circuits

Publication Year: 2009, Page(s):63 - 72
Cited by:  Papers (13)
| | PDF (722 KB) | HTML

This paper presents 3-D thermal simulation studies of GaN-on-SiC monolithic microwave integrated circuits (MMICs) containing multifinger micrometer-scale high electron mobility transistors (HEMTs). The heat spreading effect of HEMT source, gate, and drain metallizations on peak structure temperatures is examined. The impacts of a realistic die attach material and rear-of-die heat transfer coeffici... View full abstract»

• ### Dependence of the Fracture of PowerTrench MOSFET Device on Its Topography in Cu Bonding Process

Publication Year: 2009, Page(s):73 - 78
Cited by:  Papers (2)  |  Patents (2)
| | PDF (945 KB) | HTML

Dependence of the fracture-resistance of a PowerTrench MOSFET device on its topography in Cu bonding process was investigated. Two different topographies, namely dimple and round, have been tested. A significantly higher cratering rate has been clearly observed on dimple topography. The dimple topography exhibited a cratering rate of 371 k ppm levels compared to 0 ppm in round topographies. Three-... View full abstract»

• ### Electromigration Test on Void Formation and Failure Mechanism of FCBGA Lead-Free Solder Joints

Publication Year: 2009, Page(s):79 - 88
Cited by:  Papers (2)
| | PDF (1860 KB) | HTML

The effect of electromigration (EM) on void formation and the failure mechanism of flip chip ball grid array (FCBGA) packages under a current density of 1 -10 A/cm2 and an environmental temperature of 150degC was investigated. Eight solder/substrate combinations of four lead-free solder systems with two substrates were examined to verify the failure modes. A conservative failure criteri... View full abstract»

• ### Thermal Management of Blocks in a Channel Using Phase Change Material

Publication Year: 2009, Page(s):89 - 99
Cited by:  Papers (2)
| | PDF (523 KB) | HTML

The application of the phase change material (PCM) in thermal management of an electronic device is presented in this paper. The considered geometry consists of a horizontal channel with three volumetrically heated blocks mounted on the bottom wall of the channel in a forced convection domain. The heated blocks simulate electronic chips. A PCM layer is attached to the bottom wall of the channel un... View full abstract»

• ### Development of a Thermal Switch Using the Channel Geometry Effect for Electronic Packages

Publication Year: 2009, Page(s):100 - 105
Cited by:  Papers (1)
| | PDF (1147 KB) | HTML

This paper presents development of a thermal switch using the channel geometry effect for electronic packages operated via liquid conduction channel formation. The developed switch panel is composed of several conduction channels, breathing grooves, reservoirs, and actuators. On demand, a vacant conduction channel is filled with liquid supplied by an actuator and conducts heat from hot spots to co... View full abstract»

• ### The Fracture Resistance of Bonded Au Wires for Interconnection

Publication Year: 2009, Page(s):106 - 109
| | PDF (1857 KB) | HTML

This paper presents the effects of the local strength degradation due to recrystallization and grain growth and the large deformation induced in wire bonding process on the fracture resistance of the bonded Au wires for interconnection. The experimental and numerical results show that, for a wire to deform to the required shape without reduction in the fracture resistance, sufficient ductility is ... View full abstract»

• ### Efficient Fourier Series Solutions to Nonlinear Steady-State Heat Conduction Problems in Microwave Circuits

Publication Year: 2009, Page(s):110 - 119
| | PDF (656 KB) | HTML

This paper presents a method of obtaining rapidly convergent Fourier series solutions to heat conduction problems in media containing temperature-dependent and orthotropic thermal conductivities subject to applied surface flux. Such problems occur frequently in the analysis of thermal heating of integrated circuits, with the heat sources consisting primarily of transistors, resistors and other con... View full abstract»

• ### Study of Flip Chip Solder Joint Cracks Under Temperature Cycling Using a Laser Ultrasound Inspection System

Publication Year: 2009, Page(s):120 - 126
Cited by:  Papers (10)
| | PDF (925 KB) | HTML

The current techniques for nondestructive quality evaluation of bumped solder joint connections in electronics packages are either incapable of detecting solder joint cracks, or unsuitable for inline inspection due to cost and throughput reasons. As an alternative, a novel solder joint inspection system is being developed. The system projects short laser pulses onto specimen surface through optic ... View full abstract»

• ### An Experimental Study on Minimum Arc Current for Arcs Longer Than a Few Microseconds in Relay Contacts and Possible Reinterpretation of the Meaning Thereof

Publication Year: 2009, Page(s):127 - 134
Cited by:  Papers (4)
| | PDF (420 KB) | HTML

A minimum arc current value for each contact material is one of the very important factors in consideration and comparison of arc discharge characteristics for proper selection of contact materials. In this paper, Ag and Ag alloy contacts were operated to break various dc load currents in the range of up to 1.5 A with 10-30 V, and occurrence rates of break arcs (having durations equal to or longer... View full abstract»

Publication Year: 2009, Page(s):135 - 144
Cited by:  Papers (7)
| | PDF (5142 KB) | HTML

In this paper, a methodology for prognostication-of-electronics has been developed for assessment of residual life in deployed electronic components, and the determination of damage-state in absence of macro-indicators of failure. Proxies for leading indicators-of-failure have been identified and correlated with damage progression under thermomechanical loads. Examples of proxies include micro-str... View full abstract»

• ### Detailed CFD Modelling of EMC Screens for Radio Base Stations: A Parametric Study

Publication Year: 2009, Page(s):145 - 155
Cited by:  Papers (3)
| | PDF (1382 KB) | HTML

The objective of this paper is to make a parametric study of the hydraulic resistance and flow pattern of the flow after an electromagnetic compatibility screen and between two printed circuit boards (PCBs) in a model of a 90deg subrack cooling architecture. The parametric study is carried out using a detailed 3-D model of a PCB slot. The detailed model was experimentally validated in a previous p... View full abstract»

• ### Pool Boiling Experiments on a Nano-Structured Surface

Publication Year: 2009, Page(s):156 - 165
Cited by:  Papers (29)
| | PDF (1288 KB) | HTML

The effect of nano-structured surfaces on pool boiling was investigated. Saturated and subcooled pool boiling experiments were performed on a horizontal heater surface coated with vertically aligned multiwalled carbon nanotubes (MWCNTs). MWCNTs were synthesized using the chemical vapor deposition (CVD) process. In this paper, MWCNT forests of two distinctly different heights (Type A: 9-mum height,... View full abstract»

• ### Experimental-Numerical Comparison for a High-Density Data Center: Hot Spot Heat Fluxes in Excess of 500 W/ft $^{2}$

Publication Year: 2009, Page(s):166 - 172
Cited by:  Papers (14)
| | PDF (1015 KB) | HTML

This paper uses previously published experimental data to present a comparison between test results and numerical simulations. The example considered is a large 7400 ft2 data canter that houses over 130 heat-producing racks (1.2 MW) and 12 air conditioning units. Localized hot spot heat fluxes were measured to be as high as 512 W/ft2 (5.5 kW/m2 ) for a 400 ft... View full abstract»

• ### The Role of Aging on Dynamic Failure Envelopes of OSP-Sn37Pb Interconnects in Plastic Ball Grid Array (PBGA) Packages

Publication Year: 2009, Page(s):173 - 179
Cited by:  Papers (1)
| | PDF (735 KB) | HTML

This paper quantifies the effect of aging on the durability of printed wiring assemblies (PWAs) subjected to dynamic loading conditions. The test specimen is a FR4 board with a single 256 I/O, full grid, PBGA component at the center. The pad finish on the board and component side of the Sn37Pb eutectic solder interconnects is organic solderability preservative (OSP) and Sn15Pb, respectively. The t... View full abstract»

• ### Effect of Vapour Force at the Blow-Open Process in Double-Break Contacts

Publication Year: 2009, Page(s):180 - 190
Cited by:  Papers (3)
| | PDF (1031 KB) | HTML

This paper presents results of a theoretical and experimental investigation of the phenomena of electrical contact repulsion and its associated blow-off characteristics at high current. The voltage and current waveforms as well as contact's displacement oscillograms are recorded for analysis. The mathematical model of the phenomena based on differential equations for the arc, forces, contact heati... View full abstract»

## Aims & Scope

IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging.

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope

## Meet Our Editors

Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.