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Electronics Packaging Manufacturing, IEEE Transactions on

Issue 2 • Date April 2008

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Displaying Results 1 - 18 of 18
  • Table of contents

    Publication Year: 2008 , Page(s): C1
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  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2008 , Page(s): C2
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  • Laser Micromachining of Barium Titanate ({\hbox {BaTiO}}_{3}) -Epoxy Nanocomposite-Based Flexible/Rollable Capacitors: New Approach for Making Library of Capacitors

    Publication Year: 2008 , Page(s): 97 - 103
    Cited by:  Papers (6)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1626 KB) |  | HTML iconHTML  

    This paper discusses laser micromachining of barium titanate (BaTiO3)-polymer nanocomposite thin films. In particular, recent developments on high-capacitance, large-area, thin, flexible, embedded capacitors are highlighted. A variety of barium titanate (BaTiO3)-epoxy polymer nanocomposite-based flexible/rollable thin films ranging from 2 to 25 mum thick were processed on lar... View full abstract»

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  • Neural Network Control of Variable-Frequency Microwave Processing of Polymer Dielectric Curing

    Publication Year: 2008 , Page(s): 104 - 113
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (662 KB) |  | HTML iconHTML  

    Variable-frequency microwave (VFM) curing can perform the same processing steps as conventional thermal processing in minutes, without compromising intrinsic material properties. With increasing demand for novel dielectrics, there is a corresponding demand for new processing techniques that lead to comparable or better properties than conventional methods. VFM processing could be a viable alternat... View full abstract»

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  • Control of Photonic Package Alignment With Asynchronous Laser Spot Welds

    Publication Year: 2008 , Page(s): 114 - 119
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (845 KB) |  | HTML iconHTML  

    The precise alignment of an optical fiber to a laser diode for maximum optical coupling is often accomplished with synchronous laser spot welds in three symmetric locations. To improve precision and reduce operational complexity, the utility of single-beam spot welds made in an asynchronous manner has been investigated. Independent measurements of fiber tip post weld shift have been made using edd... View full abstract»

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  • Geometric and Compaction Dependence of Printed Polymer-Based RFID Tag Antenna Performance

    Publication Year: 2008 , Page(s): 120 - 125
    Cited by:  Papers (7)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (750 KB) |  | HTML iconHTML  

    Radio frequency identification (RFID) tags with printed antennas are lower in cost but have lower performance than those with metal antennas. Printed antennas can replace metal ones if the performance is increased without raising cost. The performance of printed antennas can be increased if the series resistance in the antennas is lowered. The resistance is dependent on the line thickness and the ... View full abstract»

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  • DMAIC Approach to Improve the Capability of SMT Solder Printing Process

    Publication Year: 2008 , Page(s): 126 - 133
    Cited by:  Papers (10)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (856 KB) |  | HTML iconHTML  

    One of the major manufacturing processes of surface-mount technology (SMT) is the solder paste printing process. In this process, the thickness of deposited solder paste on printed circuit board (PCB) pads is a key quality characteristic (QCH) of main concern. In practice, large deviations of solder thickness from a nominal value result in SMT defects that may cause PCB failure. This paper impleme... View full abstract»

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  • Modeling of Unsteady Laminar Flow Based on Steady Solution in Jetting Dispensing Process

    Publication Year: 2008 , Page(s): 134 - 142
    Cited by:  Papers (5)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1141 KB) |  | HTML iconHTML  

    This paper proposes a new approach to model unsteady laminar flows of dispenser systems in the semiconductor packaging industry. The approach is based on the exact steady solution. After an overview of dispensing technology and historical modeling of the unsteady flows, a new modeling approach of the unsteady laminar flow in a circular pipe and annular duct is developed. From the proposed model, t... View full abstract»

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  • Study on Contamination Control for Yield Enhancement in the Manufacturing Line of Cellular Phone Modules

    Publication Year: 2008 , Page(s): 143 - 149
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (668 KB) |  | HTML iconHTML  

    Practical studies on the method of contamination control for yield enhancement in the cellular phone modules production line were carried out. A contamination control method was proposed, consisting of data collection, data analysis, improvement action, verification, and implementation of control. The partition check method and the composition analysis for data collection and data analysis were re... View full abstract»

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  • Wide-Bandwidth Coaxial PWB Transmission Line Probe

    Publication Year: 2008 , Page(s): 150 - 158
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1081 KB) |  | HTML iconHTML  

    The design, fabrication, and test of a wide-bandwidth (3-dB attenuation bandwidth ges 30 GHz), 50 Omega, passive coaxial probe for the electrical characterization of printed wiring board (PWB) transmission lines is described. The probe can make thousands of repeated contacts, using spring-loaded interconnects, without affecting probe performance. The probe contains an internal mechanism for dissip... View full abstract»

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  • Modified Face-Down Bonding of Ridge-Waveguide Lasers Using Hard Solder

    Publication Year: 2008 , Page(s): 159 - 167
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (2541 KB) |  | HTML iconHTML  

    A modified face-down bonding technique of ridge-waveguide laser diodes (LDs) using 80Au20Sn solder has been performed. For ease of manufacturability, a bonding window with good bonding integrity and improved optical performance was determined. Metallographical investigation showed that the solder joint comprised of a layer of delta phase compound near the solder/heatsink interface, a layer of (Au,... View full abstract»

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  • An X-Ray Imaging-Based Layer Alignment and Tape Deformation Inspection System for Multilayer Ceramic Circuit Boards

    Publication Year: 2008 , Page(s): 168 - 173
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1027 KB) |  | HTML iconHTML  

    Advances in conductor patterning and via preparation techniques have facilitated a continuous increase in the circuit packaging density of ceramic multilayer substrates. A decrease in feature size combined with the trend toward constantly increasing the processed panel size is placing extremely high demands for layer-to-layer alignment as well as ceramic green tape stability. This paper describes ... View full abstract»

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  • Optimization of Thermomechanical Reliability of Board-Level Flip-Chip Packages Implemented With Organic or Silicon Substrates

    Publication Year: 2008 , Page(s): 174 - 179
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1018 KB) |  | HTML iconHTML  

    A design that optimizes package-level along with board-level thermomechanical reliability of a flip-chip package implemented with an organic or a silicon substrate is provided for the package subjected to an accelerated thermal cycling test condition. Different control factors including thickness of substrate, die, board, and polyimide or soldermask are considered. The optimal design is obtained u... View full abstract»

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  • Table of contents

    Publication Year: 2008 , Page(s): 180 - 181
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    Freely Available from IEEE
  • Table of contents

    Publication Year: 2008 , Page(s): 182 - 183
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  • Leading the field since 1884 [advertisement]

    Publication Year: 2008 , Page(s): 184
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information for authors

    Publication Year: 2008 , Page(s): C3
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2008 , Page(s): C4
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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University