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# IEEE Transactions on Components and Packaging Technologies

## Filter Results

Displaying Results 1 - 25 of 53
• ### [Front cover]

Publication Year: 2007, Page(s): C1
| PDF (230 KB)
• ### IEEE Transactions on Components and Packaging Technologies publication information

Publication Year: 2007, Page(s): C2
| PDF (40 KB)
• ### Table of contents

Publication Year: 2007, Page(s):553 - 554
| PDF (52 KB)
• ### Foreword

Publication Year: 2007, Page(s): 555
| PDF (213 KB) | HTML
• ### Compact Harmonic Filter Design and Fabrication Using IPD Technology

Publication Year: 2007, Page(s):556 - 562
Cited by:  Papers (22)
| | PDF (1360 KB) | HTML

An integrated passive device (IPD) technology has been developed to meet the ever increasing needs of size and cost reduction in radio front-end transceiver module applications. Electromagnetic (EM) simulation was used extensively in the design of the process technology and the optimization of inductor and harmonic filter designs and layouts. Parameters such as inductor shape, inner diameter, meta... View full abstract»

• ### High Density Double and Triple Layer Tantalum Pentoxide Decoupling Capacitors

Publication Year: 2007, Page(s):563 - 568
Cited by:  Papers (4)
| | PDF (670 KB) | HTML

High-performance integrated circuits (ICs) require extremely low impedance power distribution. The low voltage, high current requirements of these devices must be provided by decoupling capacitors very close to the IC. Currently this decoupling is provided by discrete surface mount capacitors with relatively high parasitic inductance, requiring many devices in parallel to provide low impedance at ... View full abstract»

• ### Processing and Dielectric Properties of Nanocomposite Thin Film “Supercapacitors” for High-Frequency Embedded Decoupling

Publication Year: 2007, Page(s):569 - 578
Cited by:  Papers (12)
| | PDF (1976 KB) | HTML

The embedded decoupling capacitor problem has been pursued by several groups and industry around the world over the past decade. Currently, popular ceramic-polymer composites can only provide limited capacitance, typically within 10 nF/cm2 . With the reliability and processing constraints imposed, the capacitance density would be much lower. Newer capacitor concepts such as supercapacit... View full abstract»

• ### Dual Process Dielectric Formation for Decoupling Capacitors on Flexible Substrates

Publication Year: 2007, Page(s):579 - 584
Cited by:  Papers (1)
| | PDF (1295 KB) | HTML

Large area, high density integrated capacitors within printed wiring boards can provide a substantial decoupling capacitance with very low parasitic inductance. Tantalum pentoxide (Ta2O5) is an excellent dielectric for this application due to the relatively high dielectric constant (~ 22-24), however the difficulty of fabricating large, defect-free capacitors has thus far pre... View full abstract»

• ### Integrating High-k Ceramic Thin Film Capacitors into Organic Substrates Via Low-Cost Solution Processing

Publication Year: 2007, Page(s):585 - 594
Cited by:  Papers (12)
| | PDF (2697 KB) | HTML

Current organic package-compatible embedded decoupling capacitors are based on thick film (8-16 m) polymer-ceramic composites with dielectric constant (k) of 20-30 and do not have sufficient capacitance density to meet the impedance requirements for emerging high-speed circuits and high power density microprocessors. High-k/high capacitance density ceramics films that can meet the performance targ... View full abstract»

• ### Foreword

Publication Year: 2007, Page(s):595 - 596
| PDF (332 KB) | HTML
• ### An Integrated Experimental and Computational System for the Thermal Characterization of Complex Three-Dimensional Submicron Electronic Devices

Publication Year: 2007, Page(s):597 - 603
Cited by:  Papers (2)
| | PDF (1703 KB) | HTML

This work presents the creation of a coupled analysis engine and experimental system capable of fully characterizing the thermal behavior of complex, 3D, active, submicron, electronic devices. First, the surface temperature field of an activated device is non-invasively measured with submicron spatial resolution. Next, the thermal conductivity of each thin-film layer composing the device is measur... View full abstract»

• ### Quantitative Thermoreflectance Imaging: Calibration Method and Validation on a Dedicated Integrated Circuit

Publication Year: 2007, Page(s):604 - 608
Cited by:  Papers (7)
| | PDF (1343 KB) | HTML

We have developed a charge-coupled device-based thermoreflectance microscope which can deliver thermal images of working integrated circuits. However, in any thermoreflectance experiment, the coefficient linking reflectance variations to temperature is different for each material. Calibrations are therefore necessary in order to obtain quantitative temperature imaging on the complex surface of an ... View full abstract»

• ### Photo-Thermoelectric Technique for Anisotropic Thermal Diffusivity Measurements

Publication Year: 2007, Page(s):609 - 617
Cited by:  Papers (3)
| | PDF (857 KB) | HTML

A photo-thermoelectric technique was employed to perform anisotropic thermal diffusivity measurements in nanocomposites and multilayer structures. In this technique a thermal wave is produced into the specimen by absorption of modulated laser radiation while the thermal wave is detected using a fast thermoelectric effect at the junction between a sharp wire probe and the sample surface. To allow e... View full abstract»

• ### Differential Temperature Sensors Fully Compatible With a 0.35-$mu$m CMOS Process

Publication Year: 2007, Page(s):618 - 626
Cited by:  Papers (13)  |  Patents (6)
| | PDF (1122 KB) | HTML

Four differential temperature sensors, two passive and two active, designed and fabricated in a 0.35-m standard CMOS technology, are presented and characterized. Passive sensors are based on integrated thermopiles. Each one consists of eight thermocouples (16 strips) serially connected: poly1-poly2 for the first thermopile and poly1-P+diffusion for the second one. The active sensors are based on d... View full abstract»

• ### A Method of Measuring the Transient Thermal Impedance of Monolithic Bipolar Switched Regulators

Publication Year: 2007, Page(s):627 - 631
Cited by:  Papers (10)
| | PDF (330 KB) | HTML

In the paper, a new electrical method of measuring the transient thermal impedance Z(t) of monolithic switched regulators with a bipolar junction transistor as a switch, is proposed. In the method, based on the cooling curve, the electrical power is dissipated in the considered device operating in the boost converter being their typical (catalogue) application circuit. As a thermally... View full abstract»

• ### Thermal Resistance Measurement of LED Package with Multichips

Publication Year: 2007, Page(s):632 - 636
Cited by:  Papers (57)
| | PDF (615 KB) | HTML

Thermal transient measurements of high power GaN-based light-emitting diodes (LEDs) with multichip designs are presented and discussed in the paper. Once transient cooling curve was obtained, the structure function theory was applied to determine the thermal resistance of packages. The total thermal resistance from junction to ambient considering optical power is 19.87 K/W, 10.78 K/W, 6.77 K/W for... View full abstract»

• ### Thermal Investigation of GaN-Based Laser Diode Package

Publication Year: 2007, Page(s):637 - 642
Cited by:  Papers (11)
| | PDF (823 KB) | HTML

We investigated thermal behavior of GaN-based laser diode (LD) packages as a function of cooling systems, die attaching materials, chip loading conditions, and optical performances. The electrical thermal transient technique was employed for the thermal measurement of junction temperature and thermal resistance of LD packages. The results demonstrate that the total thermal resistance of LD package... View full abstract»

• ### Structure Function Representation of Multidirectional Heat-Flows

Publication Year: 2007, Page(s):643 - 652
Cited by:  Papers (9)
| | PDF (877 KB) | HTML

The relation between the structure function of a one-port dynamic thermal network and the spatial distribution of thermal properties in a heat diffusion problem with applied boundary conditions is generalized from 1D heat flows to multidirectional heat flows. A strategy for exploiting this relation is derived which allows an accurate localization of defects and measurement of thermal properties in... View full abstract»

• ### Compact Models of Dynamic Thermal Networks with Many Heat Sources

Publication Year: 2007, Page(s):653 - 659
Cited by:  Papers (26)
| | PDF (895 KB) | HTML

A novel approach, based both on multipoint moment matching and principal component analysis, is proposed for generating passive compact models of dynamic thermal networks with many heat sources. As main result, the generated passive compact dynamic thermal networks both assure a prescribed accuracy and have a number of elements linearly related to the number of heat sources. View full abstract»

• ### Thermal Characterization of Electronic Packages Using the Nyquist Plot of the Thermal Impedance

Publication Year: 2007, Page(s):660 - 665
Cited by:  Papers (13)
| | PDF (623 KB) | HTML

It will be shown in this contribution that if the thermal impedance Zth(jw)of an electronic package is represented in a Nyquist plot, the curve obtained can be fitted very well to a combination of a few (n) circles, n varying between 2 and a maximum of 5. For each of these circles, it is sufficient to know the radius and the coordinates of the center point or just three parameters. With... View full abstract»

• ### The Corrosion of Electronic Resistors

Publication Year: 2007, Page(s):666 - 672
Cited by:  Papers (9)
| | PDF (2338 KB) | HTML

Precision thick chip resistors are used in a variety of different industries, from telecommunications to automotive electronics, and as such can be exposed to mild and aggressive corrosive environments. This paper investigates the corrosion performance of two generic precision thick chip resistors in a controlled corrosive atmosphere consisting of 60degC, 4 ppm H2S and water vapor in pu... View full abstract»

• ### Spatial and Temporal Resolution of Conjugate Conduction-Convection Thermal Resistance

Publication Year: 2007, Page(s):673 - 682
Cited by:  Papers (1)
| | PDF (963 KB) | HTML

A transient, 3-D solution to the heat conduction equation with a small square heat source on an adiabatic surface and Newtonian convection on the opposite side was obtained using Green's functions. The geometry conservatively models conduction spreading resistance encountered by small, concentrated heat sources such as light-emitting diodes and integrated circuits in general, mounted to larger sub... View full abstract»

• ### A Thermal Conductivity Model for Micro-Nanoscale Diamond Thin Films Using Dispersion Curve Data

Publication Year: 2007, Page(s):683 - 690
Cited by:  Papers (1)
| | PDF (811 KB) | HTML

Thermal conductivity is investigated for a cubic C (diamond). Boundary scattering, Umklapp processes, normal processes, and the presence of impurities are the mechanisms considered for heat flow resistance. Three symmetry directions [001], [110], [111], and three polarizations for each direction in the first Brillouin zone are considered for the material. The main purpose of this study is to analy... View full abstract»

• ### Smart Cooling Technology Utilizing Acoustic Streaming

Publication Year: 2007, Page(s):691 - 699
Cited by:  Papers (6)
| | PDF (1851 KB) | HTML

Acoustic streaming induced by longitudinal vibration at 30 kHz is visualized with particle imaging velocimetry (PIV). To gauge an increase in the velocity of air flow due to acoustic streaming, the velocity of air flow in a gap between the heat source and ultrasonic vibrator is measured using PIV. The ultrasonic wave propagating into air in the gap creates steady-state secondary vortex called acou... View full abstract»

• ### Acceleration Factors for Lead-Free Solder Materials

Publication Year: 2007, Page(s):700 - 707
Cited by:  Papers (29)
| | PDF (358 KB) | HTML

In this paper, the acceleration factors for lead-free solder materials are discussed. The focus is on the analytical models proposed by Norris-Landzberg, Pan, and Salmela. As most reliability prediction models are originally created for eutectic SnPb solder material, it is expected that the models must be recalibrated in order to be useful in conjunction with lead-free solder materials. Pan et ... View full abstract»

## Aims & Scope

IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging.

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope

## Meet Our Editors

Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.