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IEEE Electrical Insulation Magazine

Issue 5 • Sept.-Oct. 1988

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Displaying Results 1 - 4 of 4
  • Technological progress in high-voltage XLPE power cables in Japan. I

    Publication Year: 1988, Page(s):9 - 16
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (632 KB)

    The author reviews technological progress in the design and production of cross-linked polyethylene cable and discusses the present status of the products taking advantage of this technology. A brief historical background is given. The methods for determining or choosing cable characteristics, such as insulation thickness, service life, and cable quality, are discussed. Progress in production tech... View full abstract»

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  • EPR-based URD insulation: a question of confidence

    Publication Year: 1988, Page(s):17 - 20
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (462 KB)

    Concern about the possibility of failure of miles of medium voltage (15-35 kV) underground residential distribution (URD) power cable is discussed. This concern centers on the cable specification decisions that were made years ago an the consequences of cable failure and subsequent replacement. The factors that degrade URD are recalled. Choice of insulation material is discussed. The effects of th... View full abstract»

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  • Laminated motor pole assembly using welded studs and its effect on interlaminar resistance

    Publication Year: 1988, Page(s):21 - 25
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (661 KB)

    A method for laminated assembly manufacturing by welding the studs at each end of the assembly is investigated. Results of tests carried out to determine the tightness of the assembly are presented, and the fabrication process is described. A method is presented for calculating the final stud stretch, given the total force exerted, stud diameter, and stud material grade and length. From these calc... View full abstract»

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  • Coefficient of thermal expansion of encapsulants-is it always a constant?

    Publication Year: 1988, Page(s):26 - 28
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (333 KB)

    The mismatch between encapsulants and the printed-circuit board, the components, and even the potting shell or can due to thermal expansion and contraction, particularly if the encapsulant expansion rate is not constant, is treated. The coefficient of thermal expansion (CTE) and glass transition temperature are defined. Problems that arise because not all CTE values are reported the same way or th... View full abstract»

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Aims & Scope

The EI Magazine publishes articles written by authors from industry, research institutes and academia. The articles are more practical in content than the papers published in the Transactions.

Full Aims & Scope

Meet Our Editors

Co-Editor-in-Chief
Edward Cherney

Co-Editor-in-Chief
Robert Fleming