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Browse Journals & Magazines > Advanced Packaging, IEEE Trans ... Volume 31 Issue 1 Help

Advanced Packaging, IEEE Transactions on

Issue 1 • Date Feb. 2008

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Aims & Scope

IEEE Transactions on Advanced Packaging has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.

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Editor-in-Chief
Ganesh Subbarayan
Purdue University, School of Mechanical Engineering

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