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Microelectromechanical Systems, Journal of

Issue 2 • Date Jun 1992

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Displaying Results 1 - 5 of 5
  • Polysilicon angular microvibromotors

    Publication Year: 1992 , Page(s): 70 - 76
    Cited by:  Papers (11)  |  Patents (7)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1128 KB)  

    Two types of LPCVD polysilicon angular microvibromotors were designed, fabricated, and successfully operated in air and in vacuum. Each utilizes an electrostatically driven lateral resonant structure (the converter) to actuate a circular microrotor by means of oblique mechanical impact. Oscillatory linear motion is consequently converted into continuous angular motion. The microrotors are fabricat... View full abstract»

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  • A microfabricated floating-element shear stress sensor using wafer-bonding technology

    Publication Year: 1992 , Page(s): 89 - 94
    Cited by:  Papers (19)  |  Patents (20)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (712 KB)  

    A microfabricated floating-element (120 μm×140 μm×5 μm) liquid shear stress sensor has been developed using wafer-bonding technology. The sensor has been designed for high shear stresses (1-100 kPa) and high-pressure environments (up to 6600 psi) and utilizes a piezoresistive transduction scheme. Analytical and finite-element method (FEM) modeling have been performed to predic... View full abstract»

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  • Microfabrication of submicron nozzles in silicon nitride

    Publication Year: 1992 , Page(s): 86 - 88
    Cited by:  Patents (27)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (592 KB)  

    A novel microfabrication process is described for obtaining nanometer apertures in highly cusped nozzle-like structures fabricated in silicon nitride, having apex angles of up to a few degrees. The process is based on a sacrificial etch technology using single-crystal silicon as the mold and silicon nitride as the material for the nozzle. The nitride coating on the apex of the pyramid shaped mold ... View full abstract»

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  • Front-to-backside alignment using resist-patterned etch control and one etching step

    Publication Year: 1992 , Page(s): 95 - 99
    Cited by:  Papers (7)  |  Patents (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (496 KB)  

    A processing technique that aligns features on the front side of a wafer to those on its backside has been developed for bulk micromachining. A 30 μm-square and 1.6 μm-thick diaphragm serves as an alignment pattern. At the same time that the alignment diaphragm is made, much thicker, large-area diaphragms can be partially etched using `mesh' masking patterns in these areas. The mesh-masking ... View full abstract»

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  • A bulk silicon dissolved wafer process for microelectromechanical devices

    Publication Year: 1992 , Page(s): 77 - 85
    Cited by:  Papers (41)  |  Patents (36)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1232 KB)  

    A single-sided bulk silicon dissolved wafer process that has been used to fabricate several different micromechanical structures is described. It involves the simultaneous processing of a glass wafer and a silicon wafer, which are eventually bonded together electrostatically. The silicon wafer is then dissolved to leave heavily boron doped devices attached to the glass substrate. Overhanging featu... View full abstract»

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Aims & Scope

The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.

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Meet Our Editors

Editor-in-Chief
Christofer Hierold
ETH Zürich, Micro and Nanosystems