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Electrical Insulation, IEEE Transactions on

Issue 3 • Date Sept. 1975

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Displaying Results 1 - 10 of 10
  • Table of contents

    Publication Year: 1975 , Page(s): c1
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  • IEEE Electrical Insulation Group

    Publication Year: 1975 , Page(s): c2
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  • Editorial

    Publication Year: 1975 , Page(s): 85
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  • Silver Migration in Glass Dams between Silver-Palladium Interconnections

    Publication Year: 1975 , Page(s): 86 - 94
    Cited by:  Papers (11)
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    It is shown that two mechanisms are encountered in metal migration in glass-a platelike and treelike growth mechanism. The treelike growth, requiring a much higher interfacial energy contribution, is favored by high voltage application. The interaction of these two mechanisms accounts for the unexpected voltage and gap dependence of the niigration rate. The location of the metallic growth has been established as being in the volume of the glass. Significant differences exist in the electrical characteristics of the substrates of different manufacturers. After the application of glass dams these differences become less pronounced. View full abstract»

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  • Prediction of Multilayer Printed Wiring Board Temperatures During Lamination

    Publication Year: 1975 , Page(s): 94 - 98
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    Measurements of temperature histories of epoxy/glass prepreg layers during multilayer printed wiring board lamination have been recently obtained. It is shown that the temperature histories may be predicted by an analysis of the transient heat flow process within the multilayer board (MLB). The analysis requires a knowledge of the press platen temperature history during laminations and the thermal resistance of the padding material. Theoretically predicted results show close agreement with the experimental data for both 5-layer and 15-layer MLB's using the "hot press" as well as the "cold press" cycles. The present method may be used in the design of MLB lay-ups, in particular the determination of the necessary padding thickness to achieve heating rates which give adequate timing "windows" for cure pressure applications. The present theory has been applied to study the effect of kraft paper padding on the prepreg temperatures. Results are shown for both 15-and 5-layer laminations employing the hot press as well as cold press cycles. The number of kraft paper sheets used is shown to have a significant bearing on the temperatures. View full abstract»

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  • Thermal Characteristics of Multilayer Printed Wiring Boards During Lamination

    Publication Year: 1975 , Page(s): 98 - 101
    Cited by:  Papers (1)
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    This paper presents the results of a study to identify the thermal characteristics of the laminating process for multilayer printed wiring boards (MLB's). MLB's with 5 and 15 conducting layers were studied by embedding thermocouples into the epoxy/glass bonding sheets during the "hot-press" lamination process. An effort was made to isolate the important parameters governing thermal variation during hot-press lamination and to determine the thermal timing "window" for cure-pressure application necessary for uniform resin flow. The results show that whereas the temperature of the bonding sheets in a 5-layer MLB are practically identical, the temperature in 15-layer MLB's differs in excess of 37°F (20.50°C). The study also concludes that the lag between the time the lay-up is inserted and the press is closed governs temperature differences for a given MLB. Under laboratory conditions, the lag can be as small as 4 s;typically in production, however, the lag is 80 s for multiopening presses. It is these temperature variations that can cause voids, cured thickness variations, measle tendencies, and delamination, resulting in high proportions of defective MLB's. These temperature differences can be reduced either by increasing the padding thickness or by employing a "cold-press" lamination process. The effectiveness of these methods is also discussed. View full abstract»

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  • Comparative Testing and Evaluation of Conformal Coating Materials and Process

    Publication Year: 1975 , Page(s): 102 - 108
    Cited by:  Papers (1)
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    Conformal coating materials and processes were comparatively tested and evaluated for protection of electronic equipment. An extensive literature search was conducted for various generic types of conformal coating materials and processes. Testing and evaluation of candidate coating systems were accomplished using printed circuitry coupons, critical components, electronic assemblies, and flexible printed wiring circuitry to determine retention of electrical properties after temperature and humidity conditioning. View full abstract»

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  • Contributors

    Publication Year: 1975 , Page(s): 108
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  • Editorial policies and criteria

    Publication Year: 1975 , Page(s): 108-a
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  • Information for authors

    Publication Year: 1975 , Page(s): 108b
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Aims & Scope

This Transactions ceased production in 1993. The current retitled publication is  IEEE Transactions on Dielectrics and Electrical Insulation.

Full Aims & Scope