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IEEE Transactions on Electronics Packaging Manufacturing

Issue 4 • Oct. 2007

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Displaying Results 1 - 19 of 19
  • Table of contents

    Publication Year: 2007, Page(s): C1
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  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2007, Page(s): C2
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  • Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices

    Publication Year: 2007, Page(s):241 - 245
    Cited by:  Papers (75)  |  Patents (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1259 KB) | HTML iconHTML

    Screen/stencil-printable nanosilver pastes were processed and characterized for die-attaching SiC devices. The nanosilver pastes were made by mixing silver particles in diameter with an organic binder vehicle. For the die-attachment, the nanosilver pastes were printed onto silver-coated or gold-coated direct-bond-copper (DBC) substrates. After die-attaching the SiC devices, the assemblies were hea... View full abstract»

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  • Optimizing Embedded Passive Content in Printed Circuit Boards

    Publication Year: 2007, Page(s):246 - 257
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1508 KB) | HTML iconHTML

    A genetic algorithm's optimization approach is used in conjunction with a size/cost model to study the optimum mix of passives (resistors and capacitors) to embed within a printed circuit board on an application-specific basis. Using the models and solution approach developed in this paper, the effect of board size on the optimum embedded passive solution (minimum cost solution) is studied, and an... View full abstract»

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  • Effects of Minor Elements in Cu Leadframe on Whisker Initiation From Electrodeposited Sn/Cu Coating

    Publication Year: 2007, Page(s):258 - 269
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2292 KB) | HTML iconHTML

    Drastically different tendencies of whisker initiation have been observed from the same Sn/Cu coating electrodeposited on two different Cu leadframe materials, CUFE and CUCR. After long-term storage at room temperature, no whisker initiation was observed on the coating on CUCR, whereas long whiskers with a maximum length of more than 200 mum were formed on the coating on CUFE. FE-STEM and FE-TEM m... View full abstract»

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  • Developing a Repeatable and Reliable Rework Process for Lead-Free Fine-Pitch BGAs

    Publication Year: 2007, Page(s):270 - 278
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1232 KB) | HTML iconHTML

    Area array components are increasingly used to miniaturize modern day circuitry. Assembling these surface-mount components using lead-free solder pastes has been the subject of interest for several years. Reworking a ball grid array (BGA) is complicated as the solder joints are hidden underneath the component. The process window to rework a BGA is narrow. There are several critical factors which c... View full abstract»

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  • Thermal Cycling Aging Effect on the Reliability and Morphological Evolution of SnAgCu Solder Joints

    Publication Year: 2007, Page(s):279 - 284
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3946 KB) | HTML iconHTML

    In solder ball grid array (BGA) technology, solder joint reliability is one of the critical issues in microelectronics manufacturing industries. In this reliability aging study, Sn3.5AgO.7Cu solder joints were subjected to accelerated temperature cycling (ATC) test in TBGA assembly. Fatigue fracture occurred, very close to the solder/intermetallic compound (IMC) interface, at the TBGA component si... View full abstract»

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  • Automated Solder Inspection Technique for BGA-Mounted Substrates by Means of Oblique Computed Tomography

    Publication Year: 2007, Page(s):285 - 292
    Cited by:  Papers (23)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2045 KB) | HTML iconHTML

    High-density large-scale integration (LSI) packages such as ball grid arrays (BGAs) are being utilized in car electronics and communication infrastructure products. These products require a high speed and reliable inspection technique for their solder joints. Oblique computed tomography (OCT) was proposed as a novel imaging technique for BGA-mounted substrates, and it is being introduced in many m... View full abstract»

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  • Effect of Ni on the Formation of ${hbox {Cu}}_{6}{hbox {Sn}}_{5}$ and ${hbox {Cu}}_{3}{hbox {Sn}}$ Intermetallics

    Publication Year: 2007, Page(s):293 - 298
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1182 KB) | HTML iconHTML

    In this paper, the effect of Ni on the formation of Cu6Sn5 and Cu3Sn intermetallics between tin and (Cu,Ni) substrates has been studied by making use of the thermodynamic assessment of the Sn-Cu-Ni system. The driving forces for the diffusion of the elements in the intermetallic layers were calculated as a function of Ni content. Assuming constant mobilities of com... View full abstract»

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  • A Data Mining Algorithm for Monitoring PCB Assembly Quality

    Publication Year: 2007, Page(s):299 - 305
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (440 KB) | HTML iconHTML

    A pattern clustering algorithm is proposed in this paper as a statistical quality control technique for diagnosing the solder paste variability when a huge number of binary inspection outputs are involved. To accommodate this goal, a latent variable model is first introduced and incorporated into classical logistic regression model so that the interdependencies between measured physical characteri... View full abstract»

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  • Effect of Conductive Particle Properties on the Reliability of Anisotropic Conductive Film for Chip-on-Glass Applications

    Publication Year: 2007, Page(s):306 - 312
    Cited by:  Papers (9)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1386 KB) | HTML iconHTML

    This paper describes how the material properties of conductive particles in anisotropic conductive films (ACFs) affect the electrical conductivity and the reliability of ACF interconnections for chip-on-glass (COG) applications. For the conductive particles, Au/Ni-coated polymer particles with a 5-diameter were used. Two different types of conductive particles were characterized with respect to th... View full abstract»

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  • 300-mm Low-${hbox {k}}$ Wafer Dicing Saw Development

    Publication Year: 2007, Page(s):313 - 319
    Cited by:  Papers (10)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1297 KB) | HTML iconHTML

    With the further shrinking of IC dimensions, low- material has been widely used to replace the traditional SiO interlayer dielectric (ILD) in order to reduce the interconnect delay. The introduction of low- material into silicon imposed challenges on dicing saw process. ILD and metal layers peeling and its penetration into the sealing ring of the die during dicing saw are the most common defects. ... View full abstract»

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  • List of reviewers

    Publication Year: 2007, Page(s): 320
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  • Table of contents

    Publication Year: 2007, Page(s):321 - 322
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  • Table of contents

    Publication Year: 2007, Page(s):323 - 324
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  • IEEE copyright form

    Publication Year: 2007, Page(s):325 - 326
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  • 2007 Index IEEE Transactions on Electronics Packaging Manufacturing Vol. 30

    Publication Year: 2007, Page(s):327 - 332
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information for authors

    Publication Year: 2007, Page(s): C3
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2007, Page(s): C4
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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

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Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University