By Topic

IEEE Transactions on Electronics Packaging Manufacturing

Issue 3 • Date July 2007

Filter Results

Displaying Results 1 - 15 of 15
  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2007, Page(s): C2
    Request permission for commercial reuse | PDF file iconPDF (36 KB)
    Freely Available from IEEE
  • Table of contents

    Publication Year: 2007, Page(s): C1
    Request permission for commercial reuse | PDF file iconPDF (36 KB)
    Freely Available from IEEE
  • Mechanical Characterization and Performance Optimization for GPU Fan-Sink Cooling Module Assembly

    Publication Year: 2007, Page(s):173 - 181
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1427 KB) | HTML iconHTML

    Three GPU fan-sink cooling module assembly mounting mechanisms are mechanically characterized to determine the relationships between the clamping forces and screw torques. The first-order screw torque solutions are determined from the statistical regressions according to current industry recommendations. The screw tension force theoretical solution is derived for application to the finite-element ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Power Device Packaging Technologies for Extreme Environments

    Publication Year: 2007, Page(s):182 - 193
    Cited by:  Papers (44)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (4465 KB) | HTML iconHTML

    Silicon carbide is a wide-bandgap semiconductor capable of operation at temperatures in excess of 300degC. However, high-temperature packaging to interface with the other elements of the electrical system is required. Die attach, wire bonding, and passivation materials and techniques have been demonstrated for use at 300degC. Transient liquid phase bonding has been developed with Au:Sn/Au, yieldin... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Low-Force Electric Contact Processes on Cu Electrodes

    Publication Year: 2007, Page(s):194 - 199
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (725 KB) | HTML iconHTML

    A contact process between large-scale integration (LSI) pads and test probes at low contact force is a key to developing a probe card with smaller pitch and higher pin count. In this paper, we report on the characteristics of low-force contact methods on Cu electrodes. One is the fritting process, in which an electric breakdown is utilized to break the surface oxide, and the other is the heating t... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Performance of Printed Polymer-Based RFID Antenna on Curvilinear Surface

    Publication Year: 2007, Page(s):200 - 205
    Cited by:  Papers (16)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (885 KB) | HTML iconHTML

    The performance of flexible printed RFID tags affixed onto cylindrical containers is dependent on the inductive behavior of the bent antenna on the tag. Conductive polymeric coil antennas were screen printed onto flexible substrates, and the coil resistances, the inductances, and the S-parameters of the antenna coils were measured and analyzed. The RFID dies were mounted onto the antenna coils and... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Assembly of Copper Column Interconnect Flip Chip

    Publication Year: 2007, Page(s):206 - 212
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1238 KB) | HTML iconHTML

    This paper addresses a new flip chip interconnection technology, flexible flip chip connection (F2C2) technology, for attaching silicon chips to a chip carrier using flexible copper wires. F2C2 is a novel approach to create area array flip chip interconnections using a matrix block of wires encapsulated with a heat-resistant, dissolvable substance. A slice from the wire matrix ingot is first attac... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Optimizing Disassembly and Recycling Process for EOL LCD-Type Products: A Heuristic Method

    Publication Year: 2007, Page(s):213 - 220
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (496 KB) | HTML iconHTML

    The recycling process for end-of-life (EOL) products generally consists of disassembly, the material recovery process following shredding, and the treatment of hazardous and nonhazardous wastes. A large volume of literature addresses the optimization of EOL product recycling with a focus on these three steps. This study proposes a two-stage heuristic method to simulate and identify an optimal disa... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)

    Publication Year: 2007, Page(s):221 - 227
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1734 KB) | HTML iconHTML

    Recently, wafer-level packaging (WLP) has become one of the promising packaging technologies due to its advantages, such as fewer processing steps, lower cost, and enhanced device performance compared to conventional single-chip packaging. Many developments on new WLP design, material, and process have been accomplished according to performance and reliability requirement of the devices to be pack... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Investigation Into the Release Behavior and Releasability Evaluation of the Encapsulation of Semiconductor Packages

    Publication Year: 2007, Page(s):228 - 235
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1520 KB) | HTML iconHTML

    One disincentive to the encapsulation of semiconductor devices using transfer molding is the resulting deterioration in releasability. This is because deterioration in releasability causes the chip to crack and external appearance defects to be transcribed from the mold stain. In this study, the authors have measured the in situ release force using an actual semiconductor package (LQFP2020), and h... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Join IEEE

    Publication Year: 2007, Page(s): 236
    Request permission for commercial reuse | PDF file iconPDF (322 KB)
    Freely Available from IEEE
  • Table of contents

    Publication Year: 2007, Page(s):237 - 238
    Request permission for commercial reuse | PDF file iconPDF (69 KB)
    Freely Available from IEEE
  • Table of contents

    Publication Year: 2007, Page(s):239 - 240
    Request permission for commercial reuse | PDF file iconPDF (46 KB)
    Freely Available from IEEE
  • IEEE Components, Packaging, and Manufacturing Technology Society Information for authors

    Publication Year: 2007, Page(s): C3
    Request permission for commercial reuse | PDF file iconPDF (32 KB)
    Freely Available from IEEE
  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2007, Page(s): C4
    Request permission for commercial reuse | PDF file iconPDF (30 KB)
    Freely Available from IEEE

Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University