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Electrical Insulation Magazine, IEEE

Issue 2 • Date March-April 2008

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Displaying Results 1 - 23 of 23
  • Front cover - IEEE Electrical Insulation Magazine

    Publication Year: 2008 , Page(s): c1
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    Freely Available from IEEE
  • Author's Guide

    Publication Year: 2008 , Page(s): c2
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    Freely Available from IEEE
  • IEEE Electrical Insulation Magazine - Table of contents

    Publication Year: 2008 , Page(s): 1
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    Freely Available from IEEE
  • IEEE Electrical Insulation Magazine - Executive Committee

    Publication Year: 2008 , Page(s): 2
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    Freely Available from IEEE
  • Editorial

    Publication Year: 2008 , Page(s): 3
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    Freely Available from IEEE
  • From the Editor's desk

    Publication Year: 2008 , Page(s): 4
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    Freely Available from IEEE
  • HVDC Cable Design and Space Charge Accumulation. Part 3: Effect of Temperature Gradient [Feature article]

    Publication Year: 2008 , Page(s): 5 - 14
    Cited by:  Papers (7)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (2398 KB) |  | HTML iconHTML  

    The aim of this article is to investigate the extent of space charge accumulation due to a temperature gradient in comparison with other charge-supply mechanisms, particularly injection from the electrodes. For this purpose, space-charge measurements were carried out on HVDC cable models under application of different temperature gradients across the cable insulation, above and close to the threshold field for space-charge accumulation. The main results, consisting of space-charge patterns and extracted quantities, are discussed here. View full abstract»

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  • Manufacturing and performance criteria for medium voltage power cable semiconducting shields [Feature article]

    Publication Year: 2008 , Page(s): 15 - 21
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (1135 KB) |  | HTML iconHTML  

    The subject of semiconducting shield (screen) layers for shielded power cable is interesting as a result of the many technical requirements that must be met simultaneously and that will be described in this article. This contribution is timely in that the IEEE Insulated Conductors Committee (ICC) has a Working Group developing a Guide on cable shields. One purpose of this article is to show that the carbon black is not necessarily the dominant issue in the formulation of shield compounds. Processing and compatibility with the overall cable system is as, or more, important to the shield properties and stability in service than the carbon black used. Through held experience, one commercial conductor shield compound used during the 1990s was unstable in the field as a result of high sensitivity to shear, which resulted in the shield layer going essentially nonconductive in service. Another purpose of this contribution is to show that shield layers are not "mix and match". The shield layer must be suitable for the process and dielectric with which it is used. Shields that are designed for use with XLPE dielectric are often not suitable for use with EPR dielectric, and vice versa. Likewise, the appropriate shield depends on the configuration of the extrusion line on which the cable is manufactured. View full abstract»

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  • Lifetime characteristics of nanocomposite enameled wire under surge voltage application [Feature article]

    Publication Year: 2008 , Page(s): 22 - 27
    Cited by:  Papers (6)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (2044 KB) |  | HTML iconHTML  

    The authors obtained and quantitatively evaluated V-N characteristics and the time variation of remaining thickness of nanocomposite enameled wires under repetitive surge-voltage application. V-N characteristics exhibited longer times to breakdown for nanocomposite enameled wires and the PD resistance increased with increasing nanofiller concentration. In the case of conventional enameled wires, the remaining enamel thickness decreased linearly with the time of voltage application, i.e., with increasing total number of PD generated, N, and the enamel thickness was eventually bridged, i.e., BD. In the case of nanocomposite enameled wires, the remaining thickness reached a plateau after a gradual deterioration in the first stage, which could contribute to the longer time to BD compared to that of conventional enameled wires. The resistance to deterioration in depth could have brought about the expansion of deterioration in the peripheral and longitudinal directions of nanocomposite enameled wires. View full abstract»

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  • Development of RTV Silicone Coatings in China: Overview and Bibliography [Feature article]

    Publication Year: 2008 , Page(s): 28 - 41
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (1322 KB) |  | HTML iconHTML  

    The development of room temperature vulcanized (RTV) silicone coatings in China began in early 1985. Over the course of time, they have come to be widely used in China. At present, nearly 800,000 kg of RTV coatings are used every year. They have successfully prevented serious pollution flashover of traditional glass and porcelain insulators and radically reduced the costs of maintaining transmission lines in polluted areas. RTV silicone coatings have been extensively studied in China. The main aspects of the research include improvements in the properties of the formula for better adhesion to porcelain and control of leakage current, the hydrophobicity transference mechanism, and aging. These decades of research have successfully promoted the development of RTV silicone coatings in China. The history of the development and research of RTV silicone coatings in China are discussed in this article. View full abstract»

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  • EIC Volunteer profile

    Publication Year: 2008 , Page(s): 42 - 43
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    Freely Available from IEEE
  • EIC NEWS [including EIC volunteer profile]

    Publication Year: 2008 , Page(s): 42
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    Freely Available from IEEE
  • EIC profile: Featuring member companies of the EIC

    Publication Year: 2008 , Page(s): 44 - 45
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  • DEIS News

    Publication Year: 2008 , Page(s): 46 - 48
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  • D&EI Folks [including obituaries and IEEE Fellows]

    Publication Year: 2008 , Page(s): 49 - 51
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  • News from Japan

    Publication Year: 2008 , Page(s): 52 - 53
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  • New products

    Publication Year: 2008 , Page(s): 54 - 55
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    Freely Available from IEEE
  • Industry News

    Publication Year: 2008 , Page(s): 55
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  • Book Reviews [8 book reviews]

    Publication Year: 2008 , Page(s): 56 - 59
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  • Meetings Calendar

    Publication Year: 2008 , Page(s): 60 - 61
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  • First Circular

    Publication Year: 2008 , Page(s): 62 - 63
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  • IEEE media advertising sales offices

    Publication Year: 2008 , Page(s): 64
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  • Call For Papers

    Publication Year: 2008 , Page(s): 65 - 66
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Aims & Scope

The EI Magazine is specifically concerned with publishing articles in the development and characterization of the dielectric, chemical, mechanical, and environmental properties of all vacuum, gaseous, liquid, and solid electrical insulation, and with utilization of these materials in circuits and systems under conditions of use.

Full Aims & Scope

Meet Our Editors

Co-Editor-in-Chief
Edward Cherney

Co-Editor-in-Chief
Robert Fleming