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Browse Journals & Magazines > Components and Packaging Techn ... Volume 31 Issue 2 Help

Components and Packaging Technologies, IEEE Transactions on

Issue 2 • Date June 2008

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Aims & Scope

IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging.

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Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.

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