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Electronics Packaging Manufacturing, IEEE Transactions on

Issue 3 • Date July 2008

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Displaying Results 1 - 18 of 18
  • Table of contents

    Publication Year: 2008 , Page(s): C1
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  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2008 , Page(s): C2
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  • Gold Embrittlement of Solder Joints in Wafer-Level Chip-Scale Package on Printed Circuit Board With Ni/Au Surface Finish

    Publication Year: 2008 , Page(s): 185 - 191
    Cited by:  Papers (3)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (1326 KB) |  | HTML iconHTML  

    In this paper, the effect of gold amount on the gold embrittlement of solder balls in wafer-level chip-scale package (WLCSP) CSP 80 is investigated. First, precisely controlled amounts of gold were added artificially to solder balls through a reflow process. It is found that for CSP 80 without Au, after 2000 h of thermal aging at 150 degC, the solder balls still fail in the bulk solder. When Au is... View full abstract»

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  • Combined Parameter and Tolerance Design for Quality via Computer Experiment: A Design for Thermoelectric Microactuator

    Publication Year: 2008 , Page(s): 192 - 201
    Cited by:  Papers (2)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (303 KB) |  | HTML iconHTML  

    A thermoelectric microactuator is examined with a computer experimental approach based on the asymmetrical thermal expansion of the microstructure with two beams of different widths. Because a typical U-shaped lateral thermoelectric actuator is used, the remaining concerns are the associated parameters and tolerance values that need to be determined. Conventional approaches consider that parameter... View full abstract»

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  • Drop-on-Demand Solder Droplet Jetting System for Fabricating Microstructure

    Publication Year: 2008 , Page(s): 202 - 210
    Cited by:  Papers (16)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (1481 KB) |  | HTML iconHTML  

    The novel drop-on-demand (DOD) solder droplet jetting system, which can be characterized as the non-heat affection of the piezoelectric actuator, the control mechanism of the piston head-to-nozzle distance, and disposable nozzle parts, is devised. This system consists of the piezoelectric actuator, insulator, piston head-to-nozzle distance control apparatus, pressure control unit, and furnace. For... View full abstract»

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  • Design and Evaluation of Bioepoxy-Flax Composites for Printed Circuit Boards

    Publication Year: 2008 , Page(s): 211 - 220
    Cited by:  Papers (4)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (1090 KB) |  | HTML iconHTML  

    Printed circuit boards (PCBs) pose considerable occupational health risks during manufacturing and are a potential source of toxic hazards if improperly disposed at the end of their useful life. Indeed, base materials in current PCBs include epoxy resins, fiberglass, and brominated flame retardants. To improve the environmental performance of PCB manufacturing and disposal, we developed composite ... View full abstract»

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  • Study of Temperature Parameter in Au–Ag Wire Bonding

    Publication Year: 2008 , Page(s): 221 - 226
    Cited by:  Papers (5)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (964 KB) |  | HTML iconHTML  

    The effect of the temperature on bondability and bonding process for wire bonding are investigated. Bondability is characterized by shear bonding strength and bonding process is represented by input and output power of ultrasonic transducer. A laser Doppler vibrometer and Labview software were used to record the velocity, voltage and current of transducer at different temperature settings. A K-typ... View full abstract»

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  • Solder Joint Characteristics and Reliability of Lead-Free Area Array Packages Assembled at Various Tin–Lead Soldering Process Conditions

    Publication Year: 2008 , Page(s): 227 - 239
    Cited by:  Papers (2)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (5623 KB) |  | HTML iconHTML  

    This paper presents a comprehensive study on the effects of critical process conditions on solder joint metallurgy and reliability of mixed-alloy solder joints. The solder joint metallurgy of mixed alloys was characterized and the lead distribution through the solder joint was analyzed, for different package types and under various process conditions. The results showed that the solder paste amoun... View full abstract»

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  • Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies

    Publication Year: 2008 , Page(s): 240 - 247
    Cited by:  Papers (4)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (3163 KB) |  | HTML iconHTML  

    The purpose of this paper was to investigate the effect of thermal cycling on the high-frequency behavior of ball grid array (BGA) interconnection structures. In order to characterize the applicability of RF measurements in predicting interconnection breakdown, a broadband BGA transition structure between a radio frequency printed wiring board (RF-PWB) and a ceramic module was fabricated. In addit... View full abstract»

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  • Dynamic Characteristics of a New Jetting Dispenser Driven by Piezostack Actuator

    Publication Year: 2008 , Page(s): 248 - 259
    Cited by:  Papers (8)
    Request Permissions | Click to expandAbstract | PDF file iconPDF (1626 KB) |  | HTML iconHTML  

    This paper proposes a new type of jetting dispenser driven by a piezostack actuator. After describing structural components of the dispensing mechanism and operating principle, a dynamic model of the dispenser is analytically formulated by considering dynamic behaviors of the piezostack-piston head and the ball-needle. The inelastic impact between the ball-needle and the ball-seat during dispensin... View full abstract»

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  • Processing of Silvar for MIC Packaging Applications

    Publication Year: 2008 , Page(s): 260 - 265
    Request Permissions | Click to expandAbstract | PDF file iconPDF (1887 KB) |  | HTML iconHTML  

    Materials with high thermal conductivity and thermal expansion coefficient matching with that of GaAs are being used for packaging high-density microwave integrated circuits (MICs) due to their ability of faster heat dissipation. Powder metallurgy (P/M) has emerged as a promising technique for the processing of metal matrix composites (MMCs) in satellite applications such as thermal management mat... View full abstract»

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  • Table of contents

    Publication Year: 2008 , Page(s): 266 - 267
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  • Table of contents

    Publication Year: 2008 , Page(s): 268 - 269
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  • Scitopia.org [advertisement]

    Publication Year: 2008 , Page(s): 270
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  • Leading the field since 1884 [advertisement]

    Publication Year: 2008 , Page(s): 271
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  • Quality without compromise [advertisement]

    Publication Year: 2008 , Page(s): 272
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information for authors

    Publication Year: 2008 , Page(s): C3
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2008 , Page(s): C4
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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University