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Advanced Packaging, IEEE Transactions on

Issue 3 • Date Aug. 2007

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Aims & Scope

IEEE Transactions on Advanced Packaging has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

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Meet Our Editors

Editor-in-Chief
Ganesh Subbarayan
Purdue University, School of Mechanical Engineering