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IEEE Transactions on Electrical Insulation

Issue 3 • Date Sept. 1975

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  • Table of contents

    Publication Year: 1975, Page(s): c1
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  • IEEE Electrical Insulation Group

    Publication Year: 1975, Page(s): c2
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  • Editorial

    Publication Year: 1975, Page(s): 85
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  • Silver Migration in Glass Dams between Silver-Palladium Interconnections

    Publication Year: 1975, Page(s):86 - 94
    Cited by:  Papers (18)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (4658 KB)

    It is shown that two mechanisms are encountered in metal migration in glass-a platelike and treelike growth mechanism. The treelike growth, requiring a much higher interfacial energy contribution, is favored by high voltage application. The interaction of these two mechanisms accounts for the unexpected voltage and gap dependence of the niigration rate. The location of the metallic growth has been... View full abstract»

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  • Prediction of Multilayer Printed Wiring Board Temperatures During Lamination

    Publication Year: 1975, Page(s):94 - 98
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (817 KB)

    Measurements of temperature histories of epoxy/glass prepreg layers during multilayer printed wiring board lamination have been recently obtained. It is shown that the temperature histories may be predicted by an analysis of the transient heat flow process within the multilayer board (MLB). The analysis requires a knowledge of the press platen temperature history during laminations and the thermal... View full abstract»

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  • Thermal Characteristics of Multilayer Printed Wiring Boards During Lamination

    Publication Year: 1975, Page(s):98 - 101
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (817 KB)

    This paper presents the results of a study to identify the thermal characteristics of the laminating process for multilayer printed wiring boards (MLB's). MLB's with 5 and 15 conducting layers were studied by embedding thermocouples into the epoxy/glass bonding sheets during the "hot-press" lamination process. An effort was made to isolate the important parameters governing thermal variation durin... View full abstract»

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  • Comparative Testing and Evaluation of Conformal Coating Materials and Process

    Publication Year: 1975, Page(s):102 - 108
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (4449 KB)

    Conformal coating materials and processes were comparatively tested and evaluated for protection of electronic equipment. An extensive literature search was conducted for various generic types of conformal coating materials and processes. Testing and evaluation of candidate coating systems were accomplished using printed circuitry coupons, critical components, electronic assemblies, and flexible p... View full abstract»

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  • Contributors

    Publication Year: 1975, Page(s): 108
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  • Editorial policies and criteria

    Publication Year: 1975, Page(s): 108-a
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  • Information for authors

    Publication Year: 1975, Page(s): 108b
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Aims & Scope

This Transactions ceased production in 1993. The current retitled publication is  IEEE Transactions on Dielectrics and Electrical Insulation.

Full Aims & Scope